JPS6059759A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6059759A JPS6059759A JP16874383A JP16874383A JPS6059759A JP S6059759 A JPS6059759 A JP S6059759A JP 16874383 A JP16874383 A JP 16874383A JP 16874383 A JP16874383 A JP 16874383A JP S6059759 A JPS6059759 A JP S6059759A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- air
- lead frame
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は樹脂封止型の外囲器を有する半導体装置用のリ
ードフレームに関するもので、特にＤＩＰ、（Ｄｕａｌ
、Ｉｎ、−１ｉｎｅ Ｐａｃｋａｇｅ ） 、Ｆｌａ
ｔ 、Ｐａｃｋａｇｅ等の外囲器に使用するリードフレ
ームに関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a lead frame for a semiconductor device having a resin-sealed envelope, and particularly relates to a lead frame for a semiconductor device having a resin-sealed envelope.
, In, -1ine Package), Fla
This invention relates to a lead frame used for an envelope such as T, Package, etc.
第１図にＤＩＰ型のＩＣを製造する場合に用いられる従
来のり、−ド、フレームの構成の一例を示す。これは、
例えば鋼糸の板を打ち抜き形成したもので中央のマウン
ト部２上に図示しない半導体チップがマウントされ、こ
のチップとこのリードフレーム１０のインナーリード３
とがＲンデイングワイヤ等により接続される。また、ア
ウターリード４はダム部５により連結固定されており、
破線で示す樹脂モールド部７がリードフレームＬ！を挾
むようく形成されると、不要となる上記ダム部５および
リードフレームＵの両側部の枠部１ ａ ＋ １ ｂは
切り落とされる。FIG. 1 shows an example of the configuration of a conventional glue, board, and frame used when manufacturing a DIP type IC. this is,
For example, a semiconductor chip (not shown) is mounted on a central mount part 2 formed by punching out a plate of steel thread, and this chip and inner leads 3 of this lead frame 10 are mounted.
and are connected by an R-nding wire or the like. Further, the outer lead 4 is connected and fixed by a dam part 5,
The resin molded part 7 shown by the broken line is the lead frame L! When the dam portion 5 and the frame portions 1 a + 1 b on both sides of the lead frame U are formed so as to be sandwiched therebetween, the unnecessary dam portion 5 and the frame portions 1 a + 1 b on both sides of the lead frame U are cut off.
第１図に示すようなリードフレームＬｏ、−ｆ用いたト
ランスファモールドによる樹脂封止工程の概略は次のよ
うなものである。The outline of the resin sealing process by transfer molding using lead frames Lo and -f as shown in FIG. 1 is as follows.
第２図に示すように下金型２１．および止金型２１２か
らなる金型にチップのマウントされポンディング工程の
終了したリードフレーム１０を挾み固定し予め熱処理を
行ったモールド樹脂２３を高温に設定された金型２１の
ポット部２２に投入し、高圧でモールド樹脂２３を金型
２ノ中に押し込む。モールド樹脂２３は第１図の矢印８
方向、すなわち第２図の上記７Ｊ？ット部２２から上下
の金型２１１．２１２に設けらり、た溝状のランナ部２
４を経てキャビティ部２５に流入し、キャビティ部２５
中を充填する。As shown in FIG. 2, the lower mold 21. The lead frame 10 on which the chip has been mounted and the bonding process has been completed is sandwiched and fixed in a mold consisting of a stopper mold 212, and the mold resin 23, which has been heat-treated in advance, is placed in the pot portion 22 of the mold 21 set at a high temperature. Then, the mold resin 23 is pushed into the mold 2 under high pressure. The mold resin 23 is indicated by arrow 8 in FIG.
direction, i.e. the above 7J in Figure 2? A groove-shaped runner portion 2 is provided from the cut portion 22 to the upper and lower molds 211 and 212.
4 into the cavity part 25, and the cavity part 25
Fill inside.
