JPS6169157A - Manufacture of lead terminal - Google Patents
Manufacture of lead terminalInfo
- Publication number
- JPS6169157A JPS6169157A JP13491284A JP13491284A JPS6169157A JP S6169157 A JPS6169157 A JP S6169157A JP 13491284 A JP13491284 A JP 13491284A JP 13491284 A JP13491284 A JP 13491284A JP S6169157 A JPS6169157 A JP S6169157A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- terminals
- ceramic substrate
- springs
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、多数のリード端子をキャリアに並列せしめ、
基板等の側縁に融着するリード端子の製造方法に関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for arranging a large number of lead terminals in parallel with a carrier,
The present invention relates to a method of manufacturing a lead terminal that is fused to the side edge of a substrate or the like.
電子部品とくに、ＳＩＰ形電子電子部品板たとえばセラ
ミック基板等の側縁に配列形成されたパッドに、キャリ
ア付リード端子を半田付は等により装着する方法が行な
われている。A method of attaching lead terminals with carriers to pads arranged on the side edge of an electronic component, particularly an SIP type electronic component board such as a ceramic substrate, by soldering or the like is used.
第５図〜第７図は、従来のリード端子の製造方法を説明
するための第５図はキャリア付端子の斜視図、第６図は
セラミック基板に半田付けした断面図、第７図はキャリ
アを切除した斜視図である。Figures 5 to 7 are for explaining the conventional manufacturing method of lead terminals. Figure 5 is a perspective view of a terminal with a carrier, Figure 6 is a sectional view of a terminal soldered to a ceramic substrate, and Figure 7 is a carrier. FIG.
第５図において、完成した時に板厚の厚いリード端子５
Ａとなるキャリア付端子５は、細長いキャリア４の長手
方向の側縁に一端が連結し、櫛形に並列するようにブラ
ンク加工されて形成されている。このキャリア付端子５
の並列ピッチは、図示しないセラミ・ツク基板の側縁に
並列されたパ・ノド３のピッチに等しい。In Fig. 5, the lead terminal 5 has a thick plate when completed.
The carrier-attached terminals 5 A are blank-processed so as to have one end connected to the longitudinal side edge of the elongated carrier 4 and arranged in parallel in a comb shape. This terminal with carrier 5
The parallel pitch is equal to the pitch of the pad nodes 3 arranged in parallel on the side edges of a ceramic substrate (not shown).
そしてそれぞれのキャリア付端子５の先端は、同一平面
内に二股に分岐して一対の固着片６が形成されている。The tip of each carrier-attached terminal 5 is bifurcated within the same plane to form a pair of fixing pieces 6.
またそれぞれの固着片６の下面の所望の位置に、キャリ
ア４に平行した段付線が形成されてストッパ６ａ７！ｌ
＜設けられている。したがって固着片６のストッパ６ａ
より先端は板厚が薄くなっている。In addition, a stepped line parallel to the carrier 4 is formed at a desired position on the lower surface of each fixing piece 6, and a stopper 6a7! l
<It is provided. Therefore, the stopper 6a of the fixed piece 6
The plate thickness is thinner at the tip.
キャリア４の長手方向の側縁の所望のキャリア付端子５
間辷、すなわち１枚のセラミック基板１に対して少なく
とも２本の割合で、綱長い短冊形で長さがキャリア付端
子５の長さよりも若干長い挟持用ばね７が、キャリア付
端子５に並列して櫛形に形成されている。Desired carrier-attached terminal 5 on the longitudinal side edge of the carrier 4
In other words, at a ratio of at least two to one ceramic substrate 1, clamping springs 7 having a long rectangular shape and slightly longer than the length of the carrier-attached terminal 5 are parallel to the carrier-attached terminal 5. It is formed into a comb shape.
