TW515068B - Semiconductor package structure - Google Patents

Semiconductor package structure Download PDF

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Publication number
TW515068B
TW515068B TW089120492A TW89120492A TW515068B TW 515068 B TW515068 B TW 515068B TW 089120492 A TW089120492 A TW 089120492A TW 89120492 A TW89120492 A TW 89120492A TW 515068 B TW515068 B TW 515068B
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TW
Taiwan
Prior art keywords
die
conductor
terminal
scope
semi
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Application number
TW089120492A
Other languages
Chinese (zh)
Inventor
Huang Chen
Original Assignee
Dai Pei Ling
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Priority to TW089120492A priority Critical patent/TW515068B/en
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Publication of TW515068B publication Critical patent/TW515068B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A semiconductor package structure is disclosed, which is composed of a conductor part, an insulating housing member and a tube core. The conductor member is made by pressing and cutting a single piece of sheet-like conductor material, after applying solder paste and installing the tube core, the conductor member is folded and formed, the solder paste is melted and the tube core is soldered between the seat portion of two tube cores by reflow soldering method. The surface of the conductor member other than the injection port is sealed with adhesive tape or using similar method. After the resin is injected into the injection port and hardened for shape-forming, removing the adhesive tape, curing and baking, each semi-product continuously linked is made. The scribe line portion between two semi-products is then cut to complete the formation of conductor member and the shape-forming of insulating housing member. The product is thin and flat, the conductor part exposed out of the tube housing can be made into two or more terminals whose two surfaces or three surfaces cover both ends of the tube housing for bonding convenience.

Description

515068 五、發明說明（1) 本發明係一種半導體封裝結構，尤指一種適用於表面 焊裝電路基板應用之半導體封裝結構。 習知應用於表面焊裝電路基板之半導體構造及外型， 如第一圖，此為目前市場上最先進之設計。其未臻理想之 處有. 1) ·兩端子6 1 、6 2為突出向内彎或向外彎形式，不若 片型陶瓷電容器、電阻器等元件，無突出端子之全片狀型 式更符合應用。 2) .管芯60之散熱主要係沿管芯座及導體件61、62軸 向進行，故效率不高仍可改進。 3) .厚度仍可再降低。 4) .由於導體件由兩件組構而成，不易形成自〜動化生 產，且製造成本南。 5) .絕緣殼體63由熱固型樹脂模鑄製成，需精密複雜 之模具及週邊設備，設備昂貴、製造成本高，同時不易自 動化。 緣是，本發明人乃提出一可適用於表面焊裝電路基板 應用更理想之半導體結構。 本發明之目的為提供一種半導體之封裝結構，主要為 改善習知製品之諸多缺失，再採用系統整合、合理化之手 段，形成結構上之新設計，並使整體之結構能適用於多極 接點之各種實施，這即是本發明不同於習知之單一功用之 設計，更能配合本發明所述之製造程序，得以降低製造成 本，且可製成更理想之製品。515068 5. Description of the invention (1) The present invention is a semiconductor package structure, especially a semiconductor package structure suitable for surface-welded circuit substrate applications. Known for the semiconductor structure and appearance of surface-mounted circuit boards, as shown in the first figure, this is the most advanced design on the market. It has not been perfect. 1) · The two terminals 6 1 and 6 2 are protruding inwardly or outwardly curved. It is better to use chip-type ceramic capacitors, resistors, and other components without protruding terminals. Meet the application. 2) The heat dissipation of the die 60 is mainly carried out along the axial direction of the die seat and the conductors 61 and 62, so the efficiency can still be improved. 3). The thickness can still be reduced. 4). Because the conductor is composed of two pieces, it is not easy to form auto-production, and the manufacturing cost is low. 5). Insulating case 63 is made of thermosetting resin. It requires precise and complicated molds and peripheral equipment. The equipment is expensive, the manufacturing cost is high, and it is not easy to automate. The reason is that the inventors have proposed a more ideal semiconductor structure that can be applied to surface-mount circuit substrate applications. The purpose of the present invention is to provide a semiconductor package structure, mainly to improve many defects of conventional products, and then adopt system integration and rationalization methods to form a new structure design and make the overall structure suitable for multi-pole contacts. The various implementations of this invention are different from the conventional single-purpose design of the present invention, which can be more compatible with the manufacturing process described in the present invention, can reduce the manufacturing cost, and can be made into more ideal products.

515068 五、發明說明（2) 為了使貴審查委員能更進一步了解本發明之牲μ 技術内容’請參閱以下有關本發明之詳細說巴 而所附圖示僅供參考與說明用，並非用來以=圖，然 制者。 』不^明加以限 本發明先以第二圖之二極式製品，進行說明， 具有導體件1與絕殼殼體件（圖中樹脂4所示之部 s明 中，更含有管芯2與焊錫膏3、3 >以固定管芯2 σ· ϋ、;其 件1要經沖壓成型，製作出本發明之基本形狀，此一先導^ 之料帶，如第四、五圖所示，僅為其中一個導體件之结灵 構，其左端為具有定位孔之連結根部與相連接於導體g 部份，右端亦具有連接於導體件丨之部份，由於此二部 與導體件1之本身無關，但為製作程序上之必需，這、員、= 構能形成一種二極式之電子元件，第四圖之平面展開圖 由左至右分別形成左導接部1 4、左侧面部1 3、左管芯:部 12 (其底面為左端子底部）、沖除部1〇〇、右端子底部 1 5、右側面部1 6、右導接部1 7、延伸部1 8、右管芯座部 1 9，且於此製成之板片狀導體件1上、下兩侧各為一切割 道1 1 〇，切割道1 1 〇能被先沖除或與絕緣殼體件4成形後一 體切除，且中間之沖除部1 0 0亦已被沖除，且左導接部1 4 已被沖壓翹起、左管芯座部1 2已沖壓接合點、延伸部1 8亦 已被沖的更小’更於右管芯座部1 9沖有凹點，凹點為方便 與焊錫膏接合，其經後續之壓折後如第二圖A所示。其顯. 示兩端各為/端子，且端子間共用一管芯。 由於本發明尚能設置成多極式製品，如第七圖A為三515068 V. Description of the invention (2) In order to allow your reviewers to further understand the technical content of the present invention, 'Please refer to the following detailed description of the present invention and the attached drawings are for reference and explanation only, not for To = map, then the system. "This is not to be construed to limit the present invention. The present invention will be described with a two-pole product of the second figure. It has a conductor 1 and an insulating shell (the part s shown by the resin 4 in the figure) also contains the die 2. And solder paste 3, 3 > to fix the die 2 σ · ϋ ,; its piece 1 is to be stamped to form the basic shape of the present invention, this leading ^ strip, as shown in Figures 4 and 5 It is only the spiritual structure of one of the conductors. The left end is the connecting root with the positioning hole and the part connected to the conductor g, and the right end also has the part connected to the conductor. Since these two parts are connected to the conductor 1 It is irrelevant, but it is necessary for the production process. This structure can form a two-pole electronic component. The plan development of the fourth figure is from left to right. Face 1 3, Left die: Part 12 (the bottom of which is the bottom of the left terminal), Punch out 100, Right terminal bottom 1 5, Right side 16, Right lead 17, Extension 18, Right The die seat portion 19, and the upper and lower sides of the sheet-like conductor 1 made thereon are each a cutting track 1 1 0, and the cutting track 1 1 0 can be After being punched out or integrally cut off after forming with the insulating housing part 4, the middle punching part 1 0 0 has also been punched out, and the left lead part 1 4 has been stamped and warped, and the left die seat part 1 2 has The stamped joints and extensions 18 have also been punched smaller. They are punched more than the right die seat 19, and the recesses are convenient for bonding with the solder paste. After subsequent folding, as shown in the second figure It is shown in A. It shows that both ends are / terminals, and a die is shared between the terminals. Because the present invention can still be set as a multi-pole product, as shown in the seventh figure A is three

