JPS6077435A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPS6077435A
JPS6077435A JP58185349A JP18534983A JPS6077435A JP S6077435 A JPS6077435 A JP S6077435A JP 58185349 A JP58185349 A JP 58185349A JP 18534983 A JP18534983 A JP 18534983A JP S6077435 A JPS6077435 A JP S6077435A
Authority
JP
Japan
Prior art keywords
wire
wirings
wiring pattern
tool
disconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58185349A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312478B2 (de
Inventor
Masao Funada
雅夫 舟田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP58185349A priority Critical patent/JPS6077435A/ja
Publication of JPS6077435A publication Critical patent/JPS6077435A/ja
Publication of JPH0312478B2 publication Critical patent/JPH0312478B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58185349A 1983-10-04 1983-10-04 ワイヤボンディング方法 Granted JPS6077435A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58185349A JPS6077435A (ja) 1983-10-04 1983-10-04 ワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58185349A JPS6077435A (ja) 1983-10-04 1983-10-04 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPS6077435A true JPS6077435A (ja) 1985-05-02
JPH0312478B2 JPH0312478B2 (de) 1991-02-20

Family

ID=16169230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58185349A Granted JPS6077435A (ja) 1983-10-04 1983-10-04 ワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JPS6077435A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1068144C (zh) * 1995-10-05 2001-07-04 旭电机株式会社 楔型拉线夹板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153400A (en) * 1979-04-25 1980-11-29 Fujitsu Ltd Hand wire bonding machine
JPS5642114A (en) * 1979-09-14 1981-04-20 Chugoku Electric Power Co Ltd:The Detection method for loose parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55153400A (en) * 1979-04-25 1980-11-29 Fujitsu Ltd Hand wire bonding machine
JPS5642114A (en) * 1979-09-14 1981-04-20 Chugoku Electric Power Co Ltd:The Detection method for loose parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1068144C (zh) * 1995-10-05 2001-07-04 旭电机株式会社 楔型拉线夹板

Also Published As

Publication number Publication date
JPH0312478B2 (de) 1991-02-20

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