JPS59171347U - lead frame - Google Patents

lead frame

Info

Publication number
JPS59171347U
JPS59171347U JP6483683U JP6483683U JPS59171347U JP S59171347 U JPS59171347 U JP S59171347U JP 6483683 U JP6483683 U JP 6483683U JP 6483683 U JP6483683 U JP 6483683U JP S59171347 U JPS59171347 U JP S59171347U
Authority
JP
Japan
Prior art keywords
lead frame
center terminal
island
lead
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6483683U
Other languages
Japanese (ja)
Inventor
久保　良夫
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP6483683U priority Critical patent/JPS59171347U/en
Publication of JPS59171347U publication Critical patent/JPS59171347U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は一個の半導体素子が組み込まれるリードフレー
ムの一例を示す説明図、第２図は第１図に示したリード
フレームに半導体素子を組み込んだ状態を示す説明図、
第３図は２個の半導体素子が組み込まれるときのリード
フレームの説明図、第４図はこの考案の一実施例のリー
ドフレームの要部を示す平面図である。□ １０・・・・・・ユニット、１２・・・・・・リード端
子、１３・・・・・・インナーリード、１４．１４’、
１５Ａ〜１５Ｃ・・・・・・アイランド。FIG. 1 is an explanatory diagram showing an example of a lead frame in which one semiconductor element is incorporated, FIG. 2 is an explanatory diagram showing a state in which a semiconductor element is incorporated in the lead frame shown in FIG. 1,
FIG. 3 is an explanatory diagram of the lead frame when two semiconductor elements are assembled therein, and FIG. 4 is a plan view showing the main parts of the lead frame of one embodiment of this invention. □ 10...Unit, 12...Lead terminal, 13...Inner lead, 14.14',
15A-15C...Island.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ５個のリード端子を備え、中央の端子及び該中央の端子
に隣接した左右の端子にはそれぞれアイランドが備えら
れたことを特徴とするシングルインラインリードフレー
ム。A single in-line lead frame comprising five lead terminals, and a center terminal and left and right terminals adjacent to the center terminal are each provided with an island.
JP6483683U 1983-04-28 1983-04-28 lead frame Pending JPS59171347U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6483683U JPS59171347U (en) 1983-04-28 1983-04-28 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6483683U JPS59171347U (en) 1983-04-28 1983-04-28 lead frame

Publications (1)

Publication Number Publication Date
JPS59171347U true JPS59171347U (en) 1984-11-16

Family

ID=30195027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6483683U Pending JPS59171347U (en) 1983-04-28 1983-04-28 lead frame

Country Status (1)

Country Link
JP (1) JPS59171347U (en)

Similar Documents

Publication Publication Date Title
JPS59171347U (en) lead frame
JPS6022803U (en) Resistor
JPS619777U (en) Connection mechanism between LCD display and circuit board
JPS59164177U (en) connector
JPS59180465U (en) electronic components
JPS60106349U (en) lead frame
JPS58148874U (en) Storage battery terminal connection
JPS59136806U (en) Membrane structure
JPS6042726U (en) Chip type solid electrolytic capacitor
JPS6116687U (en) display circuit
JPS58178255U (en) lead relay
JPS60104960U (en) memory card
JPS611850U (en) semiconductor element
JPS6015763U (en) double wiring terminals
JPS5863771U (en) Magnetic bubble memory device mounting structure
JPS59166402U (en) square plate resistor
JPS619776U (en) Connection mechanism between LCD display and circuit board
JPS59176107U (en) Resistor with temperature fuse
JPS60137444U (en) coil device
JPS59117152U (en) IC socket
JPS59152762U (en) small electronic components
JPS58151998U (en) card
JPS5858328U (en) electronic components
JPS59149644U (en) power circuit
JPS59177904U (en) metal oxide varistor