JPH0198291A - Electrically conductive circuit transfer foil and manufacture thereof - Google Patents
Electrically conductive circuit transfer foil and manufacture thereofInfo
- Publication number
- JPH0198291A JPH0198291A JP25575987A JP25575987A JPH0198291A JP H0198291 A JPH0198291 A JP H0198291A JP 25575987 A JP25575987 A JP 25575987A JP 25575987 A JP25575987 A JP 25575987A JP H0198291 A JPH0198291 A JP H0198291A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper foil
- transfer
- adhesive layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000010410 layer Substances 0.000 claims abstract description 94
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 43
- 239000012790 adhesive layer Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims description 18
- 238000005476 soldering Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000004925 Acrylic resin Substances 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000012792 core layer Substances 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 5
- 239000004645 polyester resin Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、転写により被転写材料に導電性回路を形成さ
せるための導電性回路転写箔、殊に、微細なパターン加
工が可能でかつ良好なハンダ適性を有する転写箔に関す
るものである。また、そのような転写箔を製造する方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a conductive circuit transfer foil for forming a conductive circuit on a material to be transferred by transfer, particularly a conductive circuit transfer foil that can be processed into a fine pattern and has good solderability. This invention relates to a suitable transfer foil. The present invention also relates to a method of manufacturing such a transfer foil.
従来の技術
プリント配線板を得る方法の一つとして、転写により被
転写材料に導電性回路を形成する方法が考えられる。BACKGROUND ART One possible method for obtaining a printed wiring board is to form a conductive circuit on a material to be transferred by transfer.
この目的の導電性回路転写箔として、基材フィルム」二
に易剥離性層を形成し、その易剥離性層面に導電性ペー
ストによる所定のパターンの回路印刷層を設け、さらに
その上から被転写材料への貼合のための接着剤層を設け
る方法が検討されている。As a conductive circuit transfer foil for this purpose, an easily peelable layer is formed on the base film 2, a circuit printing layer with a predetermined pattern made of conductive paste is provided on the surface of the easily peelable layer, and then the transfer target is placed on top of that. A method of providing an adhesive layer for bonding to materials is being considered.
発明が解決しようとする問題点
しかしながら、上記の方法により製造した導電性回路転
写箔は、導電性ペーストを用いているため、被転写材料
に転写した際のハンダ適性が劣り、ＩＣチップ等の実装
には不適当であるという制約があった。また必要とする
導電性を得るためには、導電性ペースト印刷層を厚塗り
する必要があり、その結果極めて微細なパターン印刷は
困難であるという問題点がある。Problems to be Solved by the Invention However, since the conductive circuit transfer foil manufactured by the above method uses a conductive paste, it has poor solderability when transferred to a transfer material, and is difficult to mount IC chips, etc. There were restrictions that made it inappropriate. In addition, in order to obtain the required conductivity, it is necessary to apply a thick layer of printed conductive paste, and as a result, there is a problem in that it is difficult to print extremely fine patterns.
本発明は、このような状況に鑑み、ハンダ適性を有しか
つ微細なパターン加工が可能である導電性回路転写箔を
提供することを目的とするものである。In view of these circumstances, the present invention aims to provide a conductive circuit transfer foil that has solderability and can be processed into fine patterns.
問題点を解決するための手段
本発明の導電性回路転写箔は、基材フィルム（１）／易
剥離性層（１ａ）／銅箔貼合用接着剤層（３）／所定の
回路パターンにエツチング処理された銅箔（４）／転写
用接着剤層（７）がこの順に積層した構成を有するもの
である。Means for Solving the Problems The conductive circuit transfer foil of the present invention consists of a base film (1)/an easily peelable layer (1a)/an adhesive layer for bonding copper foil (3)/a predetermined circuit pattern. The etched copper foil (4)/transfer adhesive layer (7) is laminated in this order.