第６図において、セラミック基板１の表面の側縁部に並
列形成されたパット３の上面には、半田ペースト８が塗
布されている。そしてセラミック基板１の側縁を挟持用
ばね７の先端部の上面に押圧し、挟持用ばね７を撓ませ
て、セラミック基板１がキャリア付端子５と挟持用ばね
７の間に押入れられている。なお、押入れる位置はパッ
ド３ガ固着片６の下面に当接する位置である。そしてセ
ラミック基板１とキャリア付端子５とが平行し、セラミ
ック基板１の側縁の端面がストッパ６ａに係止するまで
、セラミック基板１を挿入接着したｔ るの
ち、第７図に示すようにキャリア４をＭ−Ｍの線で切除
する構成となっている。In FIG. 6, solder paste 8 is applied to the upper surface of pads 3 formed in parallel on the side edges of the surface of ceramic substrate 1. As shown in FIG. Then, the side edge of the ceramic substrate 1 is pressed against the upper surface of the tip of the clamping spring 7, the clamping spring 7 is bent, and the ceramic substrate 1 is pushed between the terminal with carrier 5 and the clamping spring 7. . The position where the pad 3 is pushed in is the position where the pad 3 contacts the lower surface of the fixing piece 6. Then, the ceramic substrate 1 is inserted and bonded until the ceramic substrate 1 and the terminal with carrier 5 are parallel to each other and the end face of the side edge of the ceramic substrate 1 is stopped by the stopper 6a. 4 is cut along the line M-M.
上記の構成のリード端子の製造方法において、キャリア
付端子５のピッチが小さくなると、固着片６と挟持用ば
ね７のギャップが非常に狭くなるので、打抜型の層比が
激しいので高価になるとともに、作業能率が悪い等の問
題点があった。In the method for manufacturing lead terminals having the above structure, when the pitch of the carrier-attached terminals 5 becomes small, the gap between the fixing piece 6 and the clamping spring 7 becomes very narrow, which increases the layer ratio of the punching die and increases the cost. There were problems such as poor work efficiency.
本発明は、上記の問題点を解決したリード端子の製造方
法を提供するもので、その手段は、一端が同一平面内で
二股に分岐し、一面に基板あ側縁部が当接係止する段付
ストッパ部を設けた固着片と、他端を細長いキャリアの
長手方向に沿って櫛形に並列せしめるキャリア付端子を
形成したリード端子において、該リード端子のブランク
加工時に、端子間の不要部分を少なくとも２本以上残し
、前記基板を挟持するよう形成した挟持ばねを付設する
ようにしたことによってなされる。The present invention provides a method for manufacturing a lead terminal that solves the above-mentioned problems, and the method is such that one end branches into two within the same plane, and the other side edge of the substrate abuts and locks on one side. In a lead terminal formed of a fixed piece with a stepped stopper portion and a terminal with a carrier whose other end is arranged in parallel in a comb shape along the longitudinal direction of an elongated carrier, unnecessary parts between the terminals are removed when blanking the lead terminal. This is accomplished by attaching at least two or more holding springs formed to hold the substrate.
上記リード端子の製造方法は、キャリア付リード端子を
ブランク加工により行なう時に、リード端子間の打抜き
切断除去する部分を少なくとも２ケ所以上をキャリアか
ら切断せずに残して、挟持用ばねを形成し、固着片に対
して若干下方え折り曲げて固着片と挟持用ばねでセラミ
ック基板を挟持する構成となし、製造が容易で経済的で
ある。The method for manufacturing a lead terminal described above includes, when blanking a lead terminal with a carrier, leaving at least two or more portions between the lead terminals to be punched and removed without cutting from the carrier to form a clamping spring; The ceramic substrate is bent slightly downward relative to the fixing piece and the ceramic substrate is held between the fixing piece and the clamping spring, which is easy and economical to manufacture.
以下図面を参照しながら本発明に係るリード端子の製造
方法の実施例について詳細に説明する。Embodiments of the method for manufacturing a lead terminal according to the present invention will be described in detail below with reference to the drawings.
