1220309 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於-種導電端子植接谭料之方法，特別 是指-種應用於可利用表面黏著法與—電路板電性連接 之一電連接器之導電端子的焊料植接方法。 【先前技術】 由於如中央處理器（CPU)等積體電路晶片，其處理速 度及功能有日益強大的發展趨勢，因此晶片對外進行訊號 10 輸出入⑽)之電性接點將愈來愈多，然而其封裝後的體積 卻要求輕薄短小，故如中央處理器等高度密集化設計的積 體電路晶片之封裝皆已採用PGA(Pin Gdd α_)、、 BGA(Ball Grid Array)，甚至 等封裝 15 20 方式’但無論積體電路晶片採用何種封裝方式，皆必須利 用一電連接器與-f路板電性連接，因此，為了使電連接 器配合積體電路晶片的封裝方式，以及考慮電連接器與電 路板間相互電性連接的穩固性及製程效率，故—般在電連 接器内各導電端子之—端連接—對應㈣球，再利用表面 黏著法（SMT)將電連接器焊固於電路板上的做法，乃為現 今電連接器與電路板間產生電性連接經常使用的製法。 “如圖1’是表示一以PGA方式封裝之中央處理器7 措^一電連接器8與-電路板9電性連接，其+，中央處 理為7在封裝後於其底面的面積内形成複數等間隔距 雄排列且向下凸出之插腳]，而電連接器8則包括有一絕 緣本體81及複數對應插腳71位置而貫穿絕緣本體μ上 4 1220309 5 下兩面之容置孔82’各容置孔82均可收容_導 83,另外在電路板9上則預先設計有對應導電端子 置之電性接點91，藉由收容於絕緣本體81内之導 83的上端電性接觸中央處理器7之對應插腳η 對應地連接位於電路板9上的電性接點91，使得 理 器7得以與電路板9電性連接以傳遞電子訊號。、免里 10 15 如圖2，承前所述，為了使導電端子以的下端盘電 路板9間可利絲面黏著法相連，導電端子83之下端 須先連接—錫球84，其中_種做法是在絕緣本體W之下 表面811形成一對應與容置㈣相通且向内呈球弧形凹陷 狀的配合面813 ’而導電端+ 83下端則形成一與配合面 813貼合之承接部83卜使配合面⑴與承接部831構成 —與錫球84表面相接觸之凹部，藉由凹部以定位锡球料， 而錫球84亦可與導電端子83之承接部831接觸，之後進 行轉的㈣，使得料84純而得雜接在對應的導 電立而子83上，並可供後續電連接器與電路板之表面黏 製程。 J而上述為了使錫球84植接在導電端子Μ上必須 20 經過錫爐料行_的作業，一料業必須要具備定位 錫球之機具以及輸送電連接器通過錫爐之設備，若能減少 回谭之製程將有助於提高電連接器之生產效率。 【發明内容】 因此，本發明之目的，是在提供一種於導電端子植接 焊料且不需經過錫爐回焊之植接方法。 5 1220309 本發明導電端子植接焊料之方法是先製備一導電端 f使導電端子形成有_焊接端，焊接端並具有一散接 ^再ϋ機具將一焊料由焊接端一面擠壓使其向相反另 面•動並通過&接部’接著再以機具由焊接端另一面相 =壓焊料，使焊料包覆焊接端，並同時使焊料與喪接部 “以產生干涉作用，使得焊料不致脫離焊接端而形成固 接。 本發明之功效在於，利用擠壓焊料以包覆導電端子， 並使變形後之焊料藉其與嵌接部密合所產生之干涉作 用達到與^電端子固接而不需回焊溶化之過程。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配。參考圖式之_較佳實施例的詳細說明十，將可清 楚的明白。 本發明導電端子植接焊料之方法的一較佳實施例步 驟如下： —參閱圖3 ’先以沖壓模具（圖未示）製備一導電端子 1 ’貫際上’導電端子1是在—金屬料帶1GG上連續成形， =後之金屬料帶_在去除不必要的材料後可成為複數 導電端子1平行相鄰但仍保持連接之狀態，而各導電端子 1均形成有-接觸端U、一焊接端12及複數位於兩側之凸 刺13，本例中，接觸端u是—彈性臂形態，但亦可採用 其他不同形態’主要視所欲電性連接之如中央處理器等電 子元件所應用之封裝形式而定，因接觸端U之形態非關本 6 =之内容’在此即不擬進—步討論，而焊接端12則呈 爲平狀，使得焊接端12具有相反之一第一面121與—第 γΓΓΓ而焊接端12上並在沖製過程令的同時、或以另 /衣長序產生-嵌接部’本#施狀純部為—略呈 匙孔狀而連通焊接端12之第一面121與第二面122，而開 槽14在料端12末緣處形成—寬度較小之開放側⑷， 與開放側141相反之另一端則形成寬度較大之封閉側142。 參考圖4至圖9，取—焊料2，本财，谭料2是自 連續的錫線上截取適當長度而得，但並非以錫線為限，使 焊料2接觸焊接端12之第—面ΐ2ι (圖4所示》再藉— 機具^圖未示），將谭料2相對於導電端子】由其焊接端 i之第面121向第二面122方向擠壓（圖5所示），因 焊料2材料本身之延展性，在受到擠麼後焊料2會產生變 开/而表生材料机動的現象，使得焊料2可通過開槽Μ而 凸出於第二面122 °此外，為使焊料2易於流動，亦可先 對焊料2加溫，但僅使其軟化即可而不必到達焊料2炼化 之溫度。 接著，再以機具由焊接端12之第二面122向第一面 121方向擠壓凸出於第二面122外的焊料2 (圖6所示）， 使焊料2因兩面受力而將焊接端12包覆，並同時使烊料2 與開槽14形狀密合（圖7、圖8及圖9所示），藉開槽14 開放侧141車父窄而封閉側142較寬之形狀，可造成焊料2 不能由開槽14之開放侧141脫離而與焊接端12產生干涉 作用，使得焊料2與焊接端12形成固接。 1220309 參照圖1 0，待焊料2皆植接於對應之導電端子i 後，即可將導電端子1組裝於一絕緣本體3所設之對應容 置孔31内，藉由導電端子丨兩側之凸刺13可卡固定位在 界定對應容置孔31之内壁面上，並使得各導電端子丨之 接觸端η及植接有焊料2之焊接端12分別凸出於絕緣本 體3之相反兩面外以構成一電連接器。而圖中僅以一導電 端子1代表，且絕緣本體3之容置孔31亦僅繪出少數， 貫際容置孔31及導電端子1數目需視所欲連接之電子元 件之I/O接腳或接點之數目而定。 如此，電連接1§之製程中可完全不需回焊的步驟而能 達到焊料2植接於導電端子^上之效果，不但可簡化製 程’同時亦能降低製造成本。 再者如圖1 1，由於焊接端12所設嵌接部之目的主 要在提供焊料2擠壓後能夠與焊接端12產生干涉而防止 相互脫離之效果，因此能夠達成此一目的之各種形狀的嵌 接部亦可，因此並非一定如圖3所示之鑰匙孔形狀，圖工 1中所示是另一種嵌接部的型態，其是在焊接端12之兩 側以沖製成曲折邊緣15,如此亦能夠在焊料2包覆焊接端 12後，藉由曲折邊緣15防止焊料2自焊接端12上脫離（如 圖1 2所示）。 歸納上述，本發明之焊料植接方法，藉由成形於導電 端子焊接端上之嵌接部，並將焊料擠壓包覆焊接端而與嵌 接部產生密合而發生干涉作用，使得焊料與導電端子在不 需回焊的過程下形成固接的效果，故確實能達到本發明之 8 1220309 目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及說明書内容所作之簡單的等效變化與修飾，皆應仍 5 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明一電子元件藉一電連接器 與一電路板電性連接之實施形態； 圖2是一部份剖視示意圖，說明習知一種導電端子與鲁 —錫球之連接關係； 圖3是一立體示意圖，說明本發明植接焊料之方法的 -較佳實施例中製備導電端子的步驟及其與焊料之連接 關係； 圖4是圖3中IV-IV剖面線剖視示意圖，說明導電端 15 子之焊接端與焊料接觸之位置關係； 圖5是圖4中的焊料受-方擠壓之材料流動示意圖； 圖6是圖5中的焊料進一步受相反一方擠壓之材料· 流動不意圖， 圖7是圖6中的焊料擠製完成後與導電端子焊接端 20 之連接關係； 圖8是圖3中M -VDI剖面線剖視示意圖，說明圖7之 焊料與導電端子焊接端之連接關係； 圖9是顯示圖8中焊料與導電端子焊接端另一角声 之連接端係； & 9 1220309 圖1 0是一立體示意圖，說明導電端子組裝於一絕緣 本體以構成一電連接器； 圖1 1是一立體圖，說明導電端子之另一種可行之焊 接端形態；及 5 圖1 2是一側面視圖，說明圖1 1中之導電端子應用 本發明之方法植接焊料後之連接關係。 10 1220309 【圖式之主要元件代表符號說明】 1 導電端子 100 金屬料帶 11 接觸端 12 焊接端 121 第一面 122 第二面 13 凸刺 14 開槽 141 開放側 142 封閉側 15 曲折邊緣 2 焊料 3 絕緣本體 31 7 容置？L 中央處理器 71 插腳 8 電連接器 81 絕緣本體 812 下表面 813 配合面 82 容置孔 83 導電端子 831 承接部 84 錫球 9 電路板 91 電性接點 111220309 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for planting conductive materials with conductive terminals, and in particular, it refers to one of the methods for applying electrical connection to a circuit board using a surface adhesion method. Method for soldering implantation of conductive terminals of electrical connectors. [Previous technology] As integrated circuit chips such as central processing units (CPUs) have increasingly strong processing speeds and functions, the chip will carry more and more electrical contacts for signal output (10 input and output). However, its packaged volume requires light, thin and short. Therefore, the package of highly integrated design integrated circuit chips such as central processing units has adopted PGA (Pin Gdd α_), BGA (Ball Grid Array), and even other packages. 20 methods', but no matter what kind of packaging method the integrated circuit chip uses, it must be electrically connected to the -f circuit board using an electrical connector. Therefore, in order to match the electrical connector with the integrated circuit chip packaging method, The stability and process efficiency of the electrical connection between the connector and the circuit board, so-generally, the end of each conductive terminal in the electrical connector-corresponding to the ball, and then the surface connector method (SMT) is used to solder the electrical connector The method of being fixed on a circuit board is a manufacturing method often used to produce an electrical connection between an electrical connector and a circuit board. "Figure 1 'shows a central processing unit 7 packaged in a PGA manner. An electrical connector 8 is electrically connected to the-circuit board 9 and its +, central processing is 7 formed in the area of its bottom surface after packaging. Plural male pins arranged at equal intervals and protruding downward], and the electrical connector 8 includes an insulating body 81 and a plurality of corresponding pins 71, penetrating the insulating body μ 4 1220309 5 receiving holes 82 ′ on both sides of the lower surface The accommodating holes 82 can accommodate _ guides 83. In addition, electrical contacts 91 corresponding to the conductive terminals are pre-designed on the circuit board 9, and the upper ends of the guides 83 housed in the insulating body 81 are electrically contacted with the central processing. The corresponding pins η of the device 7 are correspondingly connected to the electrical contacts 91 on the circuit board 9, so that the device 7 can be electrically connected to the circuit board 9 to transmit electronic signals. In order to connect the conductive terminals by the 9 wire-face bonding method of the lower end circuit board, the lower end of the conductive terminal 83 must be connected first-the solder ball 84, among which the method is to form a correspondence on the surface 811 under the insulating body W Communicating with the receiving puppet and inwardly spherically concave The mating surface 813 ′ and the lower end of the conductive end + 83 form a receiving portion 83 that fits with the mating surface 813 so that the mating