JPS59143151A - Stripping development method - Google Patents

Abstract

PURPOSE:To facilitate continuous stripping of a support or the like from a substrate after the end of exposure and to obtain a sharp image by applying an adhesive tape having a releasable rear face at the corners of the substrate in advance before applying an image forming material on the substrate. CONSTITUTION:An image forming material formed by applying a photopolymerizable compsn. layer to a transparent support is adhered to the surface of an image forming substrate 1, then exposed, and the support and the unexposed parts of the photopolymerizable compsn. layer is stripped from the substrate. In this stripping development method, before the image forming material is applied to the substrate 1, adhesive tapes S1-S4, S9 each having a rear face releasable from said photopolymerizable compsn. layer are applied to the 2 or more sides of the substrate 1 and the corners including their intersections. As the adhesive tape, an adhesive tape having a rear face coated with a silicone resin, laminated with a PE film, etc. are usable.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a peeling and developing method used for manufacturing printed circuits and the like.

For the production of printed circuits, etc., the above-mentioned photopolymerizable composition layer side of an image-forming material consisting of a transparent support and a photopolymerizable composition layer formed with wavy lines on the support is placed on the surface of an image-forming substrate. The photopolymerizable composition layer is imagewise exposed to light to form a cured area, and if necessary, the image forming material is heated. Imaging means have already been devised for peeling exposed portions from a substrate to form an image-like resist on the substrate.

In this image forming means, the photopolymerizable composition layer in the image forming material has a strong adhesive force to the transparent support in an unexposed state, but when exposed to light, the adhesive force to the substrate increases and the adhesive force to the transparent support increases. This takes advantage of the fact that power decreases.

However, since this photopolymerizable composition layer has considerable adhesion to the substrate even in an unexposed state, various methods have been devised for peeling it off after image formation.

For example, after the end of exposure, a tape-shaped peelable end piece protruding from the substrate is adhered to one end of the transparent support on the substrate, and then the peelable end piece is sandwiched between a peeling means such as a nip roll or a suction roll. There is a method of peeling off by rolling the unexposed portions of the support and the photopolymerizable composition layer. However, according to this peeling method, it is necessary to separately provide a peeling end piece after exposure, which increases the number of steps, and it is difficult to reliably hold the peelable end piece mechanically. There were some drawbacks such as failure to peel it off.

Further, other peeling methods have been unsatisfactory due to problems in terms of economy and reliability.

Therefore, the present inventors have developed a peeling development method that allows economical, easy, and continuous peeling of the support from the substrate without providing a peelable end piece on the transparent support after the completion of exposure to obtain a clear image. This invention was made with the aim of providing the following.

That is, this invention provides an image forming material in which a photopolymerizable composition layer is adhered to a transparent support on the surface of an image forming substrate, and then exposed to light. In a peel development method in which an unexposed portion of the polymerizable composition layer is peeled off from the substrate, before the image-forming material is attached to the substrate, a back surface is coated on a corner including at least two sides of the substrate and the intersection thereof. The present invention relates to a peeling development method characterized in that an adhesive tape having releasability is attached to the photopolymerizable composition layer.

In this invention, as described above, an adhesive tape having releasability for the photopolymerizable composition layer is pasted in advance on at least two sides of the image forming substrate and one corner including the intersection of these sides on the back side or the photopolymerizable composition layer. Therefore, when peeling the support etc. from this substrate after exposure, the adhesive strength of the photopolymerizable composition layer to the back side of this adhesive tape is low, so this part peels off very easily, and this may cause the adhesive tape to peel off easily. The remaining supports such as the second substrate can also be easily peeled off.

In the present invention, adhesive tapes whose back surface has releasability to the photopolymerizable composition layer include those whose back surface is coated with a silicone resin and those whose back surface is laminated with a polyethylene film.