この際に金Ｗ２１のシノソット部２２、ランナ部２４、
キャビティ部２５に滞留している高温のエアー（空気）
並び妃流入されている樹脂２３から発生する反応性がス
は、金型２１に設けられたエアーベント２６より排出さ
れる。At this time, the gold W21 Shinosot part 22, runner part 24,
High temperature air (air) staying in the cavity part 25
Reactive gas generated from the resin 23 flowing in the mold 21 is discharged from an air vent 26 provided in the mold 21.
このエアーベント２６は、下金型２１工或いは上金型２
１２或いはその両方の、キャビティ部２５の樹脂流入口
（ｒ−ト）２７に対向した部位に１例えば４０〜１００
μｍの深さで形成された溝部からなるものである。第１
図の平面図で示すと破線２６の間がエアーベントの形成
される部分で、キャビティ部すなわちモールド樹脂部７
の一側面から金型の外に向けて設けられている。従って
、エアーおよび反応性がスはリードフレーム１ｒ４の外
枠１ｂの面に沿って矢印９の方向に排出される。This air vent 26 is connected to the lower mold 21 or the upper mold 2.
12 or both of them, 1, for example, 40 to 100, is placed on the part facing the resin inlet (r-t) 27 of the cavity part 25.
It consists of a groove portion formed with a depth of μm. 1st
In the plan view of the figure, the part between the broken lines 26 is the part where the air vent is formed, and the cavity part, that is, the mold resin part 7.
It is provided facing the outside of the mold from one side of the mold. Therefore, air and reactive gas are discharged in the direction of arrow 9 along the surface of outer frame 1b of lead frame 1r4.
このようにしてモールド樹脂２３の加圧形成後、金型２
ノを開放し、モールド樹脂部７とリードフレーム１ｏと
が一体となったものが形成される。After forming the mold resin 23 under pressure in this way, the mold 2
The molded resin portion 7 and the lead frame 1o are integrally formed.
上記のようなトランスファモールドによるイカ脂封止工
程は一度に多量の素子を形成加工できるため今日広く行
なわれている。The squid fat sealing process using transfer molding as described above is widely used today because it is possible to form and process a large number of devices at one time.
しかしながら、上記のようなトランスファモールド工程
において、モールド条件や作業条件等のばらつきＫより
、モールド金型２ノのエアーペント２６上にモールド樹
脂２３が付着しエアーベント２６を埋めてしまう場合が
ある。However, in the transfer molding process as described above, the mold resin 23 may adhere to the air vent 26 of the mold die 2 and fill the air vent 26 due to variations K in mold conditions, working conditions, etc.
このため、エアーベント２６の付着樹脂の除去作業を行
なう必要があるが、近年生産性向上のために１つの金型
内のキャビティ数を増やす傾向にあり、このような多数
のキャビティを有する大型の金型では付着樹脂の除去作
業に時間がかかシ過ぎるため付着樹脂の除去を充分と行
えな込という問題がある。For this reason, it is necessary to remove the resin adhered to the air vent 26, but in recent years there has been a trend to increase the number of cavities in one mold to improve productivity, and it is necessary to remove the resin from the air vent 26. In the mold, there is a problem in that the adhering resin cannot be removed sufficiently because it takes too much time to remove the adhering resin.
また、エアーベント２６からのエアー４力すがスムーズ
に行なわれないとモールドされた樹脂部ｚ中にエアーお
よびがスが排出されずに残り、内部巣を形成したり、ポ
ンディングワイヤの流れや変形を生じる。また、樹脂部
７表面にｂわゆる肌荒れやピンホールが生じ、ひどい場
合には樹脂２３の未充填を生じる場合もある。In addition, if the air from the air vent 26 is not flowed smoothly, air and gas may remain in the molded resin part z without being exhausted, forming internal cavities or causing the flow of the bonding wire. Causes deformation. In addition, so-called rough skin and pinholes may occur on the surface of the resin portion 7, and in severe cases, the resin 23 may not be filled.