この場合、易剥離性層（１ａ）と銅箔貼合用接着剤層（
３）との間に、ハンダ付け孔（２ａ）を有する第一絶縁
層（２）を介在させることができ、また．エッチング処
理された銅箔（４）と転写用接着剤層（７）との間に、
第二絶縁層（６）を介在させることができる。第一絶縁
層（２）と第二絶縁層（６）との双方を設置してもよい
。In this case, the easily peelable layer (1a) and the copper foil laminating adhesive layer (
A first insulating layer (2) having a soldering hole (2a) can be interposed between the first insulating layer (2) and the first insulating layer (2). Between the etched copper foil (4) and the transfer adhesive layer (7),
A second insulating layer (6) can be interposed. Both the first insulating layer (2) and the second insulating layer (6) may be provided.
基材フィルム（１）としては、ポリエステルフィルム、
ポリイミドフィルム、ポリイミドアミドフィルム、ポリ
プロピレンフィルム、ポリアミドフィルム、ポリカーボ
ネートフィルム、ガラスエポキシフィルム（ガラスクロ
スに変性エポキシ樹脂を含浸硬化させたもの）、ボリア
ミド不織布にエポキシ樹脂を含浸硬化させたもの、アラ
ミドペーハー、フッ素系樹脂フィルム、セルロース系フ
ィルムなどが用いられる。熱可塑性プラスチックスフィ
ルムの場合は１寸法安定性の点から、二軸延伸フィルム
を用いることが多い。As the base film (1), polyester film,
Polyimide film, polyimide amide film, polypropylene film, polyamide film, polycarbonate film, glass epoxy film (glass cloth impregnated with modified epoxy resin and cured), polyamide nonwoven fabric impregnated with epoxy resin and cured, aramid pH, fluorine A resin film, a cellulose film, etc. are used. In the case of thermoplastic films, biaxially stretched films are often used from the viewpoint of one-dimensional stability.
基材フィルム（１）の層厚は、所望の強度を有する限り
限定はないが、約１２ ｇｔａ以上、望ましくは１５〜
１１００ｐ程度のものを用いることが多い。The layer thickness of the base film (1) is not limited as long as it has the desired strength, but it is about 12 gta or more, preferably 15 to
A value of about 1100p is often used.
易剥離性層（１ａ）としては、メラミン−アクリル系樹
脂、尿素−メラミン系樹脂、硝化綿−アクリル系樹脂、
セルロース系樹脂、ワックス系、シリコーン系、フッ素
化合物系、長鎖アル゛キル基を有する樹脂などの層が例
示される。The easily peelable layer (1a) includes melamine-acrylic resin, urea-melamine resin, nitrified cotton-acrylic resin,
Examples include layers of cellulose resin, wax, silicone, fluorine compound, and resin having a long chain alkyl group.
易剥離性層（１ａ）は通常基材フィルム（１）上にコー
ティングにより形成され、その層厚は、通常０．５〜５
ｇｍ程度に設定する。なお、フッ素系樹脂フィルムなど
基材フィルム（１）自体が剥離性を有したり、基材フィ
ルム（１）の成形に際し剥離性を有する添加物を配合し
たときは、該基材フィルム（１）の表面が易剥離性層（
１ａ）となるので、易剥離性層（１ａ）を別個に設ける
には及ばない。The easily peelable layer (1a) is usually formed on the base film (1) by coating, and the layer thickness is usually 0.5 to 5.
Set it to about gm. In addition, when the base film (1) itself has releasability, such as a fluororesin film, or when an additive having releasability is added during molding of the base film (1), the base film (1) The surface of is an easily peelable layer (
1a), it is not enough to separately provide the easily peelable layer (1a).
第一絶縁層（２）としては、アクリル系樹脂、ポリエス
テル系樹脂、ポリウレタン系樹脂、エポキシ樹脂をはじ
めとする絶縁性の層があげられ、核層（２）の形成に際
しては、ハンダ付け孔（２ａ）となる露出部分を残すよ
うに留意する。Examples of the first insulating layer (2) include insulating layers such as acrylic resin, polyester resin, polyurethane resin, and epoxy resin. When forming the core layer (2), soldering holes ( Care should be taken to leave an exposed portion as shown in 2a).
