556372 五、發明說明（1) 2發明係有關一種電連接器及^ C之锡球固 甘惟指一種應用於電連接器或1 C或其他 ，蕤以〔吾焊接部之電連接器及I c錫球固定製造 彳卜i j 7任何型式之端子焊接部均適於結合錫 化多種錫球結合方法者。 傳，，電連接器、CPU、chip 、零插入力電 始：?丨70 1焊接於電路板之結構，係於電路板上沖 H f此將該電連接器等元件之端子端穿過端 ΐ ϊ ί錫進行焊接與固定，此種焊接方法及其 適於大量或細密之端子接腳應用，因 考笪-ϋ製造業者所不採，取而代之者係為一種 ς 7 之端子底部結合有錫球，再運用錫球直 板上印刷電路焊接之技術手段。 惟2見的電連接器等元件結合錫球於端子底 妹I需委於端子其底端之焊接部結構，而採 ΐ二ί ΐ及結合結構，例如將端子焊接部設計有 ίΐΠ或（如第十圖及第十-圖所示）將端 姓二一平面，再用助焊劑102及熱熔方法 1…平面處，藉此才使該端 ? ί 2 Π的生產線進行結合工作，造成生產線 ;:目成本增力口，且設計端子結構時無法更靈活 又如採用端子10平面焊接部101配合助焊劑i 定製造方 電子元件 方法設計 球，且簡 連接器或 設有端子 子植孔， 所形成的 此為現今 於電連接 接與電路 部之 用不 兩銅 子1 0 令錫 子10 造者 維護 變化 製造 同的 片以 之焊 球20 可與 須配 、產 之缺 0 2及熱熔556372 V. Description of the invention (1) 2 The invention relates to an electrical connector and a solder ball of ^ C, but refers to a type applied to an electrical connector or 1 C or other. c. Soldering of solder balls. Any type of terminal soldering part is suitable for combining various solder ball bonding methods. It is said that the electrical connector, CPU, chip, and zero insertion force start:? 丨 70 1 The structure of the circuit board is soldered to the circuit board and punched H f This terminal end of the electrical connector and other components is passed through the end ΐ ϊ Tin is used for soldering and fixing. This soldering method and its application to a large number of or dense terminal pins are not accepted by the manufacturers of 系 -ϋ. Instead, it is a ς7 terminal with a combination of tin at the bottom. Ball, and then use the technical means of printed circuit soldering on a tin ball bar. However, the components of the electrical connector and other components that are combined with the solder ball at the bottom of the terminal need to be assigned to the structure of the soldering portion at the bottom of the terminal. For example, the soldering portion of the terminal is designed with ΐ or (such as (Shown in the tenth figure and the tenth-figure), the end name is a plane, and then the flux 102 and the hot-melt method 1 ... plane are used to make the end? Π 2 Π production line to combine work, resulting in a production line ;: The cost increase, and the design of the terminal structure can not be more flexible, such as the use of the terminal 10 plane soldering part 101 with flux i to determine the manufacturer's electronic components design ball, and simple connectors or terminal holes. The result is the current use of electrical connections and circuit parts. Two coppers are used. 10 The tin is made. 10 The manufacturer maintains and changes the same piece. The solder ball is 20. melt
556372 五、發明說明（2) 令錫球20結合之製造方法（如第十圖及第十一圖所示）， 亦限於端子1 〇焊接部1 〇 1係呈平面結構者，才能使助焊劑 1 0 2印刷於焊接部丨〇 1 ，如端子其焊接部係為針狀或埋頭（ 沉頭）狀結構時，均不適於此種印刷助焊劑之製造方法， 由此可見常用的習知的錫球結合製造方法過於刻板，無法 隨時因應不同的端子結構，而有待改進。 … 緣此本發明主要目的’即在於提供一種電連接器及 I C之錫球固定製造方法設計，其主要係令電連接器戍 I C之球閘陣列座採以一模板或其本身所形成之凹穴^使 錫膏可預凝於球閘陣列座底面之端子焊接部，再經由敎 方法使錫膏熔結、固定成一球狀體錫球，藉此達成任G划 式之端子焊接部均適於結合錫球，以進一步與電路板4 者。 焊接 本發明次一目的，乃在於提供一種電連接器及 錫球固定製造方法設計，其中，該錫膏預凝於球之 底面之端子焊接部方式，可採以刮壓、擠壓或嗜:外座 式來達成者。 ，/貝具寺等方 茲依附圖實施例將本發明之方法特徵及盆仙 目的詳細說明如下： 之作用、 如附圖所示，本發明所為『電連接器及J c 定製造方法』設計，係為一種可應用於電連接之锡球固 其他電子元件之端子其焊接部，使能與電路板^ ^ I C或 球閘陣列座錫球固定製造方法設計，其劁、生 行焊接之 次： I k步驟、方法如556372 V. Description of the invention (2) The manufacturing method of combining the solder ball 20 (as shown in the tenth and eleventh illustrations) is also limited to the terminal 1 〇 soldering section 1 〇1 is a flat structure, so that the flux can be used 1 0 2 is printed on the soldering part. If the soldering part of the terminal is a needle-like or countersunk (sinking) structure, it is not suitable for the manufacturing method of this printing flux. The solder ball bonding manufacturing method is too rigid and cannot be adapted to different terminal structures at any time and needs to be improved. … The main purpose of the present invention is to provide a design of a solder ball fixing manufacturing method for an electrical connector and IC, which is mainly to make the ball connector array seat of the electrical connector and IC adopt a template or a recess formed by itself The hole ^ enables the solder paste to be pre-coagulated on the terminal soldering portion on the bottom surface of the ball brake array seat, and then