第１図は、本発明に係るリード端子の製造方法の一実施
例を説明するための平面図で、第５図と同等の部分につ
いては同一符号を付している。FIG. 1 is a plan view for explaining one embodiment of the method for manufacturing a lead terminal according to the present invention, and parts equivalent to those in FIG. 5 are designated by the same reference numerals.
キャリア付端子５は、細長いキャリア４の長手方向の側
縁に一端が連結し、櫛形に並列するようにブランク加工
されて形成されている。このキャリア付端子５の並列ピ
ッチは、図示しないセラミック基板の側縁に並列された
バッド３のピッチに等しい。The carrier-attached terminals 5 are blank-processed so as to have one end connected to the longitudinal side edge of the elongated carrier 4 and arranged in parallel in a comb shape. The parallel pitch of the carrier-attached terminals 5 is equal to the pitch of the pads 3 arranged in parallel on the side edge of a ceramic substrate (not shown).
そしてそれぞれのキャリア付端子５の先端は、同一平面
内に二股に分岐して一対の固着片６が形成されている。The tip of each carrier-attached terminal 5 is bifurcated within the same plane to form a pair of fixing pieces 6.
またそれぞれの固着片６の下面の所望の位置に、キャリ
ア４に平行した段付線が形成されてストッパ６ａ（第２
図に示す）が設けられている。したがって固着片６のス
トー／パ６ａより先端は板厚が薄くなっている。Further, a stepped line parallel to the carrier 4 is formed at a desired position on the lower surface of each fixing piece 6, and a stopper 6a (second
(as shown in the figure) is provided. Therefore, the tip of the fixing piece 6 is thinner than the stop/pa 6a.
キャリア４の長手方向の側縁の所望のキャリア付端子５
間に、すなわち１枚のセラミック基板１に対して少なく
とも２本の割合で、キャリア付端子５間の打抜き切断除
去する部分をキャリアから切断せずに残して、挟持用ば
ね９を形成し、固着片６に対して若干下方え折り曲げて
固着片６と挟持用ばね９とでセラミック基板１ （第２
図に示す）を挟持する構成である。Desired carrier-attached terminal 5 on the longitudinal side edge of the carrier 4
In between, that is, at a ratio of at least two to one ceramic substrate 1, the parts to be punched and removed between the carrier-attached terminals 5 are left uncut from the carrier to form clamping springs 9 and fixed. Bend the piece 6 slightly downward and attach the ceramic substrate 1 (second
(shown in the figure) is sandwiched between the two.
第２図〜第４図は、リード端子をセラミ・ツク基板への
実装例を説明するための第２図はセラミック基板挿入前
の側断面図、第３図は挿入後の側断面図、第４図は装着
後キャリアを切除した側面図で、第５図および第１図と
同等の部分については同一符号を付している。Figures 2 to 4 are for explaining an example of mounting lead terminals on a ceramic board. Figure 2 is a side sectional view before inserting the ceramic board, Figure 3 is a side sectional view after insertion, and FIG. 4 is a cutaway side view of the carrier after installation, in which the same parts as in FIG. 5 and FIG. 1 are designated by the same reference numerals.
キャリア付端子５の固着片６と挟持用ばね９との間に、
セラミック基板１を点線矢印方向から挿入すれば、第３
図に示す如くセラミ・ツク基板１の側縁が固着片６のス
トッパ６ａに当接するまで押し込んだのち、セラミック
基板１の側縁に設けたパッド３と固着片６を半田等で接
着して、キャリア４を切り取れば第４図に示すようにリ
ード端子５Ａのみが残る。Between the fixing piece 6 of the terminal with carrier 5 and the clamping spring 9,
If the ceramic substrate 1 is inserted from the direction of the dotted arrow, the third
As shown in the figure, after pushing the ceramic substrate 1 until the side edge contacts the stopper 6a of the fixing piece 6, the pad 3 provided on the side edge of the ceramic substrate 1 and the fixing piece 6 are bonded with solder or the like. When the carrier 4 is cut out, only the lead terminals 5A remain as shown in FIG.