核層（２）の層厚は、たとえば０．５〜２０ｇｍ程度に
設定する。この第一絶縁層（２）は任意層であり、省略
することができる。The thickness of the core layer (2) is set, for example, to about 0.5 to 20 gm. This first insulating layer (2) is an optional layer and can be omitted.
銅箔貼合用接着剤層（３）としては、アクリル系接着剤
、ポリエステル系接着剤、ポリウレタン系接着剤などの
層があげられる。核層（３）の層厚は、たとえば０．５
〜５ｇｍ程度に設定する。Examples of the copper foil bonding adhesive layer (3) include layers of acrylic adhesive, polyester adhesive, polyurethane adhesive, and the like. The layer thickness of the nuclear layer (3) is, for example, 0.5
Set it to about ~5gm.
銅箔（４）としては、層厚９〜３５ル層程度の電解銅箔
が好適に用いられる。As the copper foil (4), an electrolytic copper foil having a layer thickness of about 9 to 35 layers is suitably used.
第二絶縁層（６）としては、前述の第一絶縁層（２）と
同様に、アクリル系樹脂、ポリエステル系樹脂、ポリウ
レタン系樹脂、エポキシ樹脂をはじめとする絶縁性の層
があげられる。核層（６）の層厚は、たとえば０．５〜
２０ ｐ、ｍ程度に設定する。この第二絶縁層（６）も
任意層であり、省略することができる。As the second insulating layer (6), insulating layers such as acrylic resin, polyester resin, polyurethane resin, and epoxy resin can be used, similar to the first insulating layer (2) described above. The layer thickness of the core layer (6) is, for example, 0.5~
Set to about 20 p, m. This second insulating layer (6) is also an optional layer and can be omitted.
転写用接着剤層（７）としては、アクリル系、塩化ビニ
ル−酢酸ビニル共重合体系、ポリエステル系、塩素化ポ
リプロピレン系、ポリアミド系をはじめ種々の接着剤が
用いられる。核層（７）の層厚は、通常１〜２０ ｐ−
ｒｓ程度に設定する。As the transfer adhesive layer (7), various adhesives are used including acrylic adhesives, vinyl chloride-vinyl acetate copolymer adhesives, polyester adhesives, chlorinated polypropylene adhesives, and polyamide adhesives. The thickness of the core layer (7) is usually 1 to 20 p-
Set to about rs.
上述の積層構成を有する導電性回路転写箔は、次の工程
を経ることにより製造される。The conductive circuit transfer foil having the above-described laminated structure is manufactured through the following steps.
■ 易剥離性層（１ａ）を設けた基材フィルム（１）の
易剥離処理層（１ａ）面に直接または第一絶縁層（２）
を介して銅箔貼合用接着剤層（３）を設ける工程、
■ 該接着剤層（３）上に銅箔（４）を貼合する工程、
■ 該銅箔（４）の上から回路パターンに対応したエツ
チングレジスト層（５）を設ける工程、■ エツチング
処理を行って、銅箔（４）の回路パターン以外の不要部
分を除去する工程、■ エツチングレジスト層（５）を
除去する工程、
■ 所定の回路パターンにエツチング処理された銅ｆｅ
！１（４）上に直接または第二絶縁層（６）を介して転
写用接着剤層（７）を設ける工程。■ Directly or first insulating layer (2) on the easily peelable layer (1a) surface of the base film (1) provided with the easily peelable layer (1a)
A step of providing an adhesive layer (3) for bonding copper foil through the adhesive layer (3), (2) A step of bonding a copper foil (4) on the adhesive layer (3), (2) A step of attaching a circuit from above the copper foil (4). A step of providing an etching resist layer (5) corresponding to the pattern; ■ A step of performing an etching process to remove unnecessary portions other than the circuit pattern of the copper foil (4); ■ A step of removing the etching resist layer (5); ■ Copper FE etched into a predetermined circuit pattern
! A step of providing a transfer adhesive layer (7) directly or via a second insulating layer (6) on 1(4).
