JPS6088548U - 半導体ウエ−ハの真空吸着具 - Google Patents

半導体ウエ−ハの真空吸着具

Info

Publication number
JPS6088548U
JPS6088548U JP18111783U JP18111783U JPS6088548U JP S6088548 U JPS6088548 U JP S6088548U JP 18111783 U JP18111783 U JP 18111783U JP 18111783 U JP18111783 U JP 18111783U JP S6088548 U JPS6088548 U JP S6088548U
Authority
JP
Japan
Prior art keywords
suction
vacuum suction
suction tool
flange
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18111783U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322672Y2 (en, 2012
Inventor
志水　孝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP18111783U priority Critical patent/JPS6088548U/ja
Publication of JPS6088548U publication Critical patent/JPS6088548U/ja
Application granted granted Critical
Publication of JPS6322672Y2 publication Critical patent/JPS6322672Y2/ja
Granted legal-status Critical Current

Links

JP18111783U 1983-11-22 1983-11-22 半導体ウエ−ハの真空吸着具 Granted JPS6088548U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18111783U JPS6088548U (ja) 1983-11-22 1983-11-22 半導体ウエ−ハの真空吸着具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18111783U JPS6088548U (ja) 1983-11-22 1983-11-22 半導体ウエ−ハの真空吸着具

Publications (2)

Publication Number Publication Date
JPS6088548U true JPS6088548U (ja) 1985-06-18
JPS6322672Y2 JPS6322672Y2 (en, 2012) 1988-06-22

Family

ID=30392542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18111783U Granted JPS6088548U (ja) 1983-11-22 1983-11-22 半導体ウエ−ハの真空吸着具

Country Status (1)

Country Link
JP (1) JPS6088548U (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63167418U (en, 2012) * 1987-04-23 1988-11-01
JPS6457637A (en) * 1987-05-22 1989-03-03 American Telephone & Telegraph Method and apparatus for handling wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957498A (en, 2012) * 1972-10-04 1974-06-04
JPS52139767U (en, 2012) * 1976-04-16 1977-10-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957498A (en, 2012) * 1972-10-04 1974-06-04
JPS52139767U (en, 2012) * 1976-04-16 1977-10-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63167418U (en, 2012) * 1987-04-23 1988-11-01
JPS6457637A (en) * 1987-05-22 1989-03-03 American Telephone & Telegraph Method and apparatus for handling wafer

Also Published As

Publication number Publication date
JPS6322672Y2 (en, 2012) 1988-06-22

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