以上の説明から明らかなように、本発明に係るリード端
子の製造方法によれば、リード端子のブランク加工が容
易となり作業能率が向上するとともに、挟持ばねとして
打ち抜く不要部分を利用するので経済的効果が大である
。As is clear from the above explanation, according to the method for manufacturing lead terminals according to the present invention, blank processing of lead terminals is facilitated, work efficiency is improved, and unnecessary parts punched out as clamping springs are used, resulting in economical effects. is large.
第１図は、本発明に係るリード端子の製造方法の一実施
例を説明するための平面図、
第２図〜第４図は、リード端子をセラミック基板への実
装例を説明するための第２図はセラミソｔ り基
板挿入前の側断面図、第３図は挿入後の側断面図、第４
図は装着後キャリアを切除した側面図、第５図〜第７図
は、従来のリード端子の製造方法説明するための第５図
はキャリア付端子の斜視図、第６図はセラミック基板に
半田付けした断面図、第７図はキャリアを切除した斜視
図である。
図中、１はセラミック基板、２は導体パターン、３はバ
ッド、４はキャリア、５はキャリア端子、５Ａはリード
端子、６は固着片、６ａはストッパ、７．９は挟持用ば
ね、８は半田ペースト、をそれぞれ示す。
第 １ 図
第３図
第４図
第５図FIG. 1 is a plan view for explaining an embodiment of the method for manufacturing a lead terminal according to the present invention, and FIGS. 2 to 4 are plan views for explaining an example of mounting a lead terminal on a ceramic substrate. Figure 2 is a side sectional view before inserting the ceramic substrate, Figure 3 is a side sectional view after insertion, and Figure 4 is a side sectional view before insertion.
The figure is a side view with the carrier cut out after installation, Figures 5 to 7 are perspective views of terminals with carriers, and Figure 6 is a perspective view of a terminal with a carrier to explain the conventional manufacturing method of lead terminals. The attached sectional view and FIG. 7 are perspective views with the carrier cut away. In the figure, 1 is a ceramic substrate, 2 is a conductor pattern, 3 is a pad, 4 is a carrier, 5 is a carrier terminal, 5A is a lead terminal, 6 is a fixed piece, 6a is a stopper, 7.9 is a clamping spring, and 8 is a solder paste, respectively. Figure 1 Figure 3 Figure 4 Figure 5
Claims (1)
部が当接係止する段付ストッパ部を設けた固着片と、他
端を細長いキャリアの長手方向に沿って櫛形に並列せし
めるキャリア付端子を形成したリード端子において、該
リード端子のブランク加工時に、端子間の不要部分を少
なくとも２本以上残し、前記基板を挟持するよう形成し
た挟持ばねを付設するようにしたことを特徴とするリー
ド端子の製造方法。A fixing piece with one end branching into two on the same plane and having a stepped stopper part on one side that abuts and locks the side edge of the board, and the other end arranged in a comb shape along the longitudinal direction of the elongated carrier. In the lead terminal in which a terminal with a carrier is formed, at least two or more unnecessary parts are left between the terminals when blanking the lead terminal, and a clamping spring formed to clamp the substrate is attached. A method for manufacturing lead terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13491284A JPS6169157A (en) | 1984-06-28 | 1984-06-28 | Manufacture of lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13491284A JPS6169157A (en) | 1984-06-28 | 1984-06-28 | Manufacture of lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169157A true JPS6169157A (en) | 1986-04-09 |
Family
ID=15139433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13491284A Pending JPS6169157A (en) | 1984-06-28 | 1984-06-28 | Manufacture of lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169157A (en) |
-
1984
- 1984-06-28 JP JP13491284A patent/JPS6169157A/en active Pending
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