1225812 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種導電端子植接焊料之方法，特別 是指一種應用於可利用表面黏著法與一電路板電性連接 5 之一電連接器之導電端子的焊料植接方法。 【先前技術】 由於如中央處理器（CPU)等積體電路晶片，其處理速 度及功能有日益強大的發展趨勢，因此晶片對外進行訊號 輸出入（I/O)之電性接點將愈來愈多，然而其封裝後的體積 10 料求輕薄短小，故如中央處理器等高度密集化設計的積 體電路晶片之封裝皆已採用PGA(pin Grid Array)、 BGA(Ball Grid Array)，甚至 LGA(Land Gdd Array)等封裝 方式，但無論積體電路晶片採用何種封裝方式，皆必須利 用一電連接器與一電路板電性連接，因此，為了使電連接 15 11配合積體電路晶片的封裝方式，以及考慮電連接器與電 路板間相互電性連接的穩固性及製程效率，故一般在電連 接器内各導電端子之一端連接一對應的錫球，再利用表面 黏著法（SMT)將電連接器焊固於電路板上的做法，乃為現 〉 今電連接器與電路板間產生電性連接經常使用的製法。 '〇 &圖1，是表示-以pGA方式封裝之中央處理器7 藉由一電連接器8與一電路板9電性連接，其中，中央處 理器7在封裝後於其底面一定的面積内形成複數等間隔= 離排列且向下凸出之插腳71，而電連接器8則包括有一絕 緣本體81及複數對應插腳71位置而貫穿絕緣本體8丨上 1225812 5 10 15 下兩面之容置孔82,各容置孔82均可收容一導電端子 83，另外在電路板9上則預先設計有對應導電端子83位 置之電性接點91，藉由收容於絕緣本體8ι内之導電端子 83的上端電性接觸中央處理器7之對應插腳η、下端則 ㈣地連接位於電路板9上的電性接點91，使得中央處理 盜7得以與電路板9電性連接以傳遞電子訊號。 如圖2，承前所述，為了使導電端子83的下端鱼電 路板9間可利用表面黏著法相連，導電端子83之下端必 須先連接-錫球84’其中-種做法是在絕緣本體81之下 表面⑴形成一對應與容置孔82相通且向内呈球弧形凹陷 狀的配合面813’而導電端+ 83下端則形成一與配合面 813貼合之承接部8_3卜使配合面813與承接部如構成 -與錫球84表面相接觸之凹部，藉由凹部以定位錫球84， 而錫球84亦可與導電端子83之承接部831接觸，之後進 行回焊的步驟，使得錫球84熔化而得以植接在對應的導 電端子83上，並可供後續電連接器與電路板之表面黏著 製程。 然而，上述為了使錫球84植接在導電端子83上必須 經過錫爐以進行回焊的作業，但回焊作業必須要具備定位 錫球之機具以及輸送電連接器通過錫爐之設備，若能減少 回焊之製程將有助於提高電連接器之生產效率。 【發明内容】 因此，本發明之目的，是在提供一種於導電端子植接 焊料且不需經過錫爐回焊之植接方法。 20 1225812 本發明導電端子植接焊料之方法是s製備-導電端 使導電端子形，成有-焊接端，再取—焊料，將焊料成 形出一中空部’接著，使導電端子之焊接端通過焊料之中 5 10 15 空部’藉—機具對谭料擠壓並使其包覆導電端子之焊接端 形成固接。 本發明之功效在於，利用擠壓焊料以包覆導電端子並 接合，達到烊料與導電端子固接而不需回焊炫化之過程。 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 楚的明白。 / 本發明導電端子植接焊料之方法的_較佳實施例步 驟如下： 參閲圖3，先以沖壓模具（圖未示）製備一導電端子 1，實際上，導電端子1是在-金屬料帶1GG上連續成形， 成心後之金屬料帶_在去除不必要的材料後可成為複數 導電端子1平行相鄰但仍保持連接之狀態，而各導電端子 1均形成有一接觸端u、一焊接端12及複數位於兩側之凸 刺13，本例中，接觸端u是一彈性臂形態，但亦可採用 八他不同形態，主要視所欲電性連接之如中央處理器等電 子元件所應用之封裝形式而定，因接觸端丨1之形態非關本 么明之内谷，在此即不擬進一步討論，而焊接端12則呈 扁平狀。 取焊料2 ’焊料2是自連續的錫線上截取適當長度， 20 1225812 ==工使焊料中央形成-中空部21，本财，焊料為一 冗:，但實際上亦可形成非封閉的環形，而只要具有 可供焊接端12通過之中空部21即可。 5 10 15 參考圖4及圖5，將焊料2藉其中空部2ι穿置在導 電^子1之谭接端12 w. 接如12上疋位，並以-機具（圖未示）由 2之周邊向内施磨’因焊料2材料本身之延展性，在 後嬋料2會產生變形而發生材料流動的現象，使 传蟬枓2將焊接端12加以包覆㈣成固接。此外，為使 谭料2易於流動，亦可先對痒料2加溫，但僅使其軟化即 可而不必到達焊料2熔化之溫度。 多…、圖6，待焊料2皆植接於對應之導電端子丨後， 即可將導電端子1組裝於一絕緣本體3所設之對應容置孔 31内，藉由導電端子i兩侧之凸刺13可卡固定位在界定 對應容置孔31之内壁面上，並使得各導電端子i之接觸 端11及植接有㈣2之焊接端12分別凸出於絕緣本體3 之相反兩面外以構成—電連接器。而圖中僅以—導電端子 1代表，且絕緣本體3之容置孔31亦僅繪出少數，實際容 置孔31及導電端子i數目需視所欲連接之電子元件之 接腳或接點之數目而定。 女此電連接器之製程中可完全不需回焊的步驟而能 達到焊料2植接於導電端子丨上之效果，不但可簡化製 私’同時亦能降低製造成本。 再者如圖7及圖8，為了提供焊料2在擠壓後能夠與 、^接、12產生更為穩固的連接效果，可於焊接端上進 20 1225812 5 10 15 以沖、、瓜接"卩，本例中，嵌接部是在焊接端12兩侧 ^方式各構成—曲折邊緣15,如此在焊料2包覆谭接 後藉由、J:干料2材料與曲折邊緣15密合，可形成兩 山之干乍用’防正烊料2自详接端12上脫離。當然， 甘人接^非一定為曲折邊緣15的型態，其他可產生干涉作 用之«皆可應用，於此即不再—舉例說明。 /f納上述，本發明之焊料植接方法，藉由事先於焊料 上幵/成供導電端子焊接端穿過之中空部，待導電端子焊 接端位於烊料之中空部内時，擠遷焊料而使其與焊接端固 接，使得焊料可不需轉過程，故確實能達到本發明之目 的0 淮以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明中請專利 範圍及說明書内容所作之簡單的等效變化與修飾，皆應仍 屬本發明專利涵蓋之範圍内。· 【圖式簡單說明】 圖1是-立體分解圖，說明一電子元件藉一電連接器 與一電路板電性連接之實施形態； 圖2是一部份剖視示意圖，說明習知一種導電端子與 一錫球之連接關係； 圖3是一立體示意圖，說明本發明植接焊料之方法的 一較佳實施例中製備導電端子的步驟及其與焊料之連接 關係； 圖4是一剖視示意圖，說明導電端子之焊接端與焊料 20 1225812 【圓式之主要元件代表符號說明】 1 導電端子 71 插腳 100 金屬料帶 8 電連接器 11 接觸端 81 絕緣本體 12 焊接端 812 下表面 13 凸刺 813 配合面 15 曲折邊緣 82 容ί孔 2 焊料 83 導電端子 21 中空部 831 承接部 3 絕緣本體 84 錫球 31 容置孔 9 電路板 7 中央處理器 91 電性接點 101225812 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for implanting solder to a conductive terminal, and particularly to an electrical connection which can be used to electrically connect to a circuit board 5 using a surface bonding method. Soldering method for the conductive terminals of the device. [Previous technology] Because integrated circuit chips such as central processing units (CPUs) have increasingly strong processing speeds and functions, the electrical contacts of the chip for external