第5頁 515068 五、發明說明（3) 極、第七圖B為四極、第七圖C為五極之製品，而由第七 圖D之四極導體件平面圖，由左至右分別形成左導接部丄4 a 、1 4 b、左側面部1 3 a 、1 3 b 、左管芯座部1 2 a 、1 2 b、沖除部1 〇 〇、右端子底部1 5 a 、1 5 b、右侧面部1 6 a、16b、右導接部i7a 、17b 、延伸部18a 、18b、右 管芯座部1 9 a 、1 9 b ，且具有管芯2 a 、2 b 、2 c 、2 d ， 其經折疊後，如第七圖E所示，製法如後段所述，使四極 者與二極者相同，可以看到經過較覆雜之折疊過程，即能 製成^好之製品，其顯示為共用多個管芯之多個端子結 ，’右其中少設一極，便能剪除其中之一極之結構，若需 夕言極」便疋依此類推，使增加相對應之結構，並能由此 =導至夺夕極數之接點，其需求之極數，視實際製品而” 膏3 丰务明之製法步驟如下： 步驟一：於導體件1之二 管芯座部1 2、1 9處施著烊 二·於其中—焊錫f 3(3，）上置放管芯2。 …座；圖虛線（縱向）所示各折線處， 面部16、右導接邱17切副逗110、右端子底部15、右. 型（如第二圖'延伸部18 '右管芯座部19等各苟 步驟四：於彎折德 _ ^ ^ 焊錫，完成H /輪达通過n錢電氣爐，运 成h、2與管芯座部12、19之焊接（如第六僵 515068 五、發明說明（4) 示，運用焊錫膏3、定位管芯2)。 步驟五：於左側面部1 3、左管芯座部1 2、切割道 11 0、右端子底部1 5、右側面部1 6之外側貼上封止膠帶， 僅留灌注口 （以形方體狀之封包外圍體）。 步驟六：以定量之注膠機朝灌注口中注入樹脂4。 步驟七：以烘道烘烤使樹脂固化。 步驟八：去除封止膠帶。 步驟九：以烘道烘烤使樹脂熟化。 步驟十：由切割道1 1 0處鋸切，使相鄰之二半製品分Page 5 515068 V. Description of the invention (3) Pole, seventh figure B is a four-pole, seventh figure C is a five-pole product, and the plan view of the four-pole conductor of the seventh figure D forms a left guide from left to right. Contacts a 4 a, 1 4 b, left side face 1 3 a, 1 3 b, left die seat part 1 2 a, 1 2 b, flushing part 100, right terminal bottom 1 5 a, 1 5 b , Right side face 16a, 16b, right lead portions i7a, 17b, extensions 18a, 18b, right die seat portions 1a, 1b, and have die 2a, 2b, 2c, 2 d, after folding, as shown in Figure 7E, the manufacturing method is as described in the latter paragraph, making the four poles the same as the two poles. You can see that after a more complicated folding process, it can be made into a good product. , Which is shown as multiple terminal junctions that share multiple dies, 'there is one pole on the right, and the structure of one of the poles can be cut off. If the pole is needed, the analogy is made, so that the increase corresponds to Structure, and can thus lead to the junction of the number of poles in the evening, and the number of poles required depends on the actual product. 3 The manufacturing method of Fengwuming is as follows: Step 1: In the core seat of the conductor 1-2 1 2 19 places are placed in the middle-solder f 3 (3,) is placed on the die 2. ... seat; the broken line (vertical) shown in the figure, the face 16, the right lead Qiu 17 cut vice 110, right terminal bottom 15, right. Type (such as the second figure 'Extended part 18', Right die seat part 19, etc. Step 4: Yu Fangde _ ^ ^ Solder, complete H / round through n money electrical Furnace, it is welded to h, 2 and die seat parts 12, 19 (as shown in No. 6 515068 V. Invention description (4), using solder paste 3, positioning die 2). Step 5: On the left side face 1 3. The left die seat 1 2. The cutting path 11 0, the right terminal bottom 1 5. The right side face 16 is affixed with sealing tape on the outside, leaving only the perfusion opening (packed in the shape of a rectangular parallelepiped). 6: Inject resin into the filling port with a quantitative glue injection machine. Step 7: Bake in a drying tunnel to cure the resin. Step 8: Remove the sealing tape. Step 9: Bake in a drying tunnel to mature the resin. Step 10: Saw at the cutting line 1 10 to divide the adjacent two half products

