JPS607163A - ボンデイングワイヤの製造方法 - Google Patents

ボンデイングワイヤの製造方法

Info

Publication number
JPS607163A
JPS607163A JP58114974A JP11497483A JPS607163A JP S607163 A JPS607163 A JP S607163A JP 58114974 A JP58114974 A JP 58114974A JP 11497483 A JP11497483 A JP 11497483A JP S607163 A JPS607163 A JP S607163A
Authority
JP
Japan
Prior art keywords
wire
strength
bonding
temperature
elongation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58114974A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04386B2 (enExample
Inventor
Kenichi Sato
謙一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58114974A priority Critical patent/JPS607163A/ja
Publication of JPS607163A publication Critical patent/JPS607163A/ja
Publication of JPH04386B2 publication Critical patent/JPH04386B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/5524—
    • H10W72/884—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP58114974A 1983-06-24 1983-06-24 ボンデイングワイヤの製造方法 Granted JPS607163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58114974A JPS607163A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58114974A JPS607163A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤの製造方法

Publications (2)

Publication Number Publication Date
JPS607163A true JPS607163A (ja) 1985-01-14
JPH04386B2 JPH04386B2 (enExample) 1992-01-07

Family

ID=14651231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58114974A Granted JPS607163A (ja) 1983-06-24 1983-06-24 ボンデイングワイヤの製造方法

Country Status (1)

Country Link
JP (1) JPS607163A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100873758B1 (ko) * 2001-02-19 2008-12-15 스미토모 긴조쿠 고잔 가부시키가이샤 본딩 와이어
JP2017039979A (ja) * 2015-08-20 2017-02-23 Ｋｍアルミニウム株式会社 アルミニウム合金

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101149066B1 (ko) * 2009-12-11 2012-05-24 한국세라믹기술원 포름알데히드 분해용 수열합성 패널의 제조방법 및 그로부터 제조된 패널

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100873758B1 (ko) * 2001-02-19 2008-12-15 스미토모 긴조쿠 고잔 가부시키가이샤 본딩 와이어
JP2017039979A (ja) * 2015-08-20 2017-02-23 Ｋｍアルミニウム株式会社 アルミニウム合金

Also Published As

Publication number Publication date
JPH04386B2 (enExample) 1992-01-07

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