JPS6137293B2 - - Google Patents

Info

Publication number
JPS6137293B2
JPS6137293B2 JP11670783A JP11670783A JPS6137293B2 JP S6137293 B2 JPS6137293 B2 JP S6137293B2 JP 11670783 A JP11670783 A JP 11670783A JP 11670783 A JP11670783 A JP 11670783A JP S6137293 B2 JPS6137293 B2 JP S6137293B2
Authority
JP
Japan
Prior art keywords
phenolic resin
granular
conductive
granular phenolic
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11670783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS608337A (ja
Inventor
Hiroaki Koyama
Shigeo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanebo Ltd
Original Assignee
Kanebo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanebo Ltd filed Critical Kanebo Ltd
Priority to JP11670783A priority Critical patent/JPS608337A/ja
Publication of JPS608337A publication Critical patent/JPS608337A/ja
Publication of JPS6137293B2 publication Critical patent/JPS6137293B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP11670783A 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂 Granted JPS608337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11670783A JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11670783A JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Publications (2)

Publication Number Publication Date
JPS608337A JPS608337A (ja) 1985-01-17
JPS6137293B2 true JPS6137293B2 (https=) 1986-08-22

Family

ID=14693831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11670783A Granted JPS608337A (ja) 1983-06-27 1983-06-27 導電性粒状フエノ−ル樹脂

Country Status (1)

Country Link
JP (1) JPS608337A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH072938B2 (ja) * 1986-04-16 1995-01-18 松下電器産業株式会社 異方導電性接着剤
US5650655A (en) * 1994-04-28 1997-07-22 Micron Technology, Inc. Integrated circuitry having electrical interconnects
US5434103A (en) * 1993-06-10 1995-07-18 Micron Technology, Inc. Method of forming an electrical connection

Also Published As

Publication number Publication date
JPS608337A (ja) 1985-01-17

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