JPS6134748U - lead frame - Google Patents

lead frame

Info

Publication number
JPS6134748U
JPS6134748U JP11951784U JP11951784U JPS6134748U JP S6134748 U JPS6134748 U JP S6134748U JP 11951784 U JP11951784 U JP 11951784U JP 11951784 U JP11951784 U JP 11951784U JP S6134748 U JPS6134748 U JP S6134748U
Authority
JP
Japan
Prior art keywords
lead frame
lead
view
tie bar
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11951784U
Other languages
Japanese (ja)
Other versions
JPH0115181Y2 (en
Inventor
三郎 木村
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP11951784U priority Critical patent/JPS6134748U/en
Publication of JPS6134748U publication Critical patent/JPS6134748U/en
Application granted granted Critical
Publication of JPH0115181Y2 publication Critical patent/JPH0115181Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るリードフレームの第１め実施例を
示す平面図、第２ｍｌはペレットマウント及びワイヤポ
ンデイングを完了した第１図の要部拡大平面図、第３図
は本考案の第２の実施例を示す要部拡大平面図、第４図
は本考案の第３の実施例を示す要部拡大平面図である。 第５図は従来のリードフレームの具体例を示す平面図、
第６図はペレットマウント及びワイヤボンデイングを完
了した第５図の要部拡大平面図である。 １・・・・・・リードフレーム、２・・・・・・リード
、３・・・・・・タイバー、３ ａ， ３ａ’， ３ａ
／Ｚ ３ ＩＩＩ・・・・・・両端部、４・・・・・・
ペレットマウント部、８’， ９・・・・・・長穴、
１０・・・・・・切欠き。Fig. 1 is a plan view showing the first embodiment of the lead frame according to the present invention, Fig. 2 ml is an enlarged plan view of the main part of Fig. 1 with pellet mounting and wire ponding completed, and Fig. 3 is a plan view showing the first embodiment of the lead frame according to the present invention. FIG. 4 is an enlarged plan view of main parts showing a second embodiment of the present invention, and FIG. 4 is an enlarged plan view of main parts showing a third embodiment of the present invention. FIG. 5 is a plan view showing a specific example of a conventional lead frame.
FIG. 6 is an enlarged plan view of the main part of FIG. 5 after pellet mounting and wire bonding have been completed. 1...Lead frame, 2...Lead, 3...Tie bar, 3a, 3a', 3a
/Z 3 III... Both ends, 4...
Pellet mount part, 8', 9...Elongated hole,
10... Notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ペレットマウント部に接続されたリードを含む複数本の
１組のリードを復数組平行配置し、各リードの少なくと
も中間部をタイバーにて連結一体化した樹脂モールド用
のリードフレームにおいて、上記タイパーの両端部をリ
ードの側面から突出させ、且つ、その両端部を圧延容易
に１たことを特徴とするリードフレーム。A lead frame for resin molding, in which multiple sets of leads including leads connected to the pellet mount part are arranged in parallel, and at least the middle part of each lead is connected and integrated with a tie bar. A lead frame characterized in that both ends protrude from the side surfaces of the lead and are easily rolled.
JP11951784U 1984-07-31 1984-07-31 lead frame Granted JPS6134748U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11951784U JPS6134748U (en) 1984-07-31 1984-07-31 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11951784U JPS6134748U (en) 1984-07-31 1984-07-31 lead frame

Publications (2)

Publication Number Publication Date
JPS6134748U true JPS6134748U (en) 1986-03-03
JPH0115181Y2 JPH0115181Y2 (en) 1989-05-08

Family

ID=30678386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11951784U Granted JPS6134748U (en) 1984-07-31 1984-07-31 lead frame

Country Status (1)

Country Link
JP (1) JPS6134748U (en)

Also Published As

Publication number Publication date
JPH0115181Y2 (en) 1989-05-08

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