JPS6073238U - ワイヤボンデイング用キヤピラリ - Google Patents

ワイヤボンデイング用キヤピラリ

Info

Publication number
JPS6073238U
JPS6073238U JP1983165393U JP16539383U JPS6073238U JP S6073238 U JPS6073238 U JP S6073238U JP 1983165393 U JP1983165393 U JP 1983165393U JP 16539383 U JP16539383 U JP 16539383U JP S6073238 U JPS6073238 U JP S6073238U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
bonding
semiconductor element
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983165393U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241864Y2 (enrdf_load_stackoverflow
Inventor
博之 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1983165393U priority Critical patent/JPS6073238U/ja
Publication of JPS6073238U publication Critical patent/JPS6073238U/ja
Application granted granted Critical
Publication of JPH0241864Y2 publication Critical patent/JPH0241864Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1983165393U 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ Granted JPS6073238U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983165393U JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983165393U JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Publications (2)

Publication Number Publication Date
JPS6073238U true JPS6073238U (ja) 1985-05-23
JPH0241864Y2 JPH0241864Y2 (enrdf_load_stackoverflow) 1990-11-08

Family

ID=30362367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983165393U Granted JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Country Status (1)

Country Link
JP (1) JPS6073238U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007504648A (ja) * 2003-08-29 2007-03-01 フリースケール セミコンダクター インコーポレイテッド 絶縁ワイヤのワイヤボンディング及びワイヤボンディングに用いるキャピラリ

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BONDING HANDBOOK=1979 *
MICRO-SWISSubh|-þbþ *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007504648A (ja) * 2003-08-29 2007-03-01 フリースケール セミコンダクター インコーポレイテッド 絶縁ワイヤのワイヤボンディング及びワイヤボンディングに用いるキャピラリ

Also Published As

Publication number Publication date
JPH0241864Y2 (enrdf_load_stackoverflow) 1990-11-08

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