JPS6052187B2 - conductive adhesive - Google Patents
conductive adhesiveInfo
- Publication number
- JPS6052187B2 JPS6052187B2 JP56076024A JP7602481A JPS6052187B2 JP S6052187 B2 JPS6052187 B2 JP S6052187B2 JP 56076024 A JP56076024 A JP 56076024A JP 7602481 A JP7602481 A JP 7602481A JP S6052187 B2 JPS6052187 B2 JP S6052187B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive
- particles
- conductive adhesive
- conductive particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は、導電性接着剤に関し、さらに詳しくは或る特
定の方向にのみ導電性を呈する導電異方性の導電性接着
剤に関するものてある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive adhesive, and more particularly to a conductive anisotropic conductive adhesive that exhibits conductivity only in a specific direction.
従来からエポキシ等の絶縁性接着剤に銀またはカーボン
ブラック等の導電性粒子を混入した導電性接着剤が知ら
れている。2. Description of the Related Art Conductive adhesives have been known in which conductive particles such as silver or carbon black are mixed into an insulating adhesive such as epoxy.
かかる導電性接着剤において導電性粒子の混入比率を極
端に小さくすることによつて縦方向にのみ導電性で横方
向には絶縁性であるという導電異方性が得られるという
ことが実験的に認められている。この従来のものにあつ
ては接続すべき端子間の厚み方向(対向方向)に導電性
粒子が1個だけ存在し、横方向には導電性粒子の連鎖的
接触がとぎれるように導電性粒子の径およびその混入比
率が定められていた。しかし、これによるとその用途が
限定され、また縦方向の良好なる導電性および横方向の
大なる絶縁性を共に満足することが困難である欠点があ
つた。本発明は、上記先行技術の欠点を改善することを
目的とするものであり、以下その一実施例について説明
する。It has been experimentally shown that by extremely reducing the mixing ratio of conductive particles in such conductive adhesives, conductive anisotropy, which is conductive only in the vertical direction and insulating in the horizontal direction, can be obtained. It recognized. In this conventional method, there is only one conductive particle in the thickness direction (opposing direction) between the terminals to be connected, and in the lateral direction, conductive particles are arranged so that the chain contact of the conductive particles is broken. The diameter and mixing ratio were determined. However, this has the drawback that its uses are limited and it is difficult to satisfy both good electrical conductivity in the vertical direction and high insulation properties in the horizontal direction. The present invention aims to improve the drawbacks of the above-mentioned prior art, and one embodiment thereof will be described below.
第1図において1、2は端子板であつて、その対向面に
接続電極3、4が周知のプリント配線技術等によつて形
成されている。接続電極3、4は第2図に示す如く微小
ピッチで配列している。第1図において、端子板1、2
の間には本発明による導電性接着剤5が存在し、この導
電性接着剤5を介して相対向する接続電極3、4同志が
電気的に接続し、隣接するもの同志の間は電気的に絶縁
されている。ここて導電性接着剤5は、エポキシ系の絶
縁性接着剤6中に銀などの導電性粒子7とアルミナなJ
どの絶縁性スペーサ粒子8を適宜の割合で混入したもの
(第3、4図参照)であるが、導電性粒子7の混入比率
は押圧しないて硬化した状態(自然放置による硬化)で
はあらゆる方向に絶縁性を示し、押圧して硬化した状態
では押圧方向にのみ導7電性を示す割合、つまり3叫積
%以下、好ましくは10±5体積%程度であり、スペー
サ粒子8の混入比率は微量である。In FIG. 1, reference numerals 1 and 2 are terminal plates, and connection electrodes 3 and 4 are formed on opposing surfaces thereof by a well-known printed wiring technique or the like. The connecting electrodes 3 and 4 are arranged at minute pitches as shown in FIG. In Figure 1, terminal plates 1 and 2
A conductive adhesive 5 according to the present invention exists between them, and the opposing connection electrodes 3 and 4 are electrically connected to each other via this conductive adhesive 5, and there is no electrical connection between adjacent electrodes. is insulated. Here, the conductive adhesive 5 includes conductive particles 7 such as silver and alumina J in an epoxy-based insulating adhesive 6.
