JPS6061740U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS6061740U
JPS6061740U JP1983155763U JP15576383U JPS6061740U JP S6061740 U JPS6061740 U JP S6061740U JP 1983155763 U JP1983155763 U JP 1983155763U JP 15576383 U JP15576383 U JP 15576383U JP S6061740 U JPS6061740 U JP S6061740U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
heat sink
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983155763U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6350853Y2 (enrdf_load_stackoverflow
Inventor
池田　保一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1983155763U priority Critical patent/JPS6061740U/ja
Publication of JPS6061740U publication Critical patent/JPS6061740U/ja
Application granted granted Critical
Publication of JPS6350853Y2 publication Critical patent/JPS6350853Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1983155763U 1983-10-04 1983-10-04 混成集積回路装置 Granted JPS6061740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983155763U JPS6061740U (ja) 1983-10-04 1983-10-04 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983155763U JPS6061740U (ja) 1983-10-04 1983-10-04 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6061740U true JPS6061740U (ja) 1985-04-30
JPS6350853Y2 JPS6350853Y2 (enrdf_load_stackoverflow) 1988-12-27

Family

ID=30343911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983155763U Granted JPS6061740U (ja) 1983-10-04 1983-10-04 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6061740U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015072957A (ja) * 2013-10-02 2015-04-16 日産自動車株式会社 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015072957A (ja) * 2013-10-02 2015-04-16 日産自動車株式会社 絶縁基板と冷却器の接合構造体、その製造方法、パワー半導体モジュール、及びその製造方法

Also Published As

Publication number Publication date
JPS6350853Y2 (enrdf_load_stackoverflow) 1988-12-27

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