特に、樹力旨モールド部の内部に欠陥のある不良品は外
観検査ではわかりにくいことが多く、ｘ 、７．１によ
るモールド樹脂部ｚ内の検査も人手や時間を要して生産
性の向上、低コスト化を計ることが困難であり、）ｌ、
７Ｊ脂側正型の半導体装置の品質および信頼性に問題が
あった。In particular, defective products with defects inside the molded part are often difficult to detect by visual inspection, and inspection of the inside of the molded resin part z according to , it is difficult to measure cost reduction,)l,
There were problems with the quality and reliability of the 7J fat side positive type semiconductor device.
本発明は上記のような点に鑑みなされたもので、金型を
用いた樹脂モールド工程により製造される４１を脂封止
型半導体装置の品質向上および生産性の向上を図ること
のできる構造を有するリードフレームを提供することを
目的とする。The present invention has been made in view of the above points, and provides a structure capable of improving the quality and productivity of a fat-sealed semiconductor device manufactured by a resin molding process using a metal mold. The purpose is to provide a lead frame having the following characteristics.
すなわち本発明によるリードフレームでは、モールド金
型のポット部、ランナ一部およびキャビティ部内に滞留
しているエアーおよび反応性ブスの排出を容易に行わせ
しめるために、リードフレームの両側の外枠のうち、エ
アーベント側の外枠に透孔部を設けるようにしたもので
ある。That is, in the lead frame according to the present invention, in order to easily discharge the air and reactive bus remaining in the pot part, part of the runner, and cavity part of the mold, the outer frame on both sides of the lead frame is , a through hole is provided in the outer frame on the air vent side.
以下図面に基づいて本発明の一実施例につき説明する。 An embodiment of the present invention will be described below based on the drawings.
第３図はＤＩＰ型の装置用のリードフレーム１０を示す
もので、第１図と同一構成部分には同一符号を示してそ
の詳細な説明を省略する。図に示すようにリードフレー
ムリの一方の外枠１ｂのエアーベント２６に挾まれる部
位に透孔部３０ａ、３０ｂを設ける。この透孔部、？
Ｏａ 、 、？ Ｄ ｂの形状は図面のような方形に限
らず、円形や楕円形等でもよく、また透孔部の数も１つ
のキャビティについて２個に限るものではなく適宜形成
すればよい。このようなリードフレームＩＱを第２図に
示すような金型に挾み、樹脂モールド部７を形成した場
合、モールド樹脂が矢印８方向からキャビティ中に流れ
込み、キャビティが充填される。エアーおよび反応性が
スはエアーベント２６から矢印９の方向に抜ける。FIG. 3 shows a lead frame 10 for a DIP type device, and the same components as in FIG. 1 are denoted by the same reference numerals and detailed explanation thereof will be omitted. As shown in the figure, through holes 30a and 30b are provided in a portion of one outer frame 1b of the lead frame that is sandwiched by the air vent 26. This hole?
Oa, ,? The shape of Db is not limited to the rectangular shape shown in the drawings, but may be circular or elliptical, and the number of through holes is not limited to two per cavity, but may be formed as appropriate. When such a lead frame IQ is placed in a mold as shown in FIG. 2 to form a resin mold portion 7, the mold resin flows into the cavity from the direction of arrow 8 and fills the cavity. Air and reactive gas exit from air vent 26 in the direction of arrow 9.
ここで、透孔部３０ｈ、３０ｂに対しキャビティ側の外
枠部のＩｌａ、ｌｌｂはモールド樹脂の流出を阻止する
ストツノ４となる。すなわち、キャビティ内の樹脂がエ
アーベント２６方向に押し出されようとするがストツノ
９１１ ａ 、、 １ ｌ ｂ部分での抵抗が高いため
容易には押し出されない。一方キャビテイ内のエアーお
よびがスもキャビティ方向に押し出されるが、エアーベ
ント２６にを塞ぐように樹脂がストン・ぐ１１ａ。Here, the outer frame portions Ila and Ilb on the cavity side with respect to the through holes 30h and 30b serve as stopper horns 4 that prevent the mold resin from flowing out. That is, although the resin in the cavity tries to be pushed out in the direction of the air vent 26, it is not easily pushed out because of the high resistance at the strut horns 911a, 11b. On the other hand, the air and gas inside the cavity are also pushed out toward the cavity, but the resin is blown out to block the air vent 26 11a.