the solder paste is fused and fixed into a spherical solder ball through the 敎 method, thereby achieving any G-shaped terminal soldering portion. In combination with solder balls to further connect with the circuit board 4. The second purpose of the present invention is to provide an electrical connector and a design method for fixing a solder ball, wherein the solder paste is pre-coagulated on the terminal soldering part of the bottom surface of the ball, which can be performed by scraping, squeezing, or addicting: Outstanders to achieve. Fangzi et al., According to the embodiments of the drawings, describe the characteristics of the method of the present invention and the purpose of the pot fairy in detail as follows: As shown in the drawings, the present invention is designed for "electrical connectors and J c manufacturing methods" , Is a soldering part of a solder ball terminal which can be applied to electrical connection of other electronic components, and is designed to be used with a circuit board ^ IC or ball brake array seat solder ball fixed manufacturing method design. : I k steps, methods such as
556372 五、發明說明（3) (a )選用一内 之 艮P (b )於 而 端 (c )接 覆 方 孔 膏 亦( (d )取( (e )再 锡 其 藉 連接器 電路板 陣列座 平面狀 均可供 球閘陣 係為電 球閘陣 設有複 子焊接 者將锡 於端子 式，可 穴3 1 ( 4填滿 可採以 如第三 下該模 如第四 令踢膏 球4 一 端子2 上述連 或I C 進入進 1其端 '片狀 5亥锡膏 部已植設 列座1 ( 連接器、 列座1底 數孔穴31 部2 1位於 膏4填滿 2之焊接 為採以刮 如第三圖 於該模板 噴填方式 圖B所示 板3使其 圖所示） 4進行熱 ’使凝固 底端之焊 接器及I 等電子元 行焊接。 子2底端 、針狀或 4進行預 底部具有端子焊接部2 1 如第一圖所示），該球閘陣列座1 I C或其他電子元件其中一構件； 部覆蓋一個對應端子2其焊接部2 1 如第二圖所示），使各 有端子2且 之模板3 ( 孔穴3 1中； 模板3之孔 部2 1 ，惟其 塗方式使錫 A所示）， 3之孔穴31 使錫膏4填 穴3 1，使該錫膏4恰包 中錫膏4填滿孔穴3 1之 膏4填滿於該模板3之 或可採以擠壓方式使錫 (如第三圖B所示）， 滿於該模板3之孔穴31 中錫膏4預留於端子2之焊接部21 熔，進而凝結成球狀或近似球狀之 後的錫球4 >結合於球閘陣列座1 接部21(如第五圖及第六圖所示）； C之錫球固定製造方法’即可於電 件底部之焊接部結合錫球，俾供與 因本發明係以錫膏4預凝包覆於閘 之焊接部2 1，是以不論焊接部2 1係 埋頭狀（如第九圖所示）等結構， 凝包覆，再運用熱熔方法使錫膏4556372 V. Description of the invention (3) (a) Select one of the inner P (b) at the end (c) to cover the square hole paste ((d) take ((e) and then solder the connector circuit board array The flat plane of the seat can be used for the ball brake array system. The electric ball brake array is equipped with a compound solderer to solder the tin to the terminal type. The hole can be filled with 3 1 (4 can be used as the third order, such as the fourth order to kick the ball. 4 One terminal 2 The above-mentioned connection or IC enters into 1 'end of the chip's 5 helium solder paste has been installed in the column base 1 (connector, column base 1 bottom hole 31 31 2 1 solder located in the paste 4 fill 2 Use the scraper as shown in the third figure to spray the plate and fill the plate 3 in the template (shown in Figure 3). 4 Perform thermal welding to solidify the bottom end of the welder and electronic elements such as I. Bottom end, needle-shaped Or 4 is pre-bottomed with terminal soldering part 2 1 (as shown in the first figure), the ball brake array seat 1 is one of the components of IC or other electronic components; the part covers a corresponding terminal 2 and its soldering part 2 1 is as shown in the second figure (Shown), so that each has a terminal 2 and a template 3 (in the hole 31; the hole portion 2 1 of the template 3, but the coating method is shown as tin A), 3 holes 31 Solder paste 4 fills the cavity 31, so that the solder paste 4 fills the cavity 3, the paste 4 fills the cavity 3, and the paste 4 is filled in the template 3, or the tin can be extruded (as shown in Figure 3B). (Shown), the solder paste 4 in the cavity 31 full of the template 3 is reserved for the soldering portion 21 of the terminal 2 and then coagulates into a ball or a ball-like solder ball 4 > Part 21 (as shown in the fifth and sixth figures); C's method for manufacturing a solder ball can be combined with solder balls at the soldering part at the bottom of the electrical part, and the solder paste is used for pre-caking with the solder paste 4 according to the present invention. The soldering part 21 covered on the gate is covered with the soldering part 21 regardless of the structure of the soldering part 21 (as shown in the ninth figure), and then the solder paste 4 is applied by the hot melt method.
