JPS6235595A - Manufacture of transfer sheet - Google Patents
Manufacture of transfer sheetInfo
- Publication number
- JPS6235595A JPS6235595A JP60173265A JP17326585A JPS6235595A JP S6235595 A JPS6235595 A JP S6235595A JP 60173265 A JP60173265 A JP 60173265A JP 17326585 A JP17326585 A JP 17326585A JP S6235595 A JPS6235595 A JP S6235595A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- sheet
- metal foil
- transfer sheet
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Duplication Or Marking (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は合成樹脂製の絶縁基板の成形と同時にその表面
に電気回路パターンを形成する方法に用いる転写シート
の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a transfer sheet used in a method for molding an insulating substrate made of synthetic resin and simultaneously forming an electric circuit pattern on the surface thereof.
（従来の技術）
従来、樹脂等の成形品の表面に電気回路パターンを形成
する方法としては、成形品に銅箔等の導体を接着し、不
用部分の導体をエツチング加工してパターンニングする
サブトラクティブ法や、と着強度促進用の下地処理を成
形品表面に施し、そこへ触媒を付加してメッキ核ヲ形成
した後に無電解メッキを行うフルアディティブ法や、無
電解メッキと電解メッキを併用するセミアディティブ法
等が一般的に用いられてきた。(Prior art) Conventionally, as a method for forming an electric circuit pattern on the surface of a molded product made of resin or the like, a sub-travel method is used in which a conductor such as copper foil is adhered to the molded product and the unnecessary portions of the conductor are etched and patterned. Active method, fully additive method in which a base treatment to promote adhesion strength is applied to the surface of the molded product, a catalyst is added thereto to form plating nuclei, and then electroless plating is performed, and a combination of electroless plating and electrolytic plating is used. Semi-additive methods have been commonly used.
また、成形品に導電塗料を印刷する方法、或いは導電塗
料の印刷されたシートを成形品に装着し、その塗料を熱
転写する方法も開発が進められてきた。Further, a method of printing a conductive paint on a molded product, or a method of attaching a sheet printed with a conductive paint to a molded product and thermally transferring the paint has also been developed.
しかし、いずれの方法も成形品を成形後、その表面に電
気回路パターンを形成する製造工程を必要とした。However, both methods require a manufacturing process in which an electric circuit pattern is formed on the surface of the molded product after the molded product is molded.
（発明が解決しようとする問題点〕
そこで、絶縁基板上に回路パターンを有する電気回路基
板を製造する効率の良い方法として、基材シートの上に
回路パターンが形成された転写シートを、樹脂製絶縁基
板の成形用金型内に装着し、この金型内に樹脂を充填す
ることによって、絶縁基板の成形と同時に、この表面上
に転写シートの回路パターンを転写して電気回路基板を
製造する方法が考えられる。(Problems to be Solved by the Invention) Therefore, as an efficient method for manufacturing an electric circuit board having a circuit pattern on an insulating substrate, a transfer sheet on which a circuit pattern is formed on a base sheet is made of resin. By installing it in a mold for molding an insulating substrate and filling the mold with resin, the circuit pattern of the transfer sheet is transferred onto the surface at the same time as the insulating substrate is molded, thereby manufacturing an electric circuit board. There are possible ways.
この方法に使用するのに好適な転写シートは基材シート
と金１箔とを接着剤で貼り合わせた後に、この金属箔を
エツチング除去し、その未除去部分からなる回路パター
ンを形成することにより製造される。A transfer sheet suitable for use in this method is produced by bonding a base sheet and gold foil together with an adhesive, removing the metal foil by etching, and forming a circuit pattern consisting of the unremoved portions. Manufactured.
このように製造した転写シートを、成形金型に装着して
電気回路基板を製造すると、第４図に示すように、樹脂
製のｗ！縁基板５の成形と同時にその表面に金属箔から
なる回路パターン３ａが転写される。この回路パターン
３ａの転写の際、それを基材シートに固着させていた接
着剤２も共に電気回路基板へ転写される場合が少なくな
い、この転写された接着剤２は回路パターン３ａの表面
の酸化防止に役立つので、除去せずにそのままにしてお
くことが好ましい、従って、接着剤２のｆ！類、射出す
る樹脂温度等の諸条件を適切に選定することによつ、接
着剤２を積極的に転写させることは望ましいことである
６
しかし、回路パターン３ａのコネクタ部には、リード線
等を接続するために、その部分に転写された接着剤２を
除去する工程が必要となる。When the transfer sheet manufactured in this way is attached to a molding die to manufacture an electric circuit board, as shown in FIG. 4, a resin w! At the same time as the edge substrate 5 is formed, a circuit pattern 3a made of metal foil is transferred onto its surface. When this circuit pattern 3a is transferred, the adhesive 2 that fixed it to the base sheet is often also transferred to the electric circuit board.This transferred adhesive 2 is attached to the surface of the circuit pattern 3a. It is preferable to leave it unremoved as it helps prevent oxidation, therefore the f! of Adhesive 2! It is desirable to actively transfer the adhesive 2 by appropriately selecting various conditions such as the temperature of the resin to be injected.6 However, the connector part of the circuit pattern 3a is In order to connect the parts, it is necessary to remove the adhesive 2 transferred to that part.
