TW558857B - Manufacturing method for solder-ball forming and fixing of electric connector and IC - Google Patents

Abstract

The present invention is a manufacturing method for solder-ball forming and fixing of electric connector and IC, and particularly provides a solder-ball forming and fixing method for applying to a ball grid array with electric connectors, IC or other electric components with a tinfoil attached on the bottom; wherein the tinfoil is configured with small tin sheets in the number corresponding to the soldering positions and numbers of the terminal; thus, the terminal soldering portion is enclosed by the small tin sheets or penetrating the small tin sheets; melting each small tin sheet into a ball-like solder ball with a thermal-melting method; and being stably combined with the terminal soldering portion. The method can be used for combining solder balls for any types of terminals, and can simplify multiple solder-ball combining methods.

Description

558857 V. Description of the invention (1) The invention of the invention is related to the design of a method, especially a connector and a terminal of an IC's solder ball forming fixed component. Its soldering = is used for electrical connectors, ICs or other electronic designs. Reach a variety of ten connectors and IC solder ball fixing manufacturing methods and simplify various solder ball bonding. The terminal soldering parts are suitable for combining solder balls, the traditional electrical connection, the third, the effect. Electronic component rod connection In the circuit board, ChlP, zero-insertion-force electrical connector or planting hole, the electrical connection is formed by punching a terminal on the circuit board, and then soldering the terminal end of the component through the terminal planting hole. The structure, which is not conducive to a large number of or thin ^ ^ soldering methods and electronic product manufacturing chapters and the & sub-pin application, so it has the end of today's devices and other components; The technique of soldering on the printed circuit # U ball, and then use the solder ball directly with the circuit but the electrical connector and other components are common methods of the person's method. Often, the terminal is at the bottom of the terminal 底部 5 2 The manufacturing and bonding method of the bottom of the terminal, such as the connection structure Will: = instead of The solder balls are clamped, or (such as the tenth figure and the first ^ designed with two copper pieces. The connection part 101 is set to a flat surface, and then the flux 10 is used.) =) The terminal 10 is welded to the welding part. At the bottom plane of 101, the two melting method enables solder ball 20 and circuit board 30 to be soldered (as shown in Figure 12), so that the terminal 10 can be combined with several different production lines. Therefore, the manufacturer must The cost of accessories quality control is very high, and t 5 wire maintenance and t 5 are used when designing the terminal structure. W τ · ,,, and the lack of more flexible changes, such as the use of terminal 10 flat joint 101 with flux 102 and heat ' melt

558857

Also it end = system ... (as shown in the tenth figure and tenth-figure), the 102 seal joint 101 is a flat structure 'only the flux can sink the head) shaped part l0i, such as the terminal and its welding The conventional solder ball bonding manufacturing method with a needle-shaped or countersunk head is too engraved. The method of the Fikik Temple needs to be improved due to different terminal structures. Therefore, the main purpose of the present invention is to provide an electrical connector and: The design of the solder ball forming and fixing manufacturing method of C is mainly based on a tin foil piece attached to the bottom of the ball brake array seat of an electrical connector, IC, or other electronic components. The number of small tin pieces, so that the terminal soldering part is covered or punctured by the small tin pieces, and then each small tin piece is fused into a spherical ball by a hot smelting method, and is firmly connected to the terminal soldering portion A solder ball molding and fixing manufacturing method is used to achieve any & type terminals can be suitable for bonding solder balls, and can simplify a variety of solder ball bonding methods ^ A second object of the present invention is to provide an electrical connector and J 匚Design of the method for forming and fixing the solder ball, in which The plurality of small tin foils of the tin foil are disc-shaped, and a thin connection portion is adopted around the tin foil to connect with adjacent small tin foils so as to form an approximately mesh-shaped kick foil, which is provided for covering the ball gate. The part of the array seat shrinks and breaks into independent solder balls during hot melting.-The manufacturing method and purpose of the present invention are described in detail below according to the embodiments of the drawings: The characteristics and other operations are shown in the drawings. The invention is designed for the "electrical connector and manufacturing method of tin-shaped solid connector of C", which is a kind of electrical connector,

