JPS6488536A - Dry film photoresist and manufacture thereof - Google Patents

Dry film photoresist and manufacture thereof

Info

Publication number
JPS6488536A
JPS6488536A JP18858888A JP18858888A JPS6488536A JP S6488536 A JPS6488536 A JP S6488536A JP 18858888 A JP18858888 A JP 18858888A JP 18858888 A JP18858888 A JP 18858888A JP S6488536 A JPS6488536 A JP S6488536A
Authority
JP
Japan
Prior art keywords
film
photopolymerizable layer
photoresist
coating film
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18858888A
Other languages
Japanese (ja)
Inventor
Kiyaruhoun Fuaifuii Chiyaaruzu
Jiyozefu Rouchi Donarudo
Guren Shiyaaku Sukotsuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hercules LLC
Original Assignee
Hercules LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hercules LLC filed Critical Hercules LLC
Publication of JPS6488536A publication Critical patent/JPS6488536A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE: To obtain a dry film photoresist suitable for use in production of printed circuit boards by adhering a photopolymerizable layer more strongly with a coating film than a supporting film and bringing the supporting to the inner side of a roll. CONSTITUTION: This method comprises consisting of the laminated photopolymerizable layer 7 between the two polymer films, depositing the unexposed photopolymerizable layer 7 on the flexible supporting film 6, laminating the flexible coating film 8 on the photopolymerizable layer 7 and winding the photoresist for producing the finished roll. The coating film 8 is subjected to a surface treatment in order to surely adhere the photopolymerizable layer 7. The photoresist is so wound that the coating film 8 comes to the outer side and the supporting film 6 to the inner side. The supporting film 6 is discarded in the stage of the later lamination and the film with which the photopolymerizable layer 7 is exposed through the film is obtd. after the stage the coating film 8 is laminated. The dry film photoresist improved in such a manner is conveniently usable in the production of the printed circuit boards, etc., for which the photoresist having the high quality and high resolution is required.
JP18858888A 1987-07-30 1988-07-29 Dry film photoresist and manufacture thereof Pending JPS6488536A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7963087A 1987-07-30 1987-07-30

Publications (1)

Publication Number Publication Date
JPS6488536A true JPS6488536A (en) 1989-04-03

Family

ID=22151771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18858888A Pending JPS6488536A (en) 1987-07-30 1988-07-29 Dry film photoresist and manufacture thereof

Country Status (2)

Country Link
JP (1) JPS6488536A (en)
DE (1) DE3825782A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450852A (en) * 1990-06-14 1992-02-19 Hitachi Chem Co Ltd Photosensitive film and forming method for solder mask using its film

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19711696C1 (en) * 1997-03-20 1998-11-12 Basf Drucksysteme Gmbh Process for producing a photopolymerizable recording material
MY120763A (en) * 1997-09-19 2005-11-30 Hitachi Chemical Co Ltd Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer
FR2803246B1 (en) * 1999-12-31 2002-11-29 Rollin Sa PRINTING PLATE ON ROLL AND PROCESS FOR OBTAINING

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0450852A (en) * 1990-06-14 1992-02-19 Hitachi Chem Co Ltd Photosensitive film and forming method for solder mask using its film

Also Published As

Publication number Publication date
DE3825782A1 (en) 1989-02-09

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