surface ⑴ and the receiving portion 831 constitute a recess that contacts the surface of the solder ball 84, and the tin is positioned by the recess. Ball material, and the solder ball 84 can also contact the receiving portion 831 of the conductive terminal 83, and then turn the ball, so that the material 84 is pure and hybrid to the corresponding conductive stand 83, and can be used for subsequent electrical connectors The process of bonding with the surface of the circuit board. J. In order for the solder ball 84 to be implanted on the conductive terminal M, it must pass through the operation of the tin furnace. The material industry must have a tool for positioning the solder ball and the electrical connector. If the equipment of the tin furnace can reduce the process of returning to Tan, it will help to improve the production efficiency of the electrical connector. [Summary of the Invention] Therefore, the object of the present invention is to provide a method of implanting solder on conductive terminals without passing through tin. Furnace re-welding method. 5 1220309 The method for grafting solder to the conductive terminal of the present invention is to first prepare a conductive end f so that the conductive terminal is formed with a _ soldering end, and the soldering end is provided with a loose connection ^ and then a tool is used to transfer a solder from Welding end side Press it to the opposite side and move it through the & junction section, and then use the tool to press the solder from the other side of the soldering terminal to make the solder cover the soldering terminal, and at the same time, make the solder interfere with the junction. , So that the solder does not detach from the soldering end and form a solid connection. The effect of the present invention lies in the process of using squeeze solder to cover the conductive terminal, and making the deformed solder reach the electrical terminal without interference by the interference effect generated by its close contact with the embedding part, without the need for reflow and melting. . [Embodiment] The foregoing and other technical contents, features, and effects of the present invention are as follows. Reference will be made to the detailed description of the preferred embodiment 10, which will be clearly understood. The steps of a preferred embodiment of the method for implanting solder to a conductive terminal of the present invention are as follows:-Refer to FIG. 3 'Firstly, use a stamping die (not shown) to prepare a conductive terminal 1' Continuously 'The conductive terminal 1 is in a metal material Continuous forming on the belt 1GG, = after the metal material strip_ After removing unnecessary materials, it can become a plurality of conductive terminals 1 adjacent to each other in parallel but still connected, and each conductive terminal 1 is formed with a contact end U, a The soldering end 12 and the plurality of convex thorns 13 on both sides. In this example, the contact end u is an elastic arm shape, but other different shapes can also be used. The packaging form of the application depends on the shape of the contact end U. The content of 6 = 'is not intended to be discussed further here, and the soldering end 12 is flat, so that the soldering end 12 has the opposite one. One side 121 and the first γΓΓΓ are welded on the welding end 12 at the same time as the punching process order, or produced in another order. The