556372 五、發明說明（4) 熔化凝聚成 種端子焊接 避免如習見 步獲致製造 4預凝包覆 該端子2於 的固定錫球 ，以設計端 惟本發 其端子2再 輔助步驟為 上實施，其 (a )選用一 之球閘 上設有 片狀焊 (b )將錫膏 4恰包 之方式 採以刮 (c )再令錫 錫球4： 其端子 因上述 錫球4 部均可 般多種 、品管 於閘陣 結構設 方式， 子2與 明預凝 進行熱 限，亦 方法如 内部已 陣列座 凹穴1 1 接部2 1 4填滿 覆於端 ，參考 塗、擠 膏4進 ，，使 2底端 製造方 > ，故藉本發 統一應用一種 端子多 成本低 列座1 計時， 因此設 球閘陣 錫膏4 熔之製 可直接 次： 植設有 1，於 (如第 (如第 於球閘 子2之 如上第 壓或喷 行熱熔 凝固後 之焊接 法之技 種锡球 廉等效 其端子 其焊接 計者係 列座1 於連接 造方法 於連接556372 V. Description of the invention (4) Melting and condensing into a kind of terminal soldering to avoid the manufacturing of conventional soldering 4 Pre-setting the fixed solder ball covering the terminal 2 to the design end, but the terminal 2 is the auxiliary step for the above implementation. Its (a) selects one of the ball brakes with sheet soldering (b) and applies the solder paste 4 to the package (c) and then scrapes the solder balls 4: the terminals can be used because of the above four solder balls There are many ways for the quality control to be arranged in the gate array structure. The sub 2 and Ming pre-coagulation are used to limit the heat. The method is also to fill the end by filling the cavity 1 1 with the connection 2 1 4 in the method. , So that the bottom 2 manufacturing side>, so by this invention unified application of a terminal multi-cost low-row seat 1 timing, so the ball grid array solder paste 4 melting system can be directly times: planted with 1, in (such as The first (such as the first method of the ball gate 2 or the welding method after spraying and hot-melting and solidifying the solder ball is equivalent to its terminal and its soldering meter series seat 1 in the connection manufacturing method to the connection
明之製 生產線 結合方 果。其 2底端 部2 1亦 具有比 之最佳 器或I ，並不 器或I 造方法，係 製造之方便 法之缺憾， 次’藉本發 焊接部2 1之 可不必局限 較充裕的創 的組合結構 C其球閘陣 以上述該模 C其球閘陣 端子 該焊 七圖 Λ圖 陣列 焊接 三圖 填方 ，進 的錫 部21 術特 2及底 接部21 所示） 所示） 座1之 部21， Α至第 式達成 而凝結 球4 / (如第 徵’亦 部具有端子焊 周圍之球閘陣 ，或於凹穴11 贅 凹穴1 1中，使 而錫膏4填滿 三圖B所系， > 成球狀或近# 結合於球閘降 八圖所示）’ 採用錫膏4預 達到多 功效， 以進一 明錫膏 方法， 於特定 作空間 〇 列座1 板2之 列座1 接部2 1 列座1 中設有 該錫膏 凹穴1 1 均可為 球狀之 列座1 凝包覆Mingzhi production line combines the results. The 2 bottom end 2 1 also has a better device or I than the best device or I manufacturing method, which is the shortcoming of the convenient method of manufacturing. The combined structure C of the ball brake array is filled with the above-mentioned mold C and the ball brake array terminals are welded as shown in Figure Λ and the array is welded as shown in Figure 3, and the tin part 21 is shown in Figure 2 and bottom part 21)) Blocks 21, Α to 1 are achieved and the ball 4 is condensed. (For example, if the sign has a ball grid around the terminal solder, or in the cavity 11 and the cavity 11, the solder paste 4 is filled. All three pictures are related to B, > into a ball or near # combined with the ball gate and the eight diagrams shown below) 'Using the solder paste 4 to achieve multi-effects, in order to improve the solder paste method, in a specific work space 0 row seat 1 The soldering sockets 1 1 of the mounting base 1 of the board 2 are provided in the mounting base 1. Both of them can be spherical mounting bases 1