本発明の目的はこのコネクタ部上の接着剤の除去工程を
省略可能とする転写シートの製造方法を提供することに
ある。An object of the present invention is to provide a method for manufacturing a transfer sheet that makes it possible to omit the step of removing the adhesive on the connector portion.
上記目的を達成する本発明は、樹脂製の絶縁基板の成形
と同時にその表面に 回路パターンを形成する電気回路
基板の製造に使用する転写シートの製造方法において、
金属箔と基材シートとを、所定位置に孔を有する接着用
シートを介して貼り合わせた後、該金属箔をエツチング
除去し、その未除去部分からなる回路パターンを形成す
る工程を有することを特徴とする。The present invention achieves the above object in a method of manufacturing a transfer sheet used for manufacturing an electric circuit board, in which a circuit pattern is formed on the surface of a resin insulating board at the same time as the molding of the resin insulating board.
The method includes the step of bonding a metal foil and a base sheet together via an adhesive sheet having holes at predetermined positions, and then removing the metal foil by etching to form a circuit pattern consisting of the unremoved portions. Features.
（実施例）
第１図及び第２図は、本発明の方法の一実施例を示す模
式断面図である。この実施例では、まず所定位置に孔２
ａをあけた接着用シート２により、基材シート１上に金
属箔３を貼り合わせる。(Example) FIGS. 1 and 2 are schematic sectional views showing an example of the method of the present invention. In this embodiment, first, a hole 2 is placed in a predetermined position.
The metal foil 3 is pasted onto the base sheet 1 using the adhesive sheet 2 with a gap a.
接着用シート２は加熱すると湿着力を示すようなシート
が好適である。The adhesive sheet 2 is preferably a sheet that exhibits wetting power when heated.
接着用シート２の孔２ａの位置は次のようにして決定さ
れる。即ち、次工程で金属箔３の不要部分をエツチング
除去して、その未除去部分からなる回路パターン３ａヲ
形成するが、その回路パターン３ａにおいてコネクタ部
となる金属箔３部位の下方にあたる位置に孔２ａをあけ
る。この孔２ａの直径はコネクタ部へのリード線の接続
に必要なだけで十分であつ、回路パターン３ａのコネク
タ部における幅よりも小ざい方がよい。The position of the hole 2a in the adhesive sheet 2 is determined as follows. That is, in the next step, unnecessary portions of the metal foil 3 are removed by etching to form a circuit pattern 3a consisting of the unremoved portions, and a hole is formed in the circuit pattern 3a at a position below the portion of the metal foil 3 that will become the connector portion. Open 2a. The diameter of this hole 2a is sufficient to connect the lead wire to the connector portion, and is preferably smaller than the width of the circuit pattern 3a at the connector portion.
接着用シート２に孔２ａをあ１するには、操作上の簡便
さからはこの接着用シート２１８基材シート１上に載置
する以前に行っておくとよい、なお、孔２ａをもつ接着
用シート２１８、接着剤を基材シート１上へ塗布してシ
ート状とし、その復、所定位置に孔をあけて形成しでも
よい。In order to make the holes 2a in the adhesive sheet 2, it is recommended to do so before placing the adhesive sheet 218 on the base sheet 1 for ease of operation. The sheet 218 may be formed by applying an adhesive onto the base sheet 1 to form a sheet, and then punching holes at predetermined positions.
次に、前述したように、シート状基材１上の金属箔３の
不要部分をエツチング除去することによつ、その未除去
部分からなる回路パターン３ａを形成する（第２図）。Next, as described above, unnecessary portions of the metal foil 3 on the sheet-like base material 1 are removed by etching, thereby forming a circuit pattern 3a consisting of the unremoved portions (FIG. 2).
このエツチング工程には、種々の方法が適用できるが、
例えば金属箔３の上にスクリーン印刷等によりレジスト
インク４＠印刷した後、露出している金属箔３を食刻可
能なエツチング液に浸すことにより実施できる。この操
作によって、印刷されたレジストインキ４部分に覆われ
た金属箔だけが残り回路パターン３ａが形成できる。な
お、レジストインキ４はその後除去する。またこのエツ
チング工程（こは）オドリソグラフィー技術を利用しで
もよい。Various methods can be applied to this etching process, but
For example, this can be carried out by printing the resist ink 4 on the metal foil 3 by screen printing or the like, and then immersing the exposed metal foil 3 in an etching liquid. By this operation, only the metal foil covered with the printed resist ink 4 remains, forming the circuit pattern 3a. Note that the resist ink 4 is then removed. Alternatively, lithography technology may be used in this etching process.