１１ｂＫ流れたとしても、従来のものより樹脂と外枠す
なわちストッパＩｌ＆、１１ｂとの接触面積が小さく、
樹脂の粘性に打ち勝って容易にエアーおよびガスの排出
口を確保できる。Even if 11bK flows, the contact area between the resin and the outer frame, that is, the stopper Il&, 11b is smaller than that of the conventional one.
It overcomes the viscosity of resin and can easily secure air and gas discharge ports.
さらに、エアーベント２６と対向する部位に透孔が配さ
れるため、この部所に十分な空間を得ることができる。Furthermore, since the through hole is provided in a portion facing the air vent 26, sufficient space can be obtained in this portion.
従ってエアーベント２６のストツｚ＋１１８．ｌｌｂ側
から流出した樹脂によりエアーベント２６が塞がれるこ
とがなくエアーおよび反応性力スの排出を容易に行うこ
とができる。Therefore, the air vent 26's strike z+118. The air vent 26 is not blocked by the resin flowing out from the llb side, and air and reactive force can be easily discharged.
第４図は本発明によるＳＩＰ型のリードフレーム１０の
一例を示す図である。図において矢印８に示すように樹
脂流入口からモールド樹脂がキャビティに流入すると、
モールド部７が充填され、マウント部２にマウントされ
ていたチップは樹脂により封止される。この時モールド
金型内に滞留してｂたエアーおよび樹脂から発生する反
応性ガスは、外枠１ｂに設けた透孔３０から容易に排出
される。また、ストッパ１ノによシそ−ルド樹脂の流出
は防止される。FIG. 4 is a diagram showing an example of an SIP type lead frame 10 according to the present invention. When mold resin flows into the cavity from the resin inlet as shown by arrow 8 in the figure,
The mold part 7 is filled, and the chip mounted on the mount part 2 is sealed with resin. At this time, the air remaining in the mold and the reactive gas generated from the resin are easily discharged from the through holes 30 provided in the outer frame 1b. Furthermore, the shield resin is prevented from flowing out through the stopper 1.
以上のように本発明によれば、トランスファモールドに
用いられるリードフレームの外枠のうち、金型のエアー
ベントに当たる部位に透孔部を設けることにより、この
部所に十分な９間を確保できる。従って、モールド工程
においてエアーおよび反応性がスの排出を容易に行なう
ことができ、樹脂封止型半導体装置の品質向上並びに生
産性の向上を図ることのできるイ・溶造のリードフレー
ムを提供することができる。As described above, according to the present invention, by providing a through hole in the part of the outer frame of the lead frame used for transfer molding that corresponds to the air vent of the mold, a sufficient space can be secured in this part. . Therefore, it is an object of the present invention to provide a lead frame which can easily discharge air and reactive gas during the molding process, and which can improve the quality and productivity of resin-sealed semiconductor devices. be able to.
第１図は従来のリードフレームの一例を示す平面図、第
２図はトランスファモールド用金型を説明する１折面図
、第３図は本発明によるＤＩＰ型装置用のり−Ｐフレー
ムの一例を示す平面図、第４図は本発明によるＳＩＰ型
装置用のリードフレームの一例を示す平面図である。
７ａ、７ｂ・・・外枠、２・・・マウント部、３・・・
インナーリード、４・・・アウターリード、５・・・ダ
ム部、？・・・モールド部、ｉ−０・・・リードフレー
ム、１１、Ｉｌａ、ｌｌｂ・・・ストツノや、２６・・
・エアーベント、３０，３θａ、３０ｂ・・・透孔部。
出願人代理人 弁理士 鈴 江 武 彦第２図
第３図
第４図Fig. 1 is a plan view showing an example of a conventional lead frame, Fig. 2 is a cross-sectional view illustrating a mold for transfer molding, and Fig. 3 is an example of a glue-P frame for a DIP type device according to the present invention. FIG. 4 is a plan view showing an example of a lead frame for a SIP type device according to the present invention. 7a, 7b...Outer frame, 2...Mount part, 3...
