JPS55153400A - Hand wire bonding machine - Google Patents

Hand wire bonding machine

Info

Publication number
JPS55153400A
JPS55153400A JP5123979A JP5123979A JPS55153400A JP S55153400 A JPS55153400 A JP S55153400A JP 5123979 A JP5123979 A JP 5123979A JP 5123979 A JP5123979 A JP 5123979A JP S55153400 A JPS55153400 A JP S55153400A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding machine
hand wire
hand
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5123979A
Other languages
Japanese (ja)
Inventor
Toshihiro Sakamura
Hideji Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5123979A priority Critical patent/JPS55153400A/en
Publication of JPS55153400A publication Critical patent/JPS55153400A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP5123979A 1979-04-25 1979-04-25 Hand wire bonding machine Pending JPS55153400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5123979A JPS55153400A (en) 1979-04-25 1979-04-25 Hand wire bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5123979A JPS55153400A (en) 1979-04-25 1979-04-25 Hand wire bonding machine

Publications (1)

Publication Number Publication Date
JPS55153400A true JPS55153400A (en) 1980-11-29

Family

ID=12881383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5123979A Pending JPS55153400A (en) 1979-04-25 1979-04-25 Hand wire bonding machine

Country Status (1)

Country Link
JP (1) JPS55153400A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077435A (en) * 1983-10-04 1985-05-02 Fuji Xerox Co Ltd Disconnection correcting method of wiring pattern
JPS60113700U (en) * 1984-11-22 1985-08-01 富士通株式会社 hand wire bonder
US4754086A (en) * 1982-12-22 1988-06-28 Ihara Chemical Industry Co., Ltd. Process for preparation of nuclear halides of monoalkylbenzenes

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754086A (en) * 1982-12-22 1988-06-28 Ihara Chemical Industry Co., Ltd. Process for preparation of nuclear halides of monoalkylbenzenes
JPS6077435A (en) * 1983-10-04 1985-05-02 Fuji Xerox Co Ltd Disconnection correcting method of wiring pattern
JPH0312478B2 (en) * 1983-10-04 1991-02-20 Fuji Xerox Co Ltd
JPS60113700U (en) * 1984-11-22 1985-08-01 富士通株式会社 hand wire bonder
JPS6311751Y2 (en) * 1984-11-22 1988-04-05

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