JPS58161634U - Reactive ion plating equipment - Google Patents
Reactive ion plating equipmentInfo
- Publication number
- JPS58161634U JPS58161634U JP5811582U JP5811582U JPS58161634U JP S58161634 U JPS58161634 U JP S58161634U JP 5811582 U JP5811582 U JP 5811582U JP 5811582 U JP5811582 U JP 5811582U JP S58161634 U JPS58161634 U JP S58161634U
- Authority
- JP
- Japan
- Prior art keywords
- reactive ion
- ion plating
- plating equipment
- reactive gas
- evaporation source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Thin Magnetic Films (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の反応性イオンブレーティング装置を説明
するための模式図であり、a図は操作ガス圧が10−5
〜10 ’Torr程度を用イル装置、b図は操作ガ
ス圧が10−4〜1O−2TOrr程度を用い、蒸発源
に電子銃加熱方式を用いる装置である。
111.121は真空チャンバー、112゜122は蒸
発源、113,123はイオン化器、114.124は
基板ホルダー、115,125はガス導入口、116,
126は真空排気口、117.127は反応したガスの
流れ、118゜128は排気ガスの流れ、129は差動
排気弁、100は膜形成室、120は電子銃作動室、で
ある。
第2図、第3図は本考案を実施した反応性イ1ンプレー
テイング装置の1例を説明するための模式図である。2
1.31は真空チャンバー、22゜32は蒸発源、23
.33はイオン化器、24゜34は基板ホルダー、25
.35は反応ガス導入口、26.36,326は真空排
気口、27゜37は反応したガスの流れ、2B、38.
39は真空排気ガスの流れ、310は膜形成室、320
は電子銃作動室、329は差動排気弁、30は反応ガス
放出管である。Figure 1 is a schematic diagram for explaining a conventional reactive ion blating device, and Figure a shows an operating gas pressure of 10-5.
Figure b shows an apparatus using an operating gas pressure of about 10-4 to 10-2 Torr and an electron gun heating method as the evaporation source. 111 and 121 are vacuum chambers, 112 and 122 are evaporation sources, 113 and 123 are ionizers, 114 and 124 are substrate holders, 115 and 125 are gas inlets, 116,
126 is a vacuum exhaust port, 117, 127 is a flow of reacted gas, 118.128 is a flow of exhaust gas, 129 is a differential exhaust valve, 100 is a film forming chamber, and 120 is an electron gun operating chamber. FIGS. 2 and 3 are schematic diagrams for explaining an example of a reactive implantation apparatus embodying the present invention. 2
1.31 is a vacuum chamber, 22°32 is an evaporation source, 23
.. 33 is an ionizer, 24° 34 is a substrate holder, 25
.. 35 is a reaction gas inlet, 26, 36, 326 is a vacuum exhaust port, 27°37 is a flow of reacted gas, 2B, 38.
39 is a flow of vacuum exhaust gas, 310 is a film forming chamber, 320
329 is a differential exhaust valve, and 30 is a reaction gas discharge tube.
Claims (1)
、蒸発源側に反応ガス導入口を設け、かつ基板ホルダー
側に反応ガス排気口を設け、反応ガス及び気化原料の流
れ方向を蒸発源側より基板ボルダ−側方向とした真空チ
ャンバー構造を有することを特徴とする反応イオンブレ
ーティング装置。In the film forming chamber of the reactive ion blating device, a reactive gas inlet is provided on the evaporation source side, and a reactive gas exhaust port is provided on the substrate holder side, so that the flow direction of the reactive gas and vaporized raw material is directed from the evaporation source side to the substrate boulder. - A reactive ion blating device characterized by having a lateral vacuum chamber structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5811582U JPS58161634U (en) | 1982-04-21 | 1982-04-21 | Reactive ion plating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5811582U JPS58161634U (en) | 1982-04-21 | 1982-04-21 | Reactive ion plating equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58161634U true JPS58161634U (en) | 1983-10-27 |
Family
ID=30068523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5811582U Pending JPS58161634U (en) | 1982-04-21 | 1982-04-21 | Reactive ion plating equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58161634U (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5176182A (en) * | 1974-12-27 | 1976-07-01 | Matsushita Electric Ind Co Ltd | BUTSUSHI TSUHAKUMAKU SEISEISOCHI |
JPS5329754B2 (en) * | 1974-12-18 | 1978-08-23 | ||
JPS5531115A (en) * | 1978-08-25 | 1980-03-05 | Ulvac Corp | Anti-contamination, vacuum plasma film-forming apparatus |
JPS5765324A (en) * | 1980-10-09 | 1982-04-20 | Matsushita Electric Ind Co Ltd | Method and apparatus for preparing ultrafine particle membrane |
-
1982
- 1982-04-21 JP JP5811582U patent/JPS58161634U/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329754B2 (en) * | 1974-12-18 | 1978-08-23 | ||
JPS5176182A (en) * | 1974-12-27 | 1976-07-01 | Matsushita Electric Ind Co Ltd | BUTSUSHI TSUHAKUMAKU SEISEISOCHI |
JPS5531115A (en) * | 1978-08-25 | 1980-03-05 | Ulvac Corp | Anti-contamination, vacuum plasma film-forming apparatus |
JPS5765324A (en) * | 1980-10-09 | 1982-04-20 | Matsushita Electric Ind Co Ltd | Method and apparatus for preparing ultrafine particle membrane |
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