上記■の工程において、第一絶縁層（２）は、スクリー
ン印刷、コーティングなどの方法により易剥離処理層（
１ａ）面に形成される。この場合、ハンダ付け孔（２ａ
）となる露出部分を残すようにする。In the step (2) above, the first insulating layer (2) is formed into an easily peelable layer (2) by a method such as screen printing or coating.
1a) Formed on the surface. In this case, soldering hole (2a
) so as to leave an exposed part.
銅箔貼合用接着剤層（３）は、易剥離処理層（Ｉａ）面
または第一絶縁層（２）上にコーティングにより形成さ
れるが、印刷により形成させることもできる。The copper foil bonding adhesive layer (3) is formed on the easily peelable layer (Ia) surface or the first insulating layer (2) by coating, but it can also be formed by printing.
上記■の工程においては、銅箔貼合用接着剤層（３）上
に適当な手段により銅箔（４）を貼合する。In the step (2) above, the copper foil (4) is laminated on the copper foil lamination adhesive layer (3) by an appropriate means.
上記■の工程においては．エッチングレジスト層（５）
は通常印刷により設けられ、核層（５）の形成に用いら
れる被膜形成樹脂としてはポリエステル系樹脂、アクリ
ル系樹脂、ビニル系樹脂などがあげられる。また核層（
５）は、場合によっては、コーティングやドライフィル
ム貼合により被膜を設け、この被膜を所定の回路パター
ンのマスクを介して露光したのち未露光部を除去するこ
とによっても形成することができる。In the process of ■ above. Etching resist layer (5)
is usually provided by printing, and examples of the film-forming resin used for forming the core layer (5) include polyester resin, acrylic resin, and vinyl resin. Also, the nuclear layer (
5) can also be formed, depending on the case, by providing a film by coating or laminating a dry film, exposing this film to light through a mask with a predetermined circuit pattern, and then removing the unexposed portions.
エツチングレジスト層（５）の層厚は、１〜２０ ｐ−
ｍ程度に設定するのが通常である。The layer thickness of the etching resist layer (5) is 1 to 20 p-
It is normal to set it to about m.
■の工程に従って銅箔（４）の上から回路パターンに対
応したエツチングレジスト層（５）を設けた後、■の工
程において、塩化第二鉄水溶液などのエツチング処理液
を用いてエツチング処理を行うと、銅箔（４）の回路パ
ターン以外の不要部分が除去される。After forming an etching resist layer (5) corresponding to the circuit pattern on the copper foil (4) according to step (2), etching is performed using an etching solution such as ferric chloride aqueous solution in step (2). Then, unnecessary portions of the copper foil (4) other than the circuit pattern are removed.
続いて、■の工程に従い、銅箔（４）エツチングの役割
を果たしたエツチングレジスト層（５）を適当濃度の水
酸化ナトリウム水溶液などのレジストインキ処理液で処
理すると、該エツチングレジスト層（５）が除去される
。Subsequently, in accordance with step (2), the etching resist layer (5) which played the role of etching the copper foil (4) is treated with a resist ink treatment solution such as an aqueous sodium hydroxide solution of an appropriate concentration, and the etching resist layer (5) is removed.
■の工程において、第二絶縁層（６）は、スクリーン印
刷、コーティングなどの方法により易剥離処理層（１ａ
）面に形成される。In the step (2), the second insulating layer (6) is formed by forming the easily peelable layer (1a) by a method such as screen printing or coating.
) is formed on the surface.
転写用接着剤層（７）は、所定の回路パターンにエツチ
ング処理された銅箔（４）上または前述の第二絶縁層（
６）上にコーティングにより形成されるが、印刷により
形成させることもできる。The transfer adhesive layer (7) is placed on the copper foil (4) etched into a predetermined circuit pattern or on the above-mentioned second insulating layer (
6) It is formed by coating on the surface, but it can also be formed by printing.