離。 步驟Η--:進行連續式工法之端子熱浸著錫。 步驟十二：進行電參數、特性之檢測。 步驟十三：沖切剔除不合格件。 步驟十四··雷射刻印標示。 步驟十五：沖切使製品脫離料帶之連結根部。（如第 六圖至第二圖所成之狀態。而第二圖之成品與電路相接之 情形，如第三圖中所示。） 步驟十六：覆檢。from. Step Η--: The terminal is continuously dipped in tin by the continuous method. Step 12: Test the electrical parameters and characteristics. Step 13: Die cutting rejects unqualified parts. Step 14 · Laser marking. Step 15: Die-cut the product from the connecting root of the tape. (As shown in the sixth figure to the second figure. The finished product of the second figure is connected to the circuit, as shown in the third figure.) Step 16: Review.

步驟十七：選別。 步驟十八：送入載帶包裝，製成工業規格品。 綜上所述，本發明之結構，具有如下述之特點： 1) .導體件完全由單一片材製成，且與連結根部相連 接，形成一單列連結之多個製品。 2) .由於其導體件在未折壓成形時，二管芯座部呈分Step seventeen: Election. Step 18: Feed it into carrier tape packaging to make industrial specifications. In summary, the structure of the present invention has the following characteristics: 1). The conductor is made entirely of a single sheet and connected to the root of the connection to form a single row of multiple products. 2) Because the conductor parts are not folded and formed, the two core seat parts are divided into two parts.

第7頁 五、發明說明（5) 另J展開’管芯安裝面向上形彳 得以簡易的自動化方式施:式利：：錫；；著及管怒置放 相應於置放之管芯的極性方 π猶^吕心座選擇其一以 向排列，而不須藉助機械：。：=斤需之管芯極性方 管芯之兩…技術;：翻 置較簡易，效率亦較高。 毛月之技術手奴所需设備叙 之半件：η:至導體件折型完成及管芯焊接完成時 =;;戈：他類…，以封止其間之空隙，以取得-量灌、、主f ^十分有利於採用樹脂沿灌注口處連續定 比，所使ϋ絕緣殼？件，與習知之模鑄成型工法相 本大幅降低：上更為簡易、效率較高、易於自動化且成 形式4，)·故Si製程完成時，各製品單元仍呈連續之連結 自得方;=進行，使… 5) 制。 /、政羊间、成本低之效益。 6) '=品可提高散熱效率，並降低其外形厚度。 側、下三衣，之外形為厚度較薄之全片型，端子為上、 便與電路相^側下一面包覆型式，為最理想之外型，方 高效率^本發明可達到省料、省工且提高性能，並得以 件，故心#動生產之理想境界’故完全符合專利申請之要 $矣依專利法提出申請。 X上所述，僅為本發明最佳之一的具體實施例， 515068 五、發明說明（6) 惟本發明之構造特徵並不侷限於此，任何熟悉該項技藝者 在本發明之領域内，可輕易思及之變化或修飾（如其可適 用於單一管芯多個端子或多個管芯多個端子之半導體，如 第七圖）皆可涵蓋在以下本案之專利範圍。Page 7 V. Description of the invention (5) In addition, expand the 'die installation facing upwards' to facilitate a simple and automated way to implement: the type of :: tin; the placement of the tube corresponding to the polarity of the placed core Fang Pi Ju ^ Lu Xinzuo chose one to arrange in one direction, without the need to use machinery :. : = Polarity of the core required by the core. Two of the cores ... Technology ;: Easy to flip and high efficiency. Mao Yue's technical hand slave required half of the equipment: η: to the completion of the conductor part folding and the completion of the core welding = ;; Ge: other types, to seal the gap between them, to obtain-volume irrigation The main f ^ is very conducive to the use of resin to continuously determine the ratio along the injection port, so the insulation shell? Components, which is greatly reduced compared to the conventional die casting molding method: it is simpler, more efficient, easy to automate, and form 4,) so when the Si process is completed, each product unit is still connected and obtained; To make ... 5) system. /, The benefits of low-cost government. 6) '= product can improve heat dissipation efficiency and reduce its thickness. Side and bottom three clothes, the outer shape is a full-thin type with a thin thickness, and the terminals are on the top and the side are opposite to the circuit. In order to save labor and improve performance, and to get the pieces, Xinxin #ideal state of dynamic production 'is therefore fully in line with the patent application requirements. The application is filed according to the Patent Law. The above X is only one of the best specific embodiments of the present invention. 515068 V. Description of the invention (6) However, the structural features of the present invention are not limited to this. Anyone skilled in the art is in the field of the present invention. Variations or modifications that can be easily considered (for example, it can be applied to a single die with multiple terminals or multiple die with multiple terminals, such as the seventh figure) can be covered by the patent scope of the following case.