signal input / output (I / O) will be more and more There are many, but the packaged volume is expected to be thin, short and short. Therefore, the package of highly integrated design integrated circuit chips such as central processing units has adopted PGA (pin Grid Array), BGA (Ball Grid Array), and even LGA. (Land Gdd Array) and other packaging methods, but no matter which packaging method is used for integrated circuit chips, an electrical connector must be used to electrically connect to a circuit board. Therefore, in order to make the electrical connection 15 11 match the integrated circuit chip's The packaging method, and the stability and process efficiency of the electrical connection between the electrical connector and the circuit board are considered. Therefore, a corresponding solder ball is generally connected to one end of each conductive terminal in the electrical connector, and then the surface adhesion method (SMT) is used. The method of soldering an electrical connector to a circuit board is a current manufacturing method often used to create an electrical connection between an electrical connector and a circuit board. '〇 & FIG. 1 shows-the central processing unit 7 packaged in a pGA manner is electrically connected to a circuit board 9 through an electrical connector 8, wherein the central processing unit 7 has a certain area on its bottom surface after packaging. A plurality of equal intervals are formed inside the pins 71 which are arranged in a row and protrude downward, and the electrical connector 8 includes an insulating body 81 and a plurality of corresponding positions of the pins 71 penetrating through the insulating body 8 丨 1225812 5 10 15 The hole 82 and each of the accommodating holes 82 can receive a conductive terminal 83. In addition, an electrical contact 91 corresponding to the position of the conductive terminal 83 is pre-designed on the circuit board 9, and the conductive terminal 83 is housed in the insulating body 8m. The upper end of the electrical contact contacts the corresponding pin η of the central processing unit 7 and the lower end of the central processing unit 7 is connected to the electrical contact 91 on the circuit board 9, so that the central processing unit 7 can be electrically connected to the circuit board 9 to transmit electronic signals. As shown in FIG. 2, as mentioned above, in order to connect the lower end fish circuit boards 9 of the conductive terminals 83 with the surface bonding method, the lower ends of the conductive terminals 83 must be connected first-the solder ball 84 ′. One of the methods is in the insulating body 81. The lower surface ⑴ forms a mating surface 813 ′ corresponding to the inward spherical spherical depression, which communicates with the accommodation hole 82, and the lower end of the conductive end + 83 forms a receiving portion 8_3 to fit the mating surface 813. If it is in contact with the receiving part, the recess is in contact with the surface of the solder ball 84. The recess is used to locate the solder ball 84, and the solder ball 84 can also contact the receiving part 831 of the conductive terminal 83. Then, a step of reflow is performed to make The ball 84 is melted and can be implanted on the corresponding conductive terminal 83, and can be used for the subsequent adhesion process of the electrical connector and the surface of the circuit board. However, in order for the solder ball 84 to be planted on the conductive terminal 83, the soldering must be performed through a solder furnace, but the soldering operation must be equipped with a tool for positioning the solder ball and a device for transporting the electrical connector through the solder furnace. The ability to reduce the re-soldering process will help improve the productivity of electrical connectors. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for implanting solder to a conductive terminal without re-soldering through a tin furnace. 20 1225812 The method for implanting solder to the conductive terminal of the present invention is to prepare the conductive terminal to shape the conductive terminal into a soldered end, and then take the solder to shape the solder into a hollow portion. Then, pass the soldered end of the conductive terminal through The 5 10 15 hollow part of the solder—boring—the machine squeezes the material and forms a fixed connection with the soldered end of the conductive terminal. The effect of the present invention is that, by extruding solder to cover and join the conductive terminals, it is possible to achieve a process in which the material is fixedly connected to the conductive terminals without the need for re-soldering. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of a preferred embodiment with reference to the accompanying drawings. / The method of the preferred embodiment of the present invention for the conductive terminal planting solder is as follows: Referring to FIG. 3, a conductive die 1 is first prepared by a stamping die (not shown). In fact, the conductive terminal 1 is in-metal Continuously formed on the belt 1GG, the metal strip after the core_ After removing unnecessary materials, it can become a plurality of conductive terminals 1 adjacent to each other in parallel but still connected, and each conductive terminal 1 is formed with a contact end u, a Welding end 12 and a plurality of convex thorns 13 on both sides. In this example, the contact end u is an elastic arm shape, but it can also adopt different forms, mainly depending on the electronic components such as the central processing unit that are electrically connected The package form to be used depends on the shape of the contact terminal 丨 1, which is not the inner valley of the key, so it will not be discussed further here, and the solder terminal 12 is flat. Take the solder 2 'The solder 2 is cut from the continuous tin wire to an appropriate length, 20 1225812 == the center of the solder is formed-the hollow part 21, the property is, the solder is redundant: but in fact, it can also form a non-closed ring, As long as it has a hollow portion 21 through which the welding end 12 can pass. 5 10 15 Referring to FIG. 4 and FIG. 5, the solder 2 is inserted through the hollow portion 2 ι of the tan end 12 of the conductive element 1 w. Connect to the upper position of 12 and use -machine (not shown) from 2 The peripheral edge is ground inwardly. Due to the ductility of the solder 2 material itself, the back material 2 will deform and cause the material to flow, so that the cicada 2 will cover and weld the soldering end 12. In addition, in order to make the Tan material 2 flow easily, the itchy material 2 may be warmed first, but it is only necessary to soften it without reaching the temperature at which the solder 2 is melted. Many ..., Figure 6, after solder 2 is planted to the corresponding conductive terminal, the conductive terminal 1 can be assembled in the corresponding receiving hole 31 provided in an insulating body 3, and The convex thorn 13 can be fixed on the inner wall surface corresponding to the corresponding accommodation hole 31, and the contact end 11 