作 用
上述のように、本発明の導電性回路転写箔は、基材フィ
ルム（１）／易剥離性層（１ａ）／第一絶縁層（２）／
銅箔貼合用接着剤層（３）／所定の回路パターンにエツ
チング処理された銅箔（４）／第二絶縁層（６）／転写
用接着剤層（７）がこの順に積層した構成を有する。こ
のうち第一絶縁層（２）と第二絶縁層（６）は、必要に
応じて設ける任意層である。Function As described above, the conductive circuit transfer foil of the present invention has the following structure: base film (1) / easily peelable layer (1a) / first insulating layer (2) /
A configuration in which copper foil bonding adhesive layer (3) / copper foil etched into a predetermined circuit pattern (4) / second insulating layer (6) / transfer adhesive layer (7) are laminated in this order. have Among these, the first insulating layer (2) and the second insulating layer (6) are optional layers provided as necessary.
このような積層構成を有する導電性回路転写箔の被転写
材料への転写は、成型品に後からホットスタンピングの
要領で転写する方法、成型時に金型内に取り゛付けてお
き、インモールドスタンプの要領で成型と同時に回路を
転写する方法などにより行うことができる。これにより
目的とする回路基板が得られる。The conductive circuit transfer foil having such a laminated structure can be transferred to the material to be transferred, such as by transferring it to the molded product later using hot stamping, or by placing it in the mold at the time of molding and using an in-mold stamp. This can be done by a method of transferring the circuit at the same time as molding in the same manner as described above. As a result, the intended circuit board can be obtained.
実施例 次に実施例をあげて本発明をさらに説明する。Example Next, the present invention will be further explained with reference to Examples.
実施例１
第１図（イ）〜（ハ）は、本発明の導電性回路転写箔の
製造法の一例を示した断面図である。Example 1 FIGS. 1A to 1C are cross-sectional views showing an example of the method for manufacturing a conductive circuit transfer foil of the present invention.
Ｓ材フィルム（１）としての厚さ３０ ＩＬｍの二軸延
伸ボリエ′ステルフィルム上に硝化綿−アクリル系樹脂
の溶剤溶液を塗布し、１１０℃で加熱乾燥して厚さ約Ｉ
ＩＬｍの剥離性層（１ａ）を形成させた。A nitrified cotton-acrylic resin solvent solution was applied onto a biaxially stretched BOLIER'STER film with a thickness of 30 ILm as the S material film (1), and dried by heating at 110°C to a thickness of approximately I.
A peelable layer (1a) of ILm was formed.
この処理層（１ａ）の上に、アクリル系樹脂をビヒクル
とするクリアーなインクを用いて、スクリーン印刷法に
よりハンダ付け孔（２ａ）となる露出部分を残すように
印刷して、厚さ３μｍの第一絶縁層（２）を形成させた
。On top of this treatment layer (1a), using a clear ink with an acrylic resin vehicle, printing was performed using a screen printing method so as to leave exposed parts that would become soldering holes (2a), and a thickness of 3 μm was printed. A first insulating layer (2) was formed.
第一絶縁層（２）上に、ポリエステル系樹脂接着剤溶液
を塗布、乾燥して厚さ２ｇｍの銅箔貼合用接着剤層（３
）を形成させた。A polyester resin adhesive solution is applied on the first insulating layer (2) and dried to form a copper foil bonding adhesive layer (3) with a thickness of 2 gm.
) was formed.
この銅箔貼合用接着剤層（３）の上から、厚さ１８ ｇ
ａ＋の電解銅箔（４）を貼合した。From above this copper foil bonding adhesive layer (3), a thickness of 18 g
A+ electrolytic copper foil (4) was laminated.
この銅箔（４）上に、ポリエステル樹脂を主成分とする
インクを用いて所定の回路パターンをスクリーン印刷法
により印刷し、厚さＬ ＯＩＬｒｒｒのエツチングレジ
スト層（５）を形成させた。On this copper foil (4), a predetermined circuit pattern was printed by screen printing using ink containing polyester resin as a main component to form an etching resist layer (5) having a thickness of L OILrrr.
以上の工程により、第１図（イ）に示した積層物が得ら
れた。Through the above steps, the laminate shown in FIG. 1(a) was obtained.