第9頁 515068 圖式簡單說明 第一圖係習知之表面焊著型半導體二極管之剖視圖。 第二圖係本發明二極製品之立體圖。 第二圖A係本發明第二圖未灌鑄樹脂之立體圖。（亦為第 四圖折合後立體圖） 第三圖係本發明與電路基板上線路接合時之剖面圖。 第四圖係本發明導體件之平面展開.圖。 第五圖係本發明導體件安裝管芯之剖視圖。 第六圖係本發明完成半製件之截面圖。 第七圖A係本發明三極製品之立體圖。Page 9 515068 Brief Description of Drawings The first drawing is a cross-sectional view of a conventional surface-mount semiconductor diode. The second figure is a perspective view of a bipolar product of the present invention. The second figure A is a perspective view of the second figure of the present invention without casting resin. (It is also a folded perspective view of the fourth figure.) The third figure is a cross-sectional view of the present invention when it is bonded to a circuit on a circuit board. The fourth figure is a plan development view of the conductive member of the present invention. The fifth figure is a cross-sectional view of a conductor mounting die of the present invention. The sixth figure is a cross-sectional view of a completed half-product according to the present invention. The seventh figure A is a perspective view of a three-pole product of the present invention.

第七圖B係本發明四極製品之立體圖。 第七圖C係本發明五極製品之立體圖。 第七圖D係本發明之四極式之平面展開圖。 第七圖E係本發明之四極式之折合後立體圖。 圖號與名稱說明： 1 導體件The seventh figure B is a perspective view of a quadrupole product of the present invention. The seventh figure C is a perspective view of the five-pole product of the present invention. The seventh diagram D is a plan development view of the quadrupole type of the present invention. The seventh figure E is a four-fold folded perspective view of the present invention. Drawing number and name description: 1 Conductor

2、2a、2b、2c、2d 管芯 1 2、1 2 a、1 2 b 左管芯座部 1 3、1 3 a、1 3 b 左侧面部 14、 14a、14b 左導接部 15、 15a、15b 右端子底部 1 6、1 6 a、1 6 b 右側面部 1 7、1 7 a、1 7 b 右導接部 1 8、1 8 a、1 8 b 延伸部2, 2a, 2b, 2c, 2d die 1 2, 1 2 a, 1 2 b left die seat 1 3, 1 3 a, 1 3 b left face 14, 14a, 14b left lead 15, 15a, 15b Bottom of right terminal 1 6, 1 6 a, 1 6 b Right face 1 7, 1 7 a, 1 7 b Right lead 1 18, 1 8 a, 1 8 b Extension