engagement section '本 # 施 状 纯 部 为-is slightly keyhole-shaped and connected to the welding. The first surface 121 and the second surface 122 of the end 12 and the slot 14 is in the material The end edge 12 is formed - small width of the open side ⑷, with the open side 141 opposite to the other end of the larger width of the closed side 142 is formed. Referring to FIGS. 4 to 9, the solder 2, the original material, and the material 2 are obtained by cutting an appropriate length from the continuous tin wire, but not limited to the tin wire, so that the solder 2 contacts the first surface of the soldering end 12. (Shown in Figure 4)-Borrowing again—the machine is not shown in the figure), tan material 2 relative to the conductive terminal] is squeezed from the first surface 121 of its soldering end i toward the second surface 122 (shown in Figure 5), because The ductility of the solder 2 material itself. After being squeezed, the solder 2 will open up and the surface material is maneuvering, so that the solder 2 can protrude through the second surface 122 ° through the slot M. In addition, in order to make the solder 2 is easy to flow, you can also heat the solder 2 first, but it only needs to be softened without having to reach the temperature of the solder 2 refining. Next, the solder 2 (shown in FIG. 6) protruding from the second surface 122 from the second surface 122 of the soldering end 12 toward the first surface 121 is pressed by the implement, so that the solder 2 is welded due to the stress on both sides. The end 12 is covered, and at the same time, the shape of the material 2 and the slot 14 are tightly fitted (as shown in Figs. 7, 8 and 9). By using the slot 14, the open side 141 is narrow and the closed side 142 is wide. It can cause that the solder 2 cannot be separated from the open side 141 of the slot 14 and interfere with the soldering end 12, so that the solder 2 and the soldering end 12 are firmly connected. 1220309 Referring to FIG. 10, after the solders 2 are all planted to the corresponding conductive terminals i, the conductive terminals 1 can be assembled in the corresponding receiving holes 31 provided in an insulating body 3. The convex thorn 13 can be fixed on the inner wall surface defining the corresponding accommodation hole 31, so that the contact end η of each conductive terminal 丨 and the soldering end 12 implanted with the solder 2 protrude from the opposite sides of the insulating body 3 respectively. To form an electrical connector. In the figure, only one conductive terminal 1 is represented, and only a few of the receiving holes 31 of the insulating body 3 are drawn. The number of the receiving holes 31 and the conductive terminals 1 depends on the I / O connections of the electronic components to be connected. Depending on the number of feet or contacts. In this way, the process of electrical connection 1§ can completely eliminate the need for re-soldering steps, and can achieve the effect of solder 2 being implanted on the conductive terminal ^, which can not only simplify the process, but also reduce manufacturing costs. Furthermore, as shown in FIG. 11, since the purpose of the embedding portion provided at the soldering end 12 is mainly to provide the effect of preventing the mutual interference with the soldering end 12 after the solder 2 is pressed, various shapes of this purpose can be achieved. The engagement portion is also possible, so it is not necessarily the shape of the keyhole as shown in FIG. 3, and FIG. 1 shows another type of the engagement portion, which is a zigzag edge punched on both sides of the welding end 12. 