以上説明した本発明の方法により製造した転写シートを
、第３図の示すような金型６内に、装着後、「型締め→
樹脂射出→冷却固化→型開き」の工程を実施することに
より、樹脂製の絶縁基板５が成形されると同時にその表
面に回路パターン３ａが転写され電気回路基板が製造で
きる。この操作によって、接着用シート２を構成してい
た接着能をもつ物質も電気回路基板に転写され（積極的
に転写するには接着用シート２の材料や射出する樹脂の
温度等の諸条件を適宜選択すればよい）、それが回路パ
ターン３ａの酸化防止機能を果たすが、接着用シート２
にあけられた孔のために回路パターンのコネクタ部は接
着能をもつ物質により被覆されず、その除去工程が不要
となる。After mounting the transfer sheet manufactured by the method of the present invention as described above in the mold 6 as shown in FIG.
By carrying out the steps of "resin injection→cooling solidification→mold opening", the resin insulating substrate 5 is molded and at the same time the circuit pattern 3a is transferred onto its surface, thereby producing an electric circuit board. Through this operation, the substance with adhesive properties that made up the adhesive sheet 2 is also transferred to the electric circuit board (for active transfer, various conditions such as the material of the adhesive sheet 2 and the temperature of the resin to be injected) are transferred. may be selected as appropriate), which acts as an antioxidant for the circuit pattern 3a, but the adhesive sheet 2
Because of the holes drilled in the connector, the connector portion of the circuit pattern is not coated with an adhesive substance, making a removal process unnecessary.
（発明の効果）
以上詳細に説明したように、回路パターンのコネクタ部
となる金属箔部位の下方にあたる位言に孔をもつ接着用
シートを用いた本発明の方法により製造された転写シー
トを利用す−ることにより、絶縁基板の成形と同時にそ
の表面に回路パターンを転写して電気回路基板を製造す
る方法における手間のかかる一工程が省略可能となり、
その製造効率が上昇した。(Effects of the Invention) As explained in detail above, a transfer sheet manufactured by the method of the present invention using an adhesive sheet having holes in the lower part of the metal foil that becomes the connector part of the circuit pattern is used. By doing so, it is possible to omit one time-consuming step in the method of manufacturing electric circuit boards by simultaneously molding an insulating substrate and transferring a circuit pattern onto its surface.
Its manufacturing efficiency has increased.
第１図及び第２図の本発明の方法の一実施例を示す模式
断面図、第３図は本発明の方法により製造された転写シ
ートを用いた電気回路基板の作製法を示す模式断面図で
ある。
第４図は、我々が既に揚案した方法により製造した転写
シートを用いで作製した電気回路基板の模式断面図であ
る。
］：基材シート、 ２；接着用シート、２ａ、孔、
３：金属箔、
３ａ：回路パターン、 ４ニレジストインキ、５：絶縁
基板、 ６：金型。FIGS. 1 and 2 are schematic cross-sectional views showing one embodiment of the method of the present invention, and FIG. 3 is a schematic cross-sectional view showing a method for manufacturing an electric circuit board using a transfer sheet manufactured by the method of the present invention. It is. FIG. 4 is a schematic cross-sectional view of an electric circuit board manufactured using a transfer sheet manufactured by a method that we have already proposed. ]: Base sheet, 2; Adhesive sheet, 2a, hole,
3: metal foil, 3a: circuit pattern, 4 resist ink, 5: insulating substrate, 6: mold.
Claims (1)
ターンを形成する電気回路基板の製造に使用する転写シ
ートの製造方法において、金属箔と基材シートとを、所
定位置に孔を有する接着用シートを介して貼り合わせた
後、該金属箔をエッチング除去し、その未除去部分から
なる回路パターンを形成する工程を有することを特徴と
する転写シートの製造方法。1) In a method for manufacturing a transfer sheet used to manufacture an electric circuit board, in which a circuit pattern is formed on the surface of a resin insulating substrate at the same time as molding, a metal foil and a base sheet are bonded with holes at predetermined positions. 1. A method for manufacturing a transfer sheet, comprising the steps of: bonding the metal foil together via a sheet, etching away the metal foil, and forming a circuit pattern consisting of the unremoved portions.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60173265A JPS6235595A (en) | 1985-08-08 | 1985-08-08 | Manufacture of transfer sheet |
| US06/892,086 US4980016A (en) | 1985-08-07 | 1986-08-01 | Process for producing electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60173265A JPS6235595A (en) | 1985-08-08 | 1985-08-08 | Manufacture of transfer sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6235595A true JPS6235595A (en) | 1987-02-16 |
Family
ID=15957239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60173265A Pending JPS6235595A (en) | 1985-08-07 | 1985-08-08 | Manufacture of transfer sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235595A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0198291A (en) * | 1987-10-10 | 1989-04-17 | Oike Ind Co Ltd | Electrically conductive circuit transfer foil and manufacture thereof |
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
-
1985
- 1985-08-08 JP JP60173265A patent/JPS6235595A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0198291A (en) * | 1987-10-10 | 1989-04-17 | Oike Ind Co Ltd | Electrically conductive circuit transfer foil and manufacture thereof |
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
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