第10頁 515068 圖式簡單說明 19 、 19a 110 4 100 19b 右管芯座部 切割道 焊錫膏 樹脂（絕緣殼體件） 沖除部 參Page 10 515068 Brief description of the drawings 19 、 19a 110 4 100 19b Right die seat section Cutting path Solder paste Resin (insulating housing parts) Purge section Reference

第11頁Page 11

Claims (1)

515068 六、申請專利範圍 1 · 一種半導體之封裝結構，具有一導體件與一絕緣殼體 件，導體件其基本形體為呈扁平片狀，其兩端設有至 少一個端子，兩端子間均以一沖除部分離，各該端子 有與其相對應之管芯座部、侧面部、導接部均由單片 狀之導體件沖壓折疊製成，讓兩端之相對應管芯座部 間經連續彎折形成上、下相對狀;，並分別藉焊錫膏定 位一管芯，且導體件仍與一連結根部相接，管芯件外 ' 至導接部與側面部間封包以樹脂構成之絕緣殼體件， 僅使一端至少有管芯座部底面、侧面部露出形成端 子，並使另一端侧面部、與侧面部相連之端子底部露 ® 出形成端子，即形成一半製件，各該半製件係呈以連 結根部相連之單列連結狀5最後再分離。 2 ·如申請專利範圍第1項所述之半導體之封裝結構，其 中導體件於管芯置放之前，呈展開形狀，使每一管芯 之二管芯座並列，經探測得知極性方向之管芯可選擇 二管芯座相對之一置放，以獲得所需之極性方向。 3 ·如申請專利範圍第1項所述之半導體之封裝結構，其 中半製件得以藉連結根部進行切割道切除、端子熱浸 著錫、電特性測試、標示印製、檢查、選別及包裝等 · 各項製程。 4 ·如申請專利範圍第1項所述之半導體之封裝結構，其 ~ 形成一管芯多個端子狀或多個管芯多個端子狀。515068 6. Scope of patent application1. A semiconductor package structure, which has a conductor and an insulating shell. The basic shape of the conductor is a flat sheet, with at least one terminal at both ends. A punching part is separated, and each of the terminals has a corresponding core seat part, a side part, and a lead connection part made of a single piece of conductive member by punching and folding, so that the corresponding core seat parts at both ends are warped. Continuously bend to form the upper and lower opposite shapes; and respectively position a die by solder paste, and the conductor is still connected to a connecting root, the outer part of the die is connected to the lead and the side and the resin is encapsulated. Insulating housing parts, only one end has at least the bottom surface of the die seat portion and the side portion exposed to form a terminal, and the other end side portion and the bottom of the terminal connected to the side portion are exposed to form a terminal, that is, half of the product is formed. The semi-finished products are connected in a single row by the joint roots 5 and finally separated. 2 · The semiconductor packaging structure described in item 1 of the scope of the patent application, wherein the conductor is in an unfolded shape before the die is placed, so that two die seats of each die are juxtaposed, and the polarity direction is detected by detection. The die can be placed opposite one of the two die seats to obtain the desired polarity direction. 3 · The semiconductor package structure described in item 1 of the scope of the patent application, in which the semi-manufactured parts can be cut by cutting roots by connecting roots, hot dip soldering of terminals, electrical characteristics testing, label printing, inspection, selection and packaging, etc. · Various processes. 4 · The semiconductor packaging structure described in item 1 of the scope of patent application, which has a single die with multiple terminal shapes or multiple die with multiple terminal shapes. 第12頁Page 12
TW089120492A 2000-10-02 2000-10-02 Semiconductor package structure TW515068B (en)

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