558857 _ " * 5. Description of the invention (3) The soldering part of the terminal of the IC or other electronic components' soldering ball ball array array seat to enable the child to be soldered to the circuit board. The manufacturing method of the leaf is as follows: (a) Select a ball brake array base 1 with terminals 2 planted inside and a terminal soldering part 21 at the bottom (as shown in the first figure). The ball brake array base 1 is an electrical connector, IC or other The bottom component of the electronic component; (b) A tin foil 3 is arranged on the bottom of the ball brake array base 1, the tin foil 3 is a plurality of small circular tin pieces 3 corresponding to the terminals 2 2 Adjacent connection, which can be integrally formed by punching, so that the soldering portion 2 1 of the terminal 2 penetrates the small tin sheet 3 1 (such as the first

(As shown in the figure and the second figure); (c) The ball brake array base 1 coated with the tin foil 3 is further subjected to a hot-melt operation procedure, so that each of the small tin pieces 31 of the tin foil 3 is melted into a tin liquid, and Each thin connection portion 3 2 is fractured synchronously and aggregates with the small tin piece 3 1 into a spherical or nearly spherical tin ball 3 ′, thereby covering the solder portion 21 of the terminal 2 with the liquid tin ball 3 (as shown in the third figure to As shown in the fifth figure;); (d) The solder ball 3 'is cooled and solidified and bonded to the soldering portion 2 1 of the bottom end of the terminal 2 of the ball brake array base 1;

According to the above-mentioned solder ball forming and fixing manufacturing method of the electrical connector and IC, the soldering portion of the terminal at the bottom of the electronic component such as the electrical connector can be simultaneously formed and combined with the solder ball, and the power supply connector, IC or other electronic components and the circuit board Perform secondary heating welding operations. Since the present invention is a soldering part of the bottom end of the terminal 2 of the ball brake array base 1 which is pre-cured and covered with an electrical connector or IC during refining, the small tin sheet 3 1 of the tin foil sheet 3 is refined.

Page 6 558857 V. Description of the invention (4) 2 1 is a method that can be used for the tin foil 3 regardless of the equal structure of the welded part 21 and then cooled and combined with the ball brake array seat method to achieve a variety of terminals The convenient effect of the soldering part is to avoid the regrets as is common, so as to further obtain the manufacture. “By using the tin foil 3 of the present invention to melt into the gate array base of the tin IC, its terminals 2 and the bottom terminals 2 are specific for the development and design of the structure. The solder ball method is fixed, so the space is used to design the terminal 2 and the ball brake array. However, the structure of the tin foil 3 and the ball covering in the present invention is not necessary for the terminal 2 (as shown in the sixth figure). 1 / The terminal soldering part 2 at the bottom is also attached to the ball brake array base 1, and the connection part 21 at the bottom (refer to the seventh figure), 'make each small tin piece 3 of the tin patch 3 1 synchronously fracture And the small tin piece 3 1 ball 3 / (as shown in the eighth figure), thereby condensing on the sheet-shaped soldering portion 2 1; thereby the terminal soldering portion of the same part is synchronously formed and formed due to the technology of the above-mentioned manufacturing method The gate array base 1 can have a variety of quality control liquids on the bottom of the terminals. The end welds the welders, flakes, and fins of the brake array into a needle-shaped or crimped part. Therefore, the invention can be applied to the manufacturing of electrical connections by using a raw tin ball knot uniformly by the invention. Adequately combined with a ball gate structure with small tin terminals, 3 pieces of tin package, and similar ball / wrapped special electronic terminals with a variety of low-cost coating on the joint 2 The structure of the 1 is more than 1 The column base 1 and the connection part 21, such as a thorn or an IC, can be a sheet-like tin foil 3, which can make the tin foil melt into a tin liquid to condense into a ball or make the liquid tin ball 3 can be connected to the electrical connector. There are solder balls. Levy is also a manufacturing line manufacturing method that uses the joint 21 and then coats it. Secondly, it may be limited to the creative structure of. 2 The sheet 31 is the array base, so as to cover the welding line, hot-melt each finely connected tin and cool the element bottom. The tin foil sheet 3 is coated with hot-melt, so