続いて、塩化第二鉄の５％水溶液を用いてエツチング処
理を行ったところ、銅箔（４）の回路パターン以外の不
要部分が除去された。Subsequently, when etching treatment was performed using a 5% aqueous solution of ferric chloride, unnecessary portions of the copper foil (4) other than the circuit pattern were removed.
エツチングレジスト層（５）を５％水酸化ナトリウム水
溶液を用いて除去した。The etching resist layer (5) was removed using a 5% aqueous sodium hydroxide solution.
これにより、第１図（ロ）に示した積層物が得られた。As a result, the laminate shown in FIG. 1(b) was obtained.
次に、所定の回路パターンにエツチング処理された銅箔
（４）上に、アクリル系樹脂溶液を塗布、乾燥して厚さ
３ｆｉＬｍの第二絶縁層（６）を形成させた。Next, an acrylic resin solution was applied onto the copper foil (4) etched into a predetermined circuit pattern and dried to form a second insulating layer (6) with a thickness of 3 film.
最後に、第二絶縁層（６）上にホットメルトタイプのア
クリル系接着剤溶液を塗布、乾燥し、厚さ３ｇｍの転写
用接着剤層（７）を形成させた。Finally, a hot melt type acrylic adhesive solution was applied onto the second insulating layer (6) and dried to form a transfer adhesive layer (7) with a thickness of 3 gm.
これにより、第１図（ハ）に示したように、目的とする
導電性回路転写箔が得られた。As a result, the desired conductive circuit transfer foil was obtained as shown in FIG. 1(c).
上記で作成した転写箔をホットスタンプまたはインモー
ルド成型転写を行うことにより、微細な回路パターンを
有しかつ良好なＩ＼ンダ適性を有する回路基板を得るこ
とができた。By subjecting the transfer foil produced above to hot stamping or in-mold molding transfer, it was possible to obtain a circuit board having a fine circuit pattern and good I/under suitability.
実施例２
第２図は、本発明の導電性回路転写箔の他の一例を示し
た断面図である。Example 2 FIG. 2 is a sectional view showing another example of the conductive circuit transfer foil of the present invention.
第一絶縁層（２）の形成および第二絶縁層（６）の形成
を省略したほかは実施例１を繰り返した。Example 1 was repeated except that the formation of the first insulating layer (2) and the formation of the second insulating layer (6) were omitted.
これにより、第２図に示した導電性回路転写箔が得られ
た。As a result, the conductive circuit transfer foil shown in FIG. 2 was obtained.
この転写箔をホットスタンプまたはインモールド成型転
写を行うことにより、実施例１の場合と同様に、微細な
回路パターンを有しかつ良好なハンダ適性を有する回路
基板を得ることができた。By subjecting this transfer foil to hot stamping or in-mold molding transfer, it was possible to obtain a circuit board having a fine circuit pattern and good solderability, as in the case of Example 1.
発明の効果
本発明の導電性回路転写箔は、導電性ペーストを用いた
従来の転写箔とは異なり、銅箔を使用して回路を形成し
ているため、微細な回路パターンを有しかつハンダ適性
が良好である。Effects of the Invention Unlike conventional transfer foils that use conductive paste, the conductive circuit transfer foil of the present invention uses copper foil to form the circuit, so it has a fine circuit pattern and is easy to solder. Good suitability.
第１図（イ）〜（ハ）は、本発明の導電性回路転写箔の
製造法の一例を示した断面図である。
第２図は、本発明の導電性回路転写箔の他の一例を示し
た断面図である。
（１）・・・基材フィルム、（１ｄ）・・・易剥離処理
層、（２）・・・第一絶縁層、（２ａ）・・・ハンダ付
け孔、（３）・・・銅箔貼合用接着剤層、
（４）・・・銅箔、
（５）・・・エツチングレジスト層、
（６）・・・第二絶縁層、
（７）・・・転写用接着剤層
°二、−１
第１図FIGS. 1A to 1C are cross-sectional views showing an example of the method for manufacturing the conductive circuit transfer foil of the present invention. FIG. 2 is a sectional view showing another example of the conductive circuit transfer foil of the present invention. (1) Base film, (1d) Easy peeling layer, (2) First insulating layer, (2a) Soldering hole, (3) Copper foil Adhesive layer for lamination, (4) Copper foil, (5) Etching resist layer, (6) Second insulating layer, (7) Adhesive layer for transfer. ,-1 Figure 1
Claims (5)
合用接着剤層（３）／所定の回路パターンにエッチング
処理された銅箔（４）／転写用接着剤層（７）がこの順
に積層した構成を有する導電性回路転写箔。1. Base film (1) / Easy peeling layer (1a) / Copper foil lamination adhesive layer (3) / Copper foil etched into a predetermined circuit pattern (4) / Transfer adhesive layer (7) A conductive circuit transfer foil having a structure in which are laminated in this order.
の間に、ハンダ付け孔（２ａ）を有する第一絶縁層（２
）を介在させてなる特許請求の範囲第１項記載の転写箔
。2. A first insulating layer (2) having soldering holes (2a) between the easily peelable layer (1a) and the copper foil bonding adhesive layer (3).
) The transfer foil according to claim 1, wherein the transfer foil is provided with:
（７）との間に、第二絶縁層（６）を介在させてなる特
許請求の範囲第１項記載の転写箔。3. The transfer foil according to claim 1, wherein a second insulating layer (6) is interposed between the etched copper foil (4) and the transfer adhesive layer (7).
易剥離処理層（１ａ）面に直接または第一絶縁層（２）
を介して銅箔貼合用接着剤層（３）を設ける工程、該接
着剤層（３）上に銅箔（４）を貼合する工程、該銅箔（
４）の上から回路パターンに対応したエッチングレジス
ト層（５）を設ける工程、エッチング処理を行って銅箔
（４）の回路パターン以外の不要部分を除去する工程、
エッチングレジスト層（５）を除去する工程、所定の回
路パターンにエッチング処理された銅箔（４）上に直接
または第二絶縁層（６）を介して転写用接着剤層（７）
を設ける工程からなる導電性回路転写箔の製造法。4. Directly or first insulating layer (2) on the easily peelable layer (1a) surface of the base film (1) provided with the easily peelable layer (1a)
A step of providing an adhesive layer (3) for bonding copper foil through the adhesive layer (3), a step of bonding the copper foil (4) on the adhesive layer (3), a step of bonding the copper foil (
4) A step of providing an etching resist layer (5) corresponding to the circuit pattern from above, a step of performing an etching process to remove unnecessary parts of the copper foil (4) other than the circuit pattern,
Step of removing the etching resist layer (5), transfer adhesive layer (7) directly or through the second insulating layer (6) on the copper foil (4) etched into a predetermined circuit pattern
A method for producing conductive circuit transfer foil comprising the step of providing.
