JPS6060944A - 半導体被覆用ガラス - Google Patents
半導体被覆用ガラスInfo
- Publication number
- JPS6060944A JPS6060944A JP16602683A JP16602683A JPS6060944A JP S6060944 A JPS6060944 A JP S6060944A JP 16602683 A JP16602683 A JP 16602683A JP 16602683 A JP16602683 A JP 16602683A JP S6060944 A JPS6060944 A JP S6060944A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- semiconductor
- powder
- coating
- willemite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 239000011248 coating agent Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 16
- 229910052844 willemite Inorganic materials 0.000 claims abstract description 7
- 229910011255 B2O3 Inorganic materials 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Glass Compositions (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602683A JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602683A JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6060944A true JPS6060944A (ja) | 1985-04-08 |
| JPS6341861B2 JPS6341861B2 (enrdf_load_stackoverflow) | 1988-08-19 |
Family
ID=15823556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16602683A Granted JPS6060944A (ja) | 1983-09-08 | 1983-09-08 | 半導体被覆用ガラス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6060944A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277485A (ja) * | 1988-04-15 | 1990-03-16 | E I Du Pont De Nemours & Co | 封入用組成物 |
| JP2007013137A (ja) * | 2005-06-30 | 2007-01-18 | Lg Phillips Lcd Co Ltd | 液晶表示装置用薄膜トランジスター素子及びその製造方法 |
| CN110642519A (zh) * | 2019-09-25 | 2020-01-03 | 湖南利德电子浆料股份有限公司 | 一种氮化铝基板用包封浆料及其制备方法和应用 |
| WO2024253095A1 (ja) * | 2023-06-08 | 2024-12-12 | 日本電気硝子株式会社 | 半導体素子被覆用材料、及び半導体素子被覆用焼結体 |
-
1983
- 1983-09-08 JP JP16602683A patent/JPS6060944A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277485A (ja) * | 1988-04-15 | 1990-03-16 | E I Du Pont De Nemours & Co | 封入用組成物 |
| JP2007013137A (ja) * | 2005-06-30 | 2007-01-18 | Lg Phillips Lcd Co Ltd | 液晶表示装置用薄膜トランジスター素子及びその製造方法 |
| CN110642519A (zh) * | 2019-09-25 | 2020-01-03 | 湖南利德电子浆料股份有限公司 | 一种氮化铝基板用包封浆料及其制备方法和应用 |
| WO2024253095A1 (ja) * | 2023-06-08 | 2024-12-12 | 日本電気硝子株式会社 | 半導体素子被覆用材料、及び半導体素子被覆用焼結体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6341861B2 (enrdf_load_stackoverflow) | 1988-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5188990A (en) | Low temperature sealing glass compositions | |
| JPS6238300B2 (enrdf_load_stackoverflow) | ||
| US3408212A (en) | Low melting oxide glass | |
| JPS59174544A (ja) | 半導体被覆用ガラス | |
| JPS6060944A (ja) | 半導体被覆用ガラス | |
| US3841883A (en) | Bi{11 O{11 {11 CONTAINING Pbo-Zno-B{11 O{11 {11 LOW TEMPERATURE SEALING GLASS | |
| US3900330A (en) | Zno-b' 2'o' 3'-sio' 2 'glass coating compositions containing ta' 2'o' 5 'and a semiconductor device coated with the same | |
| WO2024004711A1 (ja) | 半導体素子被覆用ガラス、半導体素子被覆用材料、及び半導体素子被覆用焼結体 | |
| TWI819109B (zh) | 半導體元件被覆用玻璃及使用此的半導體被覆用材料 | |
| US3674520A (en) | Solder glass for adhering sealing or coating | |
| JPS6014475A (ja) | 半導体装置 | |
| JPS5932138A (ja) | 半導体被覆用ガラス | |
| JPS6011467B2 (ja) | ガラス被覆半導体装置およびその製法 | |
| JPS58167445A (ja) | 半導体被覆用ガラス | |
| TWI830068B (zh) | 半導體元件被覆用玻璃及使用此之半導體被覆用材料 | |
| US1734900A (en) | Leading-in wire for glass vessels | |
| US3545989A (en) | Low loss lead fluoride sealing glasses | |
| JPS58190836A (ja) | 半導体被覆用ガラス組成物の製造方法 | |
| JPS6124343B2 (enrdf_load_stackoverflow) | ||
| JPS6229145A (ja) | 大口径シリコンウェハー被覆用ガラス | |
| JPH03205322A (ja) | 半導体被覆用ガラス | |
| JPS6146421B2 (enrdf_load_stackoverflow) | ||
| CN119661085A (zh) | 用于台面型半导体器件表面稳定的无铅粉末玻璃及其应用 | |
| JPS59167023A (ja) | 半導体パツシベ−シヨン用ガラス | |
| JPS59146951A (ja) | 半導体封入用ガラス組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |