JPS605148U - lead frame - Google Patents

lead frame

Info

Publication number
JPS605148U
JPS605148U JP9635883U JP9635883U JPS605148U JP S605148 U JPS605148 U JP S605148U JP 9635883 U JP9635883 U JP 9635883U JP 9635883 U JP9635883 U JP 9635883U JP S605148 U JPS605148 U JP S605148U
Authority
JP
Japan
Prior art keywords
supported
lead
frame
heat sink
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9635883U
Other languages
Japanese (ja)
Inventor
健太郎 村上
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9635883U priority Critical patent/JPS605148U/en
Publication of JPS605148U publication Critical patent/JPS605148U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の要部平面図、第２図は第１図の側断面
図、第３図は本案の一実施例を示す要部平面図、第４図
〜第５図は半導体装置の組立方法の説明図であって、第
４図は半導体素子のマウント状態を示す要部平面図、第
５図は完成状態を示す横断面図である。 図中、１は枠部分、２は吊りピン、３は舌片、４は放熱
板、５は凹部、６．７はタイバー、８はリード、８１〜
８７はリード片、９ぽ支持ピンである。Fig. 1 is a plan view of the main part of the conventional example, Fig. 2 is a side sectional view of Fig. 1, Fig. 3 is a plan view of the main part showing an embodiment of the present invention, and Figs. 4 and 5 are the semiconductor device. FIG. 4 is a plan view of a main part showing a mounted state of a semiconductor element, and FIG. 5 is a cross-sectional view showing a completed state. In the figure, 1 is a frame part, 2 is a hanging pin, 3 is a tongue piece, 4 is a heat sink, 5 is a recessed part, 6.7 is a tie bar, 8 is a lead, 81 -
87 is a lead piece and a 9-point support pin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平行に延びる枠部分間に両端に取付用の凹部を有する放
熱板を、枠部分より延びる吊りピンによって支持すると
共に、枠部分間を短絡するタイバーによって支持された
リードを、その一端が放熱板上に離隔位置するように配
設し、かつ放熱板の凹部を枠部分より延びる舌昇にてほ
ぼ閉塞したものにおいて、上記リードのうち、舌片に隣
接するリード片と舌片とを支持ピンにて一体化したこと
を特徴とするリードフレーム。A heat sink having mounting recesses at both ends between parallel frame parts is supported by a hanging pin extending from the frame part, and a lead supported by a tie bar that shorts between the frame parts is supported with one end on the heat sink. The recessed portion of the heat dissipation plate is substantially closed by a tongue extending from the frame portion, and the lead piece adjacent to the tongue piece and the tongue piece among the leads are attached to support pins. A lead frame characterized by an integrated structure.
JP9635883U 1983-06-21 1983-06-21 lead frame Pending JPS605148U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9635883U JPS605148U (en) 1983-06-21 1983-06-21 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9635883U JPS605148U (en) 1983-06-21 1983-06-21 lead frame

Publications (1)

Publication Number Publication Date
JPS605148U true JPS605148U (en) 1985-01-14

Family

ID=30229674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9635883U Pending JPS605148U (en) 1983-06-21 1983-06-21 lead frame

Country Status (1)

Country Link
JP (1) JPS605148U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626964B2 (en) * 1977-10-03 1981-06-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626964B2 (en) * 1977-10-03 1981-06-22

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