JPS6073232U - ウエハロ−デング装置 - Google Patents
ウエハロ−デング装置Info
- Publication number
- JPS6073232U JPS6073232U JP16426483U JP16426483U JPS6073232U JP S6073232 U JPS6073232 U JP S6073232U JP 16426483 U JP16426483 U JP 16426483U JP 16426483 U JP16426483 U JP 16426483U JP S6073232 U JPS6073232 U JP S6073232U
- Authority
- JP
- Japan
- Prior art keywords
- wafer loading
- wafer
- arm
- loading equipment
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16426483U JPS6073232U (ja) | 1983-10-24 | 1983-10-24 | ウエハロ−デング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16426483U JPS6073232U (ja) | 1983-10-24 | 1983-10-24 | ウエハロ−デング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073232U true JPS6073232U (ja) | 1985-05-23 |
| JPH043496Y2 JPH043496Y2 (enrdf_load_html_response) | 1992-02-04 |
Family
ID=30360179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16426483U Granted JPS6073232U (ja) | 1983-10-24 | 1983-10-24 | ウエハロ−デング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073232U (enrdf_load_html_response) |
-
1983
- 1983-10-24 JP JP16426483U patent/JPS6073232U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH043496Y2 (enrdf_load_html_response) | 1992-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003519932A (ja) | 真空処理装置 | |
| JPS6073232U (ja) | ウエハロ−デング装置 | |
| JPH08162288A (ja) | 高周波プラズマ装置 | |
| JP3211468B2 (ja) | 現像装置及び現像方法 | |
| JPH0258331U (enrdf_load_html_response) | ||
| JPS6013740U (ja) | 試料保持装置 | |
| JPS5812941U (ja) | 気相成長装置用サセプタ | |
| TW571359B (en) | Processing method for substrate | |
| JPS59185828U (ja) | 半導体製造装置 | |
| JPS6016535U (ja) | 気相成長装置 | |
| JP2000021798A (ja) | 基板処理装置 | |
| JPH10147875A (ja) | 加熱処理装置 | |
| JPH0468522U (enrdf_load_html_response) | ||
| JPS61194726A (ja) | プラズマ処理装置 | |
| JPS6228875U (enrdf_load_html_response) | ||
| JPS6075460U (ja) | プラズマ気相成長装置 | |
| JPH1048843A (ja) | 処理装置 | |
| JP2566818Y2 (ja) | ボンディング装置 | |
| JPS6025750U (ja) | 気相成長装置 | |
| JPS6255564U (enrdf_load_html_response) | ||
| JPH1116987A (ja) | ウェハー処理装置 | |
| JPS6350127U (enrdf_load_html_response) | ||
| JPS599084U (ja) | 化学的気相成長装置 | |
| JPH03291923A (ja) | プラズマエッチング装置 | |
| JPS6086555U (ja) | プラズマcvd装置 |