Inner lead, 4...outer lead, 5...dam section,? ...Mold part, i-0...Lead frame, 11, Ila, llb...Stock horn, 26...
- Air vent, 30, 3θa, 30b... through hole. Applicant's representative Patent attorney Takehiko Suzue Figure 2 Figure 3 Figure 4
Claims (1)
ドフレームにおいて、リードフレームの外枠のエアーを
排出する側に設詩する部分の一部にエアー抜は用の透孔
部を有していることを特徴とするリードフレーム。A lead frame for resin sealing formed by transfer molding is characterized in that a part of the outer frame of the lead frame on the side from which air is discharged has a through hole for air venting. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16874383A JPS6059759A (en) | 1983-09-13 | 1983-09-13 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16874383A JPS6059759A (en) | 1983-09-13 | 1983-09-13 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6059759A true JPS6059759A (en) | 1985-04-06 |
Family
ID=15873590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16874383A Pending JPS6059759A (en) | 1983-09-13 | 1983-09-13 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059759A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61241951A (en) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | Method of inspecting filling of resin in leadframe and mold cavity using said leadframe |
| JPH04184966A (en) * | 1990-11-20 | 1992-07-01 | Toshiba Corp | Lead frame of semiconductor device |
| US5293065A (en) * | 1992-08-27 | 1994-03-08 | Texas Instruments, Incorporated | Lead frame having an outlet with a larger cross sectional area than the inlet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632440B2 (en) * | 1976-05-17 | 1981-07-28 |
-
1983
- 1983-09-13 JP JP16874383A patent/JPS6059759A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632440B2 (en) * | 1976-05-17 | 1981-07-28 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61241951A (en) * | 1985-04-19 | 1986-10-28 | Hitachi Ltd | Method of inspecting filling of resin in leadframe and mold cavity using said leadframe |
| JPH04184966A (en) * | 1990-11-20 | 1992-07-01 | Toshiba Corp | Lead frame of semiconductor device |
| US5293065A (en) * | 1992-08-27 | 1994-03-08 | Texas Instruments, Incorporated | Lead frame having an outlet with a larger cross sectional area than the inlet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3504297B2 (en) | Semiconductor device having a die supporting member having an opening | |
| JPS6059759A (en) | Lead frame | |
| JP5377807B2 (en) | Mold, sealing device and sealing method | |
| JP2772447B2 (en) | Method for manufacturing optical semiconductor device | |
| JP4475785B2 (en) | Manufacturing method of resin-encapsulated semiconductor device | |
| JPH0936157A (en) | Molding device for semiconductor package and molding method | |
| JPS6281737A (en) | Manufacture of semiconductor and lead frame | |
| KR100298688B1 (en) | Air Vent Structure of Mold Mold for Semiconductor Package Manufacturing | |
| JPH0582706A (en) | Lead frame | |
| JPH05326799A (en) | Semiconductor device lead frame and resin sealing method of semiconductor chip provided therewith | |
| KR100983304B1 (en) | Lead frame, semiconductor package manufactured by applying same, and manufacturing method of semiconductor package | |
| JPH06283629A (en) | Semiconductor device and method and mold for manufacturing same | |
| KR100258876B1 (en) | Method for fabricating test package of semiconductor | |
| JPS60111432A (en) | Metal mold for resin sealing of semiconductor device | |
| KR20000012769U (en) | Mold for molding semiconductor package | |
| JPH0529519A (en) | Semiconductor device and manufacture thereof | |
| JPH04326755A (en) | Resin-sealed semiconductor device and manufacture thereof | |
| JPS6197955A (en) | Lead frame | |
| JPH05335442A (en) | Resin molding method for semiconductor | |
| JP2000304638A (en) | Connection structure of sensor chip | |
| KR100370479B1 (en) | Lead frame of semiconductor package | |
| KR0134168Y1 (en) | Semiconductor package | |
| KR0134812Y1 (en) | Gate structure for void prevention of semiconductor mold gold type | |
| JP2723855B2 (en) | Method for manufacturing resin-encapsulated semiconductor device | |
| KR100345162B1 (en) | Ball grid array package |