JPS608337A - 導電性粒状フエノ−ル樹脂 - Google Patents

導電性粒状フエノ−ル樹脂

Info

Publication number
JPS608337A
JPS608337A JP11670783A JP11670783A JPS608337A JP S608337 A JPS608337 A JP S608337A JP 11670783 A JP11670783 A JP 11670783A JP 11670783 A JP11670783 A JP 11670783A JP S608337 A JPS608337 A JP S608337A
Authority
JP
Japan
Prior art keywords
granular
phenol
resin
phenolic resin
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11670783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6137293B2 (https=
Inventor
Hiroaki Koyama
小山　裕章
Shigeo Shimizu
清水　滋夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanebo Ltd
Original Assignee
Kanebo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanebo Ltd filed Critical Kanebo Ltd
Priority to JP11670783A priority Critical patent/JPS608337A/ja
Publication of JPS608337A publication Critical patent/JPS608337A/ja
Publication of JPS6137293B2 publication Critical patent/JPS6137293B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP11670783A 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂 Granted JPS608337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11670783A JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11670783A JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Publications (2)

Publication Number Publication Date
JPS608337A true JPS608337A (ja) 1985-01-17
JPS6137293B2 JPS6137293B2 (https=) 1986-08-22

Family

ID=14693831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11670783A Granted JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Country Status (1)

Country Link
JP (1) JPS608337A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243668A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 異方導電性接着剤
US5493130A (en) * 1993-06-10 1996-02-20 Micron Technology, Inc. Integrated circuitry having an electrically conductive sidewall link positioned over and electrically interconnecting respective outer sidewalls of two conductive layers
US5736437A (en) * 1993-05-12 1998-04-07 Micron Technology, Inc. Method of fabricating a bottom and top gated thin film transistor having an electrical sidewall connection

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62243668A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 異方導電性接着剤
US5736437A (en) * 1993-05-12 1998-04-07 Micron Technology, Inc. Method of fabricating a bottom and top gated thin film transistor having an electrical sidewall connection
US6306696B1 (en) 1993-05-12 2001-10-23 Micron Technology, Inc. Methods of forming integrated circuitry methods of forming thin film transistors, integrated circuitry and thin film transistors
US6479332B2 (en) 1993-05-12 2002-11-12 Micron Technology, Inc. Methods of forming integrated circuitry
US6759285B2 (en) 1993-05-12 2004-07-06 Micron Technology, Inc. Methods of forming transistors
US5493130A (en) * 1993-06-10 1996-02-20 Micron Technology, Inc. Integrated circuitry having an electrically conductive sidewall link positioned over and electrically interconnecting respective outer sidewalls of two conductive layers

Also Published As

Publication number Publication date
JPS6137293B2 (https=) 1986-08-22

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