The insulating spacer particles 8 are mixed in an appropriate ratio (see Figures 3 and 4), but the mixing ratio of the conductive particles 7 varies in all directions when hardened without being pressed (hardened by leaving to stand). It exhibits insulating properties and exhibits conductivity only in the pressing direction when pressed and hardened, i.e., 3% by volume or less, preferably about 10±5% by volume, and the proportion of spacer particles 8 mixed is very small. It is.
またスペーサ粒子8は導電性粒子7の径の数倍以上の大
きさのものを使用する。Further, the spacer particles 8 used have a size several times or more larger than the diameter of the conductive particles 7.
例えば、導電性粒子7が1〜2μm径のときスペーサ粒
子8は10μm程度の径を有している。この導電性接着
剤5を、例えば端子板1,2の一方に第2図1点鎖線図
示のように接続電極を横切つて帯状にべた塗りして、両
端子板1,2の電極面を内側にして位置を合わせて重ね
る(第3図)。For example, when the conductive particles 7 have a diameter of 1 to 2 μm, the spacer particles 8 have a diameter of about 10 μm. For example, apply this conductive adhesive 5 all over one of the terminal plates 1 and 2 in a strip shape across the connecting electrode as shown by the dashed line in FIG. Turn them inside and align and stack them (Figure 3).
このとき導電性接着剤5は全方向に絶縁性を示している
。そこで両端子板1,2を押圧すると、導電性接着剤5
は第2図2点鎖線のように広がり、ついにはこの押圧は
スペーサ粒子8によつて制限される(第4図)。この押
圧によつて導電性粒子7に縦方向の連鎖状の連なりが幾
つか生じ、また横方向にはこの連なりが途切れた個所が
幾つか生じる。At this time, the conductive adhesive 5 exhibits insulation in all directions. Then, when both terminal plates 1 and 2 are pressed, the conductive adhesive 5
spreads as shown by the two-dot chain line in FIG. 2, and finally this pressure is limited by the spacer particles 8 (FIG. 4). Due to this pressing, several chains are formed in the conductive particles 7 in the vertical direction, and several places where the chains are interrupted in the horizontal direction are formed.
導電性粒子6がかかる配列を呈する理由は、接着剤5が
第2図示の如く広がるときに、主にエポキシ接着剤6が
その流動性によつて流れ出るように広がり易いが、導電
性粒子7やスペーサ粒子8は横に流れ難いことに起因す
るものと推考される。導電性粒子6が第4図示の如く配
列することによつて、相対向する接続電極3,4同志が
電気的に導通する。しかし隣接する接続電極3または4
同志の間は電気的に絶縁されたままである。仮りにスペ
ーサ粒子8を混入しなかつたとすると、上記押圧による
導電性接着剤の圧縮が第4図以上に進行し、導電性粒子
6が横に押し広げられてこの導電性接着剤5は横方向に
も導電性を示すことになる。The reason why the conductive particles 6 exhibit such an arrangement is that when the adhesive 5 spreads as shown in the second figure, the epoxy adhesive 6 tends to spread out due to its fluidity, but the conductive particles 7 and This is thought to be due to the fact that the spacer particles 8 are difficult to flow laterally. By arranging the conductive particles 6 as shown in the fourth figure, the opposing connection electrodes 3 and 4 are electrically connected to each other. However, the adjacent connection electrode 3 or 4
Comrades remain electrically isolated. Assuming that the spacer particles 8 were not mixed, the compression of the conductive adhesive due to the above-mentioned pressing would progress to a level greater than that shown in FIG. It also shows electrical conductivity.
つまりこのスペーサ粒子8は、導電性接着剤5が横方向
に絶縁性を維持し得る範囲に上記押圧を制御するもので
ある。以上のように本発明によれば、2枚の端子板の各
対向面に微小ピッチで形成された接続電極のうち、互い
に対向するもの同志の電気的接続を導電異方性の接着剤
を介して行なうときに、スペーサ粒子によつて両端子板
間の対向間隔が制限されるから導電性接着剤が押圧方向
と直角な方向(横方向)に導電性を示すことがなく、し
たがつて隣り合う接続電極間の短絡を確実に防止でき、
高い信頼性が保障される。In other words, the spacer particles 8 control the pressing force within a range where the conductive adhesive 5 can maintain insulation in the lateral direction. As described above, according to the present invention, among the connection electrodes formed at minute pitches on the opposing surfaces of two terminal boards, the electrical connection between the opposing electrodes is made via a conductive anisotropic adhesive. When pressing, the spacer particles limit the facing distance between both terminal plates, so the conductive adhesive does not exhibit conductivity in the direction perpendicular to the pressing direction (lateral direction). It can reliably prevent short circuits between matching connection electrodes,
High reliability is guaranteed.
