JPS6057942A - ペレツトマウント装置 - Google Patents
ペレツトマウント装置Info
- Publication number
- JPS6057942A JPS6057942A JP58166301A JP16630183A JPS6057942A JP S6057942 A JPS6057942 A JP S6057942A JP 58166301 A JP58166301 A JP 58166301A JP 16630183 A JP16630183 A JP 16630183A JP S6057942 A JPS6057942 A JP S6057942A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- stage
- rotation
- pellets
- suction nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/30—
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166301A JPS6057942A (ja) | 1983-09-09 | 1983-09-09 | ペレツトマウント装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166301A JPS6057942A (ja) | 1983-09-09 | 1983-09-09 | ペレツトマウント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6057942A true JPS6057942A (ja) | 1985-04-03 |
| JPH0452617B2 JPH0452617B2 (enExample) | 1992-08-24 |
Family
ID=15828806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58166301A Granted JPS6057942A (ja) | 1983-09-09 | 1983-09-09 | ペレツトマウント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057942A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295431A (ja) * | 1986-06-13 | 1987-12-22 | Nichiden Mach Ltd | ワ−クピツクアツプ装置 |
| JPS6373930U (enExample) * | 1986-10-30 | 1988-05-17 | ||
| JPS647627A (en) * | 1987-06-30 | 1989-01-11 | Toshiba Corp | Method for mounting electronic component |
| JPH01152634A (ja) * | 1987-12-09 | 1989-06-15 | Rohm Co Ltd | 半導体ペレットの組立装置 |
| JP2006135013A (ja) * | 2004-11-04 | 2006-05-25 | Renesas Technology Corp | 実装装置及び実装方法 |
| JP7683972B1 (ja) * | 2024-02-29 | 2025-05-27 | 株式会社 東京ウエルズ | ワーク移送装置、ワーク移送方法 |
-
1983
- 1983-09-09 JP JP58166301A patent/JPS6057942A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62295431A (ja) * | 1986-06-13 | 1987-12-22 | Nichiden Mach Ltd | ワ−クピツクアツプ装置 |
| JPS6373930U (enExample) * | 1986-10-30 | 1988-05-17 | ||
| JPS647627A (en) * | 1987-06-30 | 1989-01-11 | Toshiba Corp | Method for mounting electronic component |
| JPH01152634A (ja) * | 1987-12-09 | 1989-06-15 | Rohm Co Ltd | 半導体ペレットの組立装置 |
| JP2006135013A (ja) * | 2004-11-04 | 2006-05-25 | Renesas Technology Corp | 実装装置及び実装方法 |
| JP7683972B1 (ja) * | 2024-02-29 | 2025-05-27 | 株式会社 東京ウエルズ | ワーク移送装置、ワーク移送方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0452617B2 (enExample) | 1992-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9299598B2 (en) | Robot with integrated aligner | |
| US5273244A (en) | Plate-like member conveying apparatus | |
| US20090016857A1 (en) | Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus | |
| JP2005019963A (ja) | 基板処理装置及び基板受け渡し位置の調整方法 | |
| US7845897B2 (en) | Method for transporting substrates | |
| TWI731449B (zh) | 晶片轉移模組及具有晶片轉移模組之晶片接合裝置 | |
| JP2002520860A (ja) | ウェハーを極小接触でハンドリングするためのウェハーキャリア及び方法 | |
| KR100754245B1 (ko) | 반도체 제조용 웨이퍼 이송로봇 및 그를 구비한 반도체제조설비 | |
| JPS6057942A (ja) | ペレツトマウント装置 | |
| CN110970322B (zh) | 一种芯片贴片设备及芯片贴片方法 | |
| EP3503172B1 (en) | Apparatus and system | |
| KR102504029B1 (ko) | Cmp 공정용 다중 웨이퍼 이송 장치 | |
| US10473714B2 (en) | Method and apparatus for aligning electronic components | |
| KR20210128983A (ko) | 멀티 웨이퍼 트랜스퍼 및 이를 이용한 웨이퍼 이송방법 | |
| CN111715558B (zh) | 一种多输送盘的自动检测筛选系统 | |
| JP2000058625A (ja) | 基板搬送装置 | |
| JPH10321704A (ja) | 基板移載機 | |
| JPH0341468Y2 (enExample) | ||
| KR102771994B1 (ko) | SiC 웨이퍼 정렬 장치 | |
| JP3440801B2 (ja) | 電子部品の接合装置 | |
| CN221407259U (zh) | 一种晶圆转运架 | |
| KR102771986B1 (ko) | 적외선을 이용한 SiC 웨이퍼 프리 얼라이너 및 적외선을 이용한 SiC 웨이퍼 프리 얼라이닝 방법 | |
| JPS607487Y2 (ja) | ペレツト剥離装置 | |
| JPS62295431A (ja) | ワ−クピツクアツプ装置 | |
| JPH0416302B2 (enExample) |