of each conductive terminal i and the soldering end 12 implanted with ㈣ 2 can protrude from the opposite sides of the insulating body 3 respectively. Composition—electrical connector. In the figure, only-conductive terminal 1 is represented, and only a few of the accommodation holes 31 of the insulating body 3 are drawn. The actual number of the accommodation holes 31 and the conductive terminals i depends on the pins or contacts of the electronic components to be connected. It depends on the number. In the process of the female connector, the effect of soldering 2 to the conductive terminal 丨 can be achieved without the need for re-soldering steps, which can not only simplify the manufacturing process, but also reduce the manufacturing cost. Furthermore, as shown in FIG. 7 and FIG. 8, in order to provide a more stable connection effect between the solder 2 and the solder 12 after extrusion, the soldering end can be advanced by 20 1225812 5 10 15 for punching and quoting. ; 卩, in this example, the embedding part is constituted on both sides of the soldering end 12-zigzag edge 15, so that after the solder 2 is covered by the joint, J: dry material 2 and the zigzag edge 15 are in close contact. , Can form the two mountains of the first use of 'anti-positive material 2 from the detailed connection 12 detached. Of course, the Ganren connection is not necessarily the shape of the zigzag edge 15, other «that can produce interference effects can be applied, and will not be described here-for example. As mentioned above, in the solder implanting method of the present invention, the soldering end of the conductive terminal is passed through the hollow portion in advance on the solder. When the soldering end of the conductive terminal is located in the hollow portion of the material, the solder is displaced. It is fixedly connected to the soldering end, so that the solder does not need to be transferred, so it can indeed achieve the purpose of the present invention. The above-mentioned ones are only preferred embodiments of the present invention. When this cannot be used to limit the implementation of the present invention, The scope, that is, the simple equivalent changes and modifications made according to the scope of the patent and the description of the invention, should still fall within the scope of the patent of the invention. · [Brief description of the drawings] Figure 1 is a three-dimensional exploded view illustrating an embodiment in which an electronic component is electrically connected to a circuit board by an electrical connector; Figure 2 is a partial cross-sectional schematic diagram illustrating a known conductive type The connection relationship between the terminal and a solder ball; FIG. 3 is a schematic three-dimensional view illustrating the steps of preparing a conductive terminal and the connection relationship with the solder in a preferred embodiment of the method for implanting solder according to the present invention; FIG. 4 is a cross-sectional view Schematic diagram showing the soldering ends of the conductive terminals and solder 20 1225812 [Description of the symbols of the main components of the round type] 1 conductive terminals 71 pins 100 metal strips 8 electrical connectors 11 contact ends 81 insulation bodies 12 soldering ends 812 lower surface 13 burrs 813 mating surface 15 zigzag edge 82 receiving hole 2 solder 83 conductive terminal 21 hollow portion 831 receiving portion 3 insulating body 84 solder ball 31 receiving hole 9 circuit board 7 central processing unit 91 electrical contact 10