露出部分を残すように易剥離性層（１ａ）面へ形成させ
ることを特徴とする特許請求の範囲第４項記載の製造法
。5. The manufacturing method according to claim 4, characterized in that the first insulating layer (2) is formed on the surface of the easily peelable layer (1a) so as to leave an exposed portion that will become the soldering hole (2a). .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255759A JP2566424B2 (en) | 1987-10-10 | 1987-10-10 | Conductive circuit transfer foil and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62255759A JP2566424B2 (en) | 1987-10-10 | 1987-10-10 | Conductive circuit transfer foil and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0198291A true JPH0198291A (en) | 1989-04-17 |
| JP2566424B2 JP2566424B2 (en) | 1996-12-25 |
Family
ID=17283232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62255759A Expired - Lifetime JP2566424B2 (en) | 1987-10-10 | 1987-10-10 | Conductive circuit transfer foil and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2566424B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008019673A1 (en) * | 2008-04-18 | 2009-10-22 | Lucas Automotive Gmbh | Protection arrangement for protection of safety-related electronic circuits from malfunction |
| JP2010013929A (en) * | 2009-09-11 | 2010-01-21 | Okumura Corp | Waterway protecting method |
| US20140261961A1 (en) * | 2013-03-15 | 2014-09-18 | Illinois Tool Works Inc. | Transferable film including readable conductive image, and methods for providing transferable film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731671A (en) * | 1980-07-30 | 1982-02-20 | Iwaki Seiyaku Kk | Preparation of homopiperazine derivative |
| JPS6034880A (en) * | 1983-05-13 | 1985-02-22 | イング・チイ・オリベツチ・アンド・チイ・エス・ピー・ア | Printer |
| JPS6235595A (en) * | 1985-08-08 | 1987-02-16 | キヤノン株式会社 | Manufacture of transfer sheet |
-
1987
- 1987-10-10 JP JP62255759A patent/JP2566424B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731671A (en) * | 1980-07-30 | 1982-02-20 | Iwaki Seiyaku Kk | Preparation of homopiperazine derivative |
| JPS6034880A (en) * | 1983-05-13 | 1985-02-22 | イング・チイ・オリベツチ・アンド・チイ・エス・ピー・ア | Printer |
| JPS6235595A (en) * | 1985-08-08 | 1987-02-16 | キヤノン株式会社 | Manufacture of transfer sheet |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008019673A1 (en) * | 2008-04-18 | 2009-10-22 | Lucas Automotive Gmbh | Protection arrangement for protection of safety-related electronic circuits from malfunction |
| US8412432B2 (en) | 2008-04-18 | 2013-04-02 | Lucas Automotive Gmbh | Protective arrangement for the protection of safety-relevant electronic circuits from malfunctions |
| JP2010013929A (en) * | 2009-09-11 | 2010-01-21 | Okumura Corp | Waterway protecting method |
| US20140261961A1 (en) * | 2013-03-15 | 2014-09-18 | Illinois Tool Works Inc. | Transferable film including readable conductive image, and methods for providing transferable film |
| US10178778B2 (en) * | 2013-03-15 | 2019-01-08 | Illinois Tool Works Inc. | Transferable film including readable conductive image, and methods for providing transferable film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2566424B2 (en) | 1996-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2965952A (en) | Method for manufacturing etched circuitry | |
| JPH03141693A (en) | Rigid flexible composite multilayer printed circuit board and manufacture thereof | |
| JPH0198291A (en) | Electrically conductive circuit transfer foil and manufacture thereof | |
| JPH04127492A (en) | Material for printed wiring, manufacture thereof and printed wiring board | |
| JP2947963B2 (en) | Manufacturing method of printed wiring board | |
| JPH0728124B2 (en) | Double-sided circuit board manufacturing method | |
| JPH01110790A (en) | Printed circuit transfer foil and manufacture thereof | |
| JPS588600B2 (en) | Ryomen Print High Senban no Seizouhouhou | |
| JP2542416B2 (en) | Manufacturing method of mold circuit board | |
| JPH0243797A (en) | Manufacture of circuit board provided with through-hole | |
| JPS5921095A (en) | Method of producing multilayer printed circuit board | |
| JP2864276B2 (en) | Manufacturing method of printed wiring board | |
| JPS6331193A (en) | Method of forming conductor pattern of printed wiring board | |
| JPS6013304B2 (en) | Manufacturing method of lead frame with support | |
| JPH0821776B2 (en) | Double-sided circuit board manufacturing method | |
| JPS6235595A (en) | Manufacture of transfer sheet | |
| JPH02133991A (en) | Manufacture of printed-wiring board with compound metal foil conductor | |
| JPS63228797A (en) | Manufacture of circuit board | |
| JPS6221297A (en) | Manufacture of printed wiring board | |
| JPS58103194A (en) | Metal core printed circuit board | |
| JPH0294592A (en) | Manufacture of wiring board | |
| JPS62237793A (en) | Manufacture of printed wiring board | |
| JPS6239090A (en) | Manufacture of printed wiring board for aluminum wire bonding | |
| JPH0471707B2 (en) | ||
| JPS5877292A (en) | Method of producing printed circuit board |