Such adhesive tape needs to be attached to a corner including two sides of the board and the intersection thereof, for example, as shown in numbers 31 to S4 shown in Figure 1, and as shown in numbers 55 to S8 shown in Figure 2. If the two sides of the substrate and their intersections are not included, peeling is not easy. Alternatively, this adhesive tape may be attached to the periphery of the substrate as shown in S9 in FIG. 3.

If an adhesive tape is provided on the substrate as described above, in order to peel off the support and the unexposed portion of the photopolymerizable composition layer after exposure, it is usually necessary to apply adhesive tape on the surface of the support in the area where the adhesive tape is provided. Press and wrap adhesive tape used for peeling.
The support and the like are peeled off from the substrate by either pressing an adhesive roll or rotating the roll, and peeling development is performed while rolling the peeled support and the like with a nip roll.

By the above method, when the support etc. are peeled off from the substrate after exposure, the support etc. can be easily peeled off by conventional means such as adhesive tape without forming a peeled edge piece for each substrate. It will be possible.

Furthermore, by preparing a continuous adhesive tape, peeling development can be performed continuously. Moreover, such a continuous adhesive tape can also be used at a very low cost, making it highly economical. Furthermore, according to this method, the reliability of peel development can also be improved.

Next, examples of this invention will be described.

Example 1 As shown in FIG. 1, one corner of an image forming substrate 1 of size 300 rrvn x 300 was laminated with polyethylene on the back side and then treated with silicon.
A craft adhesive tape St (!712, manufactured by Nitto Electric Industries, Ltd.) was pasted, and then a peelable development type dry film resist (Neodorock type T10, manufactured by Tokyo Electric Industries, Ltd.) was pasted on this substrate 1 and exposed. After forming a waist image, a craft adhesive tape (mentioned above) is pressed onto the surface of the dry film resist as shown by the dashed line 2, and as this tape is rolled up, the support of the dry film resist and the blank are bonded. The exposed photopolymerizable composition layer was easily peeled off, and a good image could be obtained on the substrate 1.

Example 2 As shown in FIG. 1, a 5 mm x 20 m kraft adhesive tape S2 treated in the same manner as in Example 1 was attached to one corner of the substrate 1, and a good image was formed on the substrate 1 in the same manner as in Example 1. I got it.

Example 3 As shown in FIG. 1, a 10mm x 10+Nrl craft adhesive tape S3 treated in the same manner as in Example 1 was attached to one corner of the substrate 1, and a good image was formed on the substrate 1 in the same manner as in Example 1. I got it.

Example 4 As shown in FIG. 1, a 10 mm x 10++a craft adhesive tape S4 treated in the same manner as in Example 1 was attached to one corner of the substrate 1, and a good image was formed on the substrate 1 in the same manner as in Example 1. I got it.

Comparative Example A peelable development type dry film resist (described above) was attached to an image forming substrate similar to that used in the example, and exposed to light.A kraft adhesive tape for peeling was then crimped in the same manner as in the example, and the tape was rolled up. In some cases (7 out of 10 times), the unexposed photopolymerizable composition layer of the dry film resist remained on the substrate.

[Brief explanation of drawings]

FIGS. 1 and 3 are explanatory diagrams of a method for attaching a back-treated adhesive tape in the peeling and developing method according to the present invention. FIG. 2 is an explanatory diagram for comparison with the pasting method. 1...Substrate, Sl-~S9...Adhesive tape Patent applicant Nitto Electric Industry Co., Ltd.\No.1 z\Fig.2

Claims (1)

[Claims] (1) After attaching an image forming material in which a photopolymerizable composition layer is coated on a transparent support to the surface of an image forming substrate and exposing it to light, the support and the photopolymerizable composition layer are attached to the surface of the image forming substrate. In the peeling development method of peeling off the unexposed portion of the substrate from the substrate, before adhering the image forming material to the substrate, a corner including at least two sides of the substrate and the intersection thereof,
A peeling development method characterized in that an adhesive tape whose back surface has releasability to the photopolymerizable composition layer is attached.