558857 V. Description of the invention (5) Any type of terminal soldering part achieved is suitable for bonding with solder balls, and the effect of simplifying various solder ball bonding methods is the same as the above, which has substantial improvement in effectiveness. To sum up, the design of the present invention for "the solder ball molding and fixing manufacturing method of electrical connectors and ICs" has indeed been practical and creative, and the use of its means is novel and undoubted, and its efficacy and design purposes are true Yes, it has been said that reasonable progress has been made. To this end, an application for an invention patent was filed in accordance with the law, but I would like to ask Jun Bureau for detailed review and to grant the patent as a prayer.

Page 8 558857 Brief description of the drawings The first diagram is a schematic diagram of the brake array base and tin foil of the present invention. The second figure is a schematic view of the tin foil sheet covering the ball brake array base of the present invention. The third figure is a schematic view of the melting and polymerization action of the small tin sheet of the present invention. The fourth figure is a schematic view of a small tin sheet pierced by a terminal soldering portion of the present invention. The fifth figure is a schematic view of melting and polymerizing small tin pieces into tin balls according to the present invention. The sixth figure is a schematic diagram of another embodiment of the ball brake array base of the present invention. The seventh figure is a schematic view of a small tin sheet covering a soldering portion according to the present invention. The eighth figure is a schematic diagram of melting and polymerizing small tin pieces into tin balls according to the present invention. The ninth figure is a schematic view of a solder ball bonded to the bottom of the ball brake array base of the present invention. The tenth figure is a schematic diagram of applying a flux to a terminal.

Figure 11 is a schematic diagram showing the soldering state between solder balls and terminals. The twelfth figure is a schematic diagram of the soldering state between the terminal and the circuit board. Description of main drawing numbers: Ball Array Sockets 1, 1 >; Terminal 2; Soldering 21, 21 ′; Tin Foil 3; Small Tin 3 1; Connection 3 2; Tin Ball 3 >;

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Claims (1)

558857 VI. Scope of patent application 1. A solder ball forming and fixing manufacturing method for electrical connectors and ICs, which is a solder ball fixing manufacturing method for applying electrical connectors and other electronic components to the bottom of the ball brake array base to enable soldering with circuit boards. The method is characterized by: (a) selecting a ball brake array base with terminals internally and terminal welding portions at the bottom; (b) overlaying a plurality of small tin pieces corresponding to the terminals on the bottom surface of the ball brake array base and Tin foils composed of small tin pieces connected adjacently with thin connection portions, so that the soldering portion of the terminal is covered with the small tin pieces; (c) heat-dissolving is performed to melt each small tin piece into a tin liquid, The thin connection parts are broken and the small tin pieces are aggregated into solder balls, thereby forming liquid solder balls to cover the soldering portions of the terminals; (d) The liquid solder balls are cooled and solidified and bonded to the bottom end of the terminals of the ball brake array base. The soldering part; the solder ball forming and fixing manufacturing method of the electrical connector and the IC is used to combine the solder ball at the terminal soldering part of the bottom of the electronic component such as the electrical connector. 2. The solder ball forming and fixing manufacturing method of the electrical connector and IC as described in item 1 of the scope of patent application, wherein the soldering part of the terminals of the ball brake array base can be punctured in a small tin sheet. 3. The solder ball forming and fixing manufacturing method for the electrical connector and IC as described in item 1 of the scope of the patent application, wherein the soldering part of the terminals of the ball brake array base may be a sheet structure. 4. The solder ball forming and fixing manufacturing method for the electrical connector and IC as described in item 1 of the scope of patent application, wherein the tin foil sheet can be integrally stamped and manufactured. Page 10 558857 VI.The scope of patent application is 0 11IH