JPS6061722U - Film forming equipment - Google Patents
Film forming equipmentInfo
- Publication number
- JPS6061722U JPS6061722U JP15322483U JP15322483U JPS6061722U JP S6061722 U JPS6061722 U JP S6061722U JP 15322483 U JP15322483 U JP 15322483U JP 15322483 U JP15322483 U JP 15322483U JP S6061722 U JPS6061722 U JP S6061722U
- Authority
- JP
- Japan
- Prior art keywords
- film forming
- forming apparatus
- gas
- gas inlet
- forming equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はこの考案に係る成膜装置の一実施例の構成を略
示した説明図である。
1・・・・・・真空室、2・・・・・・ヒータ、3・・
・・・・基板、4・・・・・・電極、5・・・・・・気
体導入口、6a・・・・・・ニードルバルブ、6b・・
・・・・バルブ、9・・・・・・掃除用ガス排出。
口、10・・・・・・真空排気口、13・・・・・・ガ
スの切り換え機構。FIG. 1 is an explanatory diagram schematically showing the structure of an embodiment of a film forming apparatus according to this invention. 1...Vacuum chamber, 2...Heater, 3...
...Substrate, 4...Electrode, 5...Gas inlet, 6a...Needle valve, 6b...
...Valve, 9...Cleaning gas discharge. Port, 10... Vacuum exhaust port, 13... Gas switching mechanism.
Claims (3)
いて、前記ガス導入口に連通ずる配管を二股に分岐し−
の配管にはニードルバルブを介して原料ガスを導入せし
め他の配管にはバルブを介して掃除用ガスを導入せしめ
得る切り換え機構を設けることにより、前記ガス導入口
から原料ガス及び掃除用ガスを選択的に真空室内に導入
する如く構成したことを特徴とする成膜装置。(1) In a film forming apparatus equipped with an electrode with a gas inlet opened, the piping communicating with the gas inlet is branched into two.
The source gas and the cleaning gas are selected from the gas inlet by providing a switching mechanism that allows the raw material gas to be introduced into the pipe through a needle valve and the cleaning gas to be introduced through the valve into the other pipe. A film forming apparatus characterized in that it is configured to be introduced into a vacuum chamber.
とを特徴とする実用新案登録請求の範囲第1項記載の
成膜装置。(2) the film forming apparatus is a plasma CVD apparatus;
A film forming apparatus according to claim 1, characterized in that:
特徴とする実用新案登録請求の範囲第1項記載の成膜装
置。(3) The film forming apparatus according to claim 1, wherein the film forming apparatus is a sputtering apparatus.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15322483U JPS6061722U (en) | 1983-09-30 | 1983-09-30 | Film forming equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15322483U JPS6061722U (en) | 1983-09-30 | 1983-09-30 | Film forming equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6061722U true JPS6061722U (en) | 1985-04-30 |
Family
ID=30339057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15322483U Pending JPS6061722U (en) | 1983-09-30 | 1983-09-30 | Film forming equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6061722U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6487773A (en) * | 1987-06-26 | 1989-03-31 | Applied Materials Inc | Self-cleaning method of reactor chamber |
JPH03261131A (en) * | 1990-03-12 | 1991-11-21 | Ngk Insulators Ltd | Wafer heater for semiconductor manufacturing device |
JP2016197652A (en) * | 2015-04-03 | 2016-11-24 | 株式会社島津製作所 | Process processing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681929A (en) * | 1979-12-10 | 1981-07-04 | Hitachi Ltd | Plasma processing device |
JPS56158143A (en) * | 1980-05-12 | 1981-12-05 | Mitsubishi Electric Corp | Reduced pressure type vapor phase growing device |
JPS57201016A (en) * | 1981-06-05 | 1982-12-09 | Oki Electric Ind Co Ltd | Cleaning method for semiconductor manufacturing apparatus |
-
1983
- 1983-09-30 JP JP15322483U patent/JPS6061722U/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681929A (en) * | 1979-12-10 | 1981-07-04 | Hitachi Ltd | Plasma processing device |
JPS56158143A (en) * | 1980-05-12 | 1981-12-05 | Mitsubishi Electric Corp | Reduced pressure type vapor phase growing device |
JPS57201016A (en) * | 1981-06-05 | 1982-12-09 | Oki Electric Ind Co Ltd | Cleaning method for semiconductor manufacturing apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6487773A (en) * | 1987-06-26 | 1989-03-31 | Applied Materials Inc | Self-cleaning method of reactor chamber |
JPH03261131A (en) * | 1990-03-12 | 1991-11-21 | Ngk Insulators Ltd | Wafer heater for semiconductor manufacturing device |
JP2016197652A (en) * | 2015-04-03 | 2016-11-24 | 株式会社島津製作所 | Process processing apparatus |
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