JPS6072249A - 集積回路の製造方法 - Google Patents

集積回路の製造方法

Info

Publication number
JPS6072249A
JPS6072249A JP58179602A JP17960283A JPS6072249A JP S6072249 A JPS6072249 A JP S6072249A JP 58179602 A JP58179602 A JP 58179602A JP 17960283 A JP17960283 A JP 17960283A JP S6072249 A JPS6072249 A JP S6072249A
Authority
JP
Japan
Prior art keywords
film
bump
polyimide
metal
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58179602A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349378B2 (OSRAM
Inventor
Katsuhiko Yabe
矢部 勝彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58179602A priority Critical patent/JPS6072249A/ja
Publication of JPS6072249A publication Critical patent/JPS6072249A/ja
Publication of JPS6349378B2 publication Critical patent/JPS6349378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/012
    • H10W72/251

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58179602A 1983-09-28 1983-09-28 集積回路の製造方法 Granted JPS6072249A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58179602A JPS6072249A (ja) 1983-09-28 1983-09-28 集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58179602A JPS6072249A (ja) 1983-09-28 1983-09-28 集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS6072249A true JPS6072249A (ja) 1985-04-24
JPS6349378B2 JPS6349378B2 (OSRAM) 1988-10-04

Family

ID=16068609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58179602A Granted JPS6072249A (ja) 1983-09-28 1983-09-28 集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS6072249A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166542A (ja) * 1987-12-22 1989-06-30 Fujitsu Ltd 半導体装置の製造方法
US7596855B2 (en) * 2001-06-20 2009-10-06 Sae Magnetics (H.K.) Ltd. Method for manufacturing a magnetic head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166542A (ja) * 1987-12-22 1989-06-30 Fujitsu Ltd 半導体装置の製造方法
US7596855B2 (en) * 2001-06-20 2009-10-06 Sae Magnetics (H.K.) Ltd. Method for manufacturing a magnetic head

Also Published As

Publication number Publication date
JPS6349378B2 (OSRAM) 1988-10-04

Similar Documents

Publication Publication Date Title
US4272561A (en) Hybrid process for SBD metallurgies
US4451554A (en) Method of forming thin-film pattern
US3649392A (en) Thin-film circuit formation
JPS6072249A (ja) 集積回路の製造方法
JPH02253628A (ja) 半導体装置の製造方法
JPH02224336A (ja) 半導体装置の製造方法
JPS6083350A (ja) 集積回路の製造方法
JPH07212045A (ja) 電子部品及びその製造方法
JPH06342796A (ja) 突起電極の形成方法
JPS6336548A (ja) 半導体装置及びその製造方法
JPS61141158A (ja) バンプ電極形成方法
JPH04180231A (ja) 微細バンプ電極を有する半導体装置の製造方法
JPS58161346A (ja) 金属突起電極の形成方法
JPS5864616A (ja) 薄膜磁気ヘツドの製造方法
JP4025470B2 (ja) 磁気ヘッド用フレクシャーブランクの製造法
JPH03110835A (ja) 半導体装置の製造方法
JPS604221A (ja) 半導体装置の製造方法
JPS63119551A (ja) パタ−ニングされた金属膜の形成方法
JPS5978586A (ja) Nbのパタ−ン形成法
JP3404293B2 (ja) 圧電素子の製造方法
JPS5911647A (ja) 半導体装置の製造方法
JPS6070747A (ja) 半導体装置の製造方法
JPS6019661B2 (ja) 電極形成法
JP2820008B2 (ja) 半導体装置の膜厚モニタ構造及びモニタ方法
JPH04350940A (ja) 半導体装置の製造方法