556372 五、發明說明（5) 於連接器或I C其閘陣列座1其端子2底端之焊接部2 1再 施予熱熔，因此所達成之任何型式端子焊接部均適於結合 錫球，且簡化多種錫球結合方法之效果，係與前述相同， 均具有實質功效之增進。 綜上所述，本發明所為『電連接器及I C之錫球固定 製造方法』設計，已確具實用性與創作性，其手段之運用 亦出於新穎無疑，且其功效與設計目的誠然符合，已稱合 理進步至明。為此，依法提出發明專利申請，惟懇請 鈞 局惠予詳審，並賜准專利為禱，至感德便。556372 V. Description of the invention (5) The soldering part 2 1 at the bottom of the connector 2 or the gate array base 1 of the terminal 2 of the IC is then hot melted, so any type of terminal soldering part reached is suitable for bonding with solder balls, and The effect of simplification of various solder ball bonding methods is the same as that described above, and all of them have substantial enhancements. To sum up, the design of the present invention for the "Method of Manufacturing Solder Ball Fixings for Electrical Connectors and ICs" is indeed practical and creative, and the use of its means is also novel and undoubted, and its efficacy and design purpose are indeed in line with It has been said that reasonable progress has been made to the clear. To this end, an application for an invention patent was filed in accordance with the law, but the Bureau is kindly requested to review it in detail and grant the patent as a prayer.
第8頁 556372 圖式簡單說明 第一圖為本發明球閘陣列座及端子結構之示意圖。 第二圖為本發明覆設模板之方法及結構示意圖。 第三圖A為本發明刮塗填充錫膏之動作示意圖。 第三圖B為本發明擠壓填充錫膏之動作示意圖。 第三圖C為本發明喷填填充錫膏之動作示意圖。 第四圖為本發明模板取下後錫膏狀態之示意圖。 第五圖為本發明錫膏進行熱熔凝聚之示意圖。 第六圖為本發明球閘陣列座之錫球狀態示意圖。 第七圖為本發明製造方法另一實施例之示意圖。 第八圖為本發明製造方法另一實施例之示意圖。 第九圖為本發明端子焊接部埋頭狀態之示意圖。 第十圖為習見塗佈助焊劑於端子之示意圖。 第十一圖為習見錫球與端子焊接狀態之之示意圖。 第十二圖為習見端子與電路板焊接狀態之示意圖。 主要圖號說明： 球閘陣列庫1 ; 凹穴1 1 ; 端子2 ; 焊接部2 1 ; 模板3， 孔穴3 1 ; 錫膏4 ; 锡球4 ;Page 8 556372 Brief description of the drawings The first diagram is a schematic diagram of the ball brake array base and terminal structure of the present invention. The second figure is a schematic diagram of a method and a structure for laying a template according to the present invention. The third figure A is a schematic diagram of the operation of scraping and filling a solder paste according to the present invention. The third figure B is a schematic view of the operation of squeezing and filling the solder paste according to the present invention. The third figure C is a schematic view of the operation of spray filling the solder paste according to the present invention. The fourth figure is a schematic view of the state of the solder paste after the template of the present invention is removed. The fifth diagram is a schematic diagram of hot-melt agglomeration of the solder paste of the present invention. The sixth figure is a schematic view of the state of the solder balls of the ball brake array base of the present invention. The seventh figure is a schematic diagram of another embodiment of the manufacturing method of the present invention. FIG. 8 is a schematic diagram of another embodiment of the manufacturing method of the present invention. The ninth figure is a schematic view of the state of the countersunk head of the terminal soldering portion of the present invention. The tenth figure is a schematic diagram of applying a flux to a terminal. Figure 11 is a schematic diagram showing the soldering state between solder balls and terminals. The twelfth figure is a schematic diagram of the soldering state between the terminal and the circuit board. Description of main drawing numbers: Ball Array Library 1; Cavity 1 1; Terminal 2; Welding Section 2 1; Stencil 3; Cavity 3 1; Solder Paste 4; Solder Ball 4;