第1図は本発明の導電性接着剤を使用して2枚の端子板
を接続した状態の断面図、第2図は端子l板の要部平面
図、第3図は押圧前の導電性接着剤の状態を示す拡大断
面図、第4図は押圧時の導電性接着剤の状態を示す拡大
断面図である。
1,2・・・・・・端子板、3,4・・・・・・接続電
極、5・・・・・・導電性接着剤、6・・・・・・絶縁
性接着剤、7・・・・・・導・電性粒子、8・・・・・
・スペーサ粒子。Figure 1 is a cross-sectional view of two terminal boards connected using the conductive adhesive of the present invention, Figure 2 is a plan view of the main parts of the terminal plate, and Figure 3 is the conductivity before pressing. FIG. 4 is an enlarged sectional view showing the state of the conductive adhesive when pressed. 1, 2... Terminal board, 3, 4... Connection electrode, 5... Conductive adhesive, 6... Insulating adhesive, 7.・・・・・・Conductive/Electrical particles, 8・・・・・・
・Spacer particles.
Claims (1)
性を示し、押圧して硬化した状態では押圧方向にのみ導
電性を示す割合で絶縁性接着剤中に混入してある導電性
粒子と、上記絶縁性接着剤と上記導電性粒子とからなる
混合物中に分散して含有されており、上記導電性粒子よ
りも大径であつて上記混合物を接続すべき端子間に挟持
して押圧するときの当該端子間に介在する上記混合物の
圧縮量を制限する絶縁性スペーサ粒子とからなることを
特徴とする導電性接着剤。1. Conductive particles mixed in the insulating adhesive at a rate that exhibits insulation in all directions when cured without being pressed, and exhibit conductivity only in the direction of pressure when cured with pressure, and the above-mentioned insulating adhesive. It is dispersed and contained in a mixture consisting of a conductive adhesive and the above-mentioned conductive particles, and has a larger diameter than the above-mentioned conductive particles, and is used when the above-mentioned mixture is sandwiched and pressed between terminals to be connected. A conductive adhesive comprising insulating spacer particles that limit the amount of compression of the mixture interposed between terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56076024A JPS6052187B2 (en) | 1981-05-20 | 1981-05-20 | conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56076024A JPS6052187B2 (en) | 1981-05-20 | 1981-05-20 | conductive adhesive |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50086486A Division JPS5812568B2 (en) | 1975-07-14 | 1975-07-14 | Manufacturing method of electro-optical display device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57111366A JPS57111366A (en) | 1982-07-10 |
JPS6052187B2 true JPS6052187B2 (en) | 1985-11-18 |
Family
ID=13593252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56076024A Expired JPS6052187B2 (en) | 1981-05-20 | 1981-05-20 | conductive adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6052187B2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6144494A (en) * | 1984-08-09 | 1986-03-04 | ソニー株式会社 | Electric connector |
JPH0351899Y2 (en) * | 1985-11-06 | 1991-11-08 | ||
JPS62206772A (en) * | 1986-03-06 | 1987-09-11 | 日立化成工業株式会社 | Circuit connection structure |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPH0329831U (en) * | 1989-07-28 | 1991-03-25 | ||
WO1998057226A2 (en) | 1997-06-12 | 1998-12-17 | Zetfolie B.V. | Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
HU229848B1 (en) * | 2005-12-08 | 2014-10-28 | Dutkay Gyoergy Dr | Method for insulating fix bonding surfaces together |
WO2016088664A1 (en) * | 2014-12-04 | 2016-06-09 | 積水化学工業株式会社 | Electroconductive paste, connection structure, and method for manufacturing connection structure |
JP7425561B2 (en) * | 2019-08-09 | 2024-01-31 | 積水化学工業株式会社 | Conductive material, connected structure, and method for manufacturing connected structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
-
1981
- 1981-05-20 JP JP56076024A patent/JPS6052187B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51119732A (en) * | 1975-04-15 | 1976-10-20 | Seiko Epson Corp | Adhesive with anisotropy in the direction of conducting path |
Also Published As
Publication number | Publication date |
---|---|
JPS57111366A (en) | 1982-07-10 |
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