JPS6069651A - Peeling development method - Google Patents

Abstract

PURPOSE:To facilitate peeling development by using one end part of an image forming material interposing an antitack tape to use it as a peel starting end, and peeling the exposed material from a base. CONSTITUTION:When an image forming material 7 is applied to a base 1, an antitacky tape winding roll 9 is set to the end part of the material 7, and it is unwound in accordance with the application movement to obtain the base 1 having the tape 10 attached to the end of the material 7, and at that time, the tape 10 is set so as to exceed the end of the material 7 by a little. Since the end of the material 7 does not adhere to the base 1 by the presence of the tape 10, peeling development is carried out easily without any failure. Since the tape 10 is interposed at the same time as the application step on the material 7 to the base 1, the operation can not be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a peeling and developing method used for manufacturing printed circuits and the like.

For the production of printed circuits, etc., the photopolymerizable composition layer side of an image forming material consisting of a transparent support and a photopolymerizable composition layer deposited on the support on the surface of an image forming substrate. This photopolymerizable composition layer is imagewise exposed to form a cured area, and if necessary, the image forming material is heated, and then the support is peeled off from the substrate. Imaging means have already been devised for forming image-like resists on substrates.

Generally, the above-mentioned support is peeled off by adhering a tape-shaped peeling end piece protruding from the substrate to one end of the above-mentioned support on the substrate after exposure, and then using a peeling means such as a ninpro roll or a suction roll. This is done by inserting the peeled end pieces and rolling up the support.

However, according to the above peeling method, it is necessary to separately provide a peeling end piece after exposure, which forces an increase in the number of steps.

On the other hand, as a method in which peeling and development can be performed directly after exposure, the present inventors have disclosed in Japanese Patent Application No. 170288/1988 that after adhering an image forming material onto a substrate, for example, prior to image exposure, at least one of the following methods is used: Exposed areas are provided at five corners to weaken the adhesive force to the image forming material side, and the support is separated from the substrate from a corner part of the substrate and peeled off using an adhesive tape or an adhesive roll. I suggest developing it.

However, in this method, since the photocured photopolymerizable composition layer is attached to the peripheral area of the developed substrate,
During the process of handling this substrate, the photopolymerizable composition layer may be chipped and the pieces may adhere to the inside of the substrate, which may cause defects in the etching or plating process.

In addition, as disclosed in Japanese Patent Application No. 58-57107, the inventors previously attached adhesive tape with low adhesive strength to a part of the corner of the substrate, and then attached an image forming material to the second corner of the substrate. They have also devised a method that allows them to be easily peeled off by applying it. However, with this method, even if the adhesive tape has a weak adhesive strength, the part that initially triggers peeling is adhered to the substrate, so peeling cannot always be achieved smoothly.

As a result of intensive study, this invention has been completed.

That is, in attaching an image-forming material to a substrate, the present invention laminates only the edges of the image-forming material onto the substrate via a non-adhesive tape and does not adhere the edges of the image-forming material to the substrate. This area is intended to facilitate peeling m1 of the unexposed portion from the support after image exposure.

As the non-adhesive tape used in this invention, plastic film, paper, metal foil, etc. are used. It is desirable for these materials to be as thin as possible.That is, after laminating the image forming material on a substrate, when exposing the image forming material with a photomask in close contact with the image forming material, This is because a difference in level occurs between the end where the non-adhesive tape is interposed and other parts, and if this step is large, the adhesion of the photomask will be impaired in the vicinity of the end. Therefore, the thickness of the non-adhesive tape is usually preferably 25 pmm or less, and the width of the non-adhesive tape is set from 5 to 10 mm from the viewpoint of workability.
About t is preferable.

Next, an example of a method of interposing the above-mentioned non-adhesive tape at the end of the image forming material and attaching it to the substrate will be explained.

Generally, such imaging materials are applied to a substrate in the manner shown in FIG. In the figure, 1 is an image forming substrate conveyed in the direction of arrow a, 2 is an image forming material supply roll, 3 is a protective film winding roll, 4 is a protective film peeling roll, and 5 is a rolling contact roll. Reference numeral 6 denotes a band-shaped body consisting of an image forming material 7 and a protective film 8 for protecting it. - the strip 6 is unwound from the supply roll 2;

In the unwinding path, the protective film 8 is peeled off from the image-forming material 7 by the peeling roll 4 and is wound onto the winding roll 3 . On the other hand, the image forming material 7 is adhered to the main surface of the substrate 1 by a rolling contact roll 5.

When the image forming material 7 is attached to the substrate 1, the non-adhesive tape winding roll 9 may be positioned and set to match the edge of the image forming material 7 as shown in FIG. In this state, if the non-adhesive tape 10 is sequentially brought out from the non-adhesive tape winding roll 9 in accordance with the operation of adhering the image-forming material 7 to the substrate 1, the image-forming material 7 can be attached to the substrate 1. A substrate 1 can be obtained with a non-adhesive tape IO attached to the edge of the imaging material 7. In this case, it is important to set the non-adhesive tape 10 so that it slightly protrudes from the edge of the image forming material 7.

After the image forming material 7 is adhered to the main surface of the substrate 1 as described above, image exposure is performed. After that, peeling may be started from the end of the image forming material 7 using an adhesive tape or an adhesive roll.

Here, since the ends of the image forming material 7 are not adhered to the substrate 1 by the non-adhesive tape 10, the peeling development described in - can be easily performed without failure. In particular, since the non-adhesive tape 10 can be interposed at the same time in the step of attaching the image forming material 7 to the substrate 1, there is no need for an increase in the number of work steps.

Next, this invention will be explained in detail.

Example When an image forming material (Neoronk E manufactured by Nitto Electric Works Co., Ltd.) was attached to a copper-clad laminate, a polyester film having a thickness of 16 μm and a width of 10 layers was interposed at the edge of the image forming material.

Next, a wiring pattern for a printed wiring board was exposed to light through a photomask on the image forming material described in 1. After this exposure, development was carried out by attaching an adhesive tape to a part of the corner of the substrate, including the edge where the polyester film of the image forming material was interposed, and peeling off the adhesive tape from the substrate. , 1. The image forming material was easily peeled off and the development process was completed. Moreover, the pattern located at a distance of about 1 m from the area where the polyester film was interposed was also a clear image.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a method of attaching an image forming material to a substrate;
FIG. 2 is an explanatory diagram when an image forming material applied to the peeling and developing method according to the present invention is attached to a substrate. ]... Image forming substrate, 7... Image forming material, IO
...Non-adhesive tape. Patent applicant Nitto Electric Industry Co., Ltd.

Claims (1)

[Claims] +1+ An image forming material in which a photopolymerizable composition layer is coated on a transparent support is adhered to the surface of the substrate on which an image is to be formed, and then exposed to light. In a peeling development method in which an image is formed by peeling off the substrate along with the non-exposed area, the image forming material is attached to the main surface of the substrate with a non-adhesive tape interposed at an edge along at least one side of the substrate. . A peeling development method, characterized in that, after exposure, the support is peeled from the substrate using the non-adhesive tape intervening end as a peeling start end.