15. In this way, after the solder 2 is covered by the solder 2, the zigzag edge 15 can prevent the solder 2 from being detached from the solder 12 (as shown in FIG. 12). Summarizing the above, the solder implantation method of the present invention interferes with the soldering part by forming the soldering part formed on the soldering end of the conductive terminal, and extruding the solder to cover the soldering end so as to be in close contact with the soldering part, so that the solder and The conductive terminal forms a fixed connection effect without the need for re-soldering, so it can indeed achieve the purpose of 8 1220309 of the present invention. However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited in this way, that is, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the description of the present invention are all Should still be within the scope of the invention patent. [Brief description of the drawings] FIG. 1 is a three-dimensional exploded view illustrating an embodiment in which an electronic component is electrically connected to a circuit board through an electrical connector; FIG. 2 is a partial cross-sectional schematic diagram illustrating a conventional conductive terminal Connection relationship with Lu-Sn ball; Figure 3 is a schematic three-dimensional view illustrating the steps of preparing a conductive terminal in the preferred embodiment of the method for implanting solder according to the present invention and the connection relationship with the solder; Figure 4 is shown in Figure 3 A schematic cross-sectional view taken along the line IV-IV, illustrating the positional relationship between the soldering end of the conductive end 15 and the solder; FIG. 5 is a schematic view of the material flow of the solder being pressed by the side in FIG. 4; FIG. 6 is the solder in FIG. 5 The material that is further squeezed by the opposite side is not intended to flow. Figure 7 is the connection relationship with the soldering end 20 of the conductive terminal after the solder extrusion in Figure 6 is completed; Figure 8 is a schematic cross-sectional view of the M-VDI section line in Figure 3, Explain the connection relationship between the solder of FIG. 7 and the soldering terminal of the conductive terminal; FIG. 9 is a connection system showing the other corner sound of the solder and the soldering terminal of the conductive terminal of FIG. 8; & 9 1220309 FIG. Assembled in The insulating body constitutes an electrical connector; FIG. 11 is a perspective view illustrating another feasible soldering terminal form of the conductive terminal; and 5 FIG. 12 is a side view illustrating the application of the present invention to the conductive terminal in FIG. 11 Methods The connection relationship after soldering. 10 1220309 [Description of the main symbols of the drawings] 1 Conductive terminal 100 Metal strip 11 Contact end 12 Welding end 121 First side 122 Second side 13 Spur 14 Slot 141 Open side 142 Closed side 15 Zigzag edge 2 Solder 3 Insulating body 31 7 Storage? L CPU 71 pin 8 electrical connector 81 insulation body 812 lower surface 813 mating surface 82 receiving hole 83 conductive terminal 831 receiving portion 84 solder ball 9 circuit board 91 electrical contact 11