JPS6049859A - 半田用フラツクスの這上り防止剤 - Google Patents

半田用フラツクスの這上り防止剤

Info

Publication number
JPS6049859A
JPS6049859A JP15708783A JP15708783A JPS6049859A JP S6049859 A JPS6049859 A JP S6049859A JP 15708783 A JP15708783 A JP 15708783A JP 15708783 A JP15708783 A JP 15708783A JP S6049859 A JPS6049859 A JP S6049859A
Authority
JP
Japan
Prior art keywords
flux
group
compound
agent
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15708783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362315B2 (enrdf_load_stackoverflow
Inventor
Yukio Otoshi
大歳　幸男
Fumio Hase
文夫 長谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seimi Chemical Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Seimi Chemical Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP15708783A priority Critical patent/JPS6049859A/ja
Publication of JPS6049859A publication Critical patent/JPS6049859A/ja
Publication of JPS6362315B2 publication Critical patent/JPS6362315B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP15708783A 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤 Granted JPS6049859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15708783A JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15708783A JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Publications (2)

Publication Number Publication Date
JPS6049859A true JPS6049859A (ja) 1985-03-19
JPS6362315B2 JPS6362315B2 (enrdf_load_stackoverflow) 1988-12-01

Family

ID=15641958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15708783A Granted JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Country Status (1)

Country Link
JP (1) JPS6049859A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099760A1 (ja) * 2006-03-01 2007-09-07 Agc Seimi Chemical Co., Ltd. 半田用フラックス這い上がり防止組成物
WO2008059654A1 (fr) * 2006-11-17 2008-05-22 Agc Seimi Chemical Co., Ltd. Composition pour empêcher un brouillage du flux pour brasage, élément électronique pour un brasage enrobé avec la composition, procédé de brasage de l'élément et produit électrique
JP2010040916A (ja) * 2008-08-07 2010-02-18 Agc Seimi Chemical Co Ltd はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品
WO2011105223A1 (ja) * 2010-02-26 2011-09-01 アルプス電気株式会社 電気接点用表面処理剤

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6886704B2 (en) 2002-10-22 2005-05-03 Pactiv Corporation Containers and container assemblies with releasable locking feature
USD546621S1 (en) 2002-10-22 2007-07-17 Pactiv Corporation Ribs pattern for container
USD527584S1 (en) 2002-10-22 2006-09-05 Pactiv Corporation Bowl
USD576840S1 (en) 2002-10-22 2008-09-16 Pactiv Corporation Bowl
USD514880S1 (en) 2002-10-22 2006-02-14 Pactiv Corporation Container
USD525083S1 (en) 2002-10-22 2006-07-18 Pactiv Corporation Container
USD552424S1 (en) 2002-10-22 2007-10-09 Pactiv Corporation Container
USD525487S1 (en) 2004-06-18 2006-07-25 Pactiv Corporation Container
USD525832S1 (en) 2004-06-18 2006-08-01 Pactiv Corporation Container
USD545134S1 (en) 2004-06-18 2007-06-26 Pactiv Corporation Bowl
USD526163S1 (en) 2004-06-18 2006-08-08 Pactiv Corporation Bowl
USD528867S1 (en) 2004-06-18 2006-09-26 Pactiv Corporation Container
USD547616S1 (en) 2004-06-18 2007-07-31 Pactiv Corporation Container
USD533031S1 (en) 2004-06-18 2006-12-05 Pactiv Corporation Bowl
USD520303S1 (en) 2004-06-18 2006-05-09 Pactiv Corporation Container
USD526853S1 (en) 2004-07-28 2006-08-22 Pactiv Corporation Container
USD559036S1 (en) 2006-02-07 2008-01-08 Pactiv Corporation Set of ribs for container
USD823645S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate
USD823644S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926074A (enrdf_load_stackoverflow) * 1973-03-12 1974-03-08
JPS5323270A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Formation method of schottky diode electrodes
JPS6010694A (ja) * 1983-06-30 1985-01-19 石井　銀弥 プリント配線板のはんだ付け方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926074A (enrdf_load_stackoverflow) * 1973-03-12 1974-03-08
JPS5323270A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Formation method of schottky diode electrodes
JPS6010694A (ja) * 1983-06-30 1985-01-19 石井　銀弥 プリント配線板のはんだ付け方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099760A1 (ja) * 2006-03-01 2007-09-07 Agc Seimi Chemical Co., Ltd. 半田用フラックス這い上がり防止組成物
JP5124441B2 (ja) * 2006-03-01 2013-01-23 Ａｇｃセイミケミカル株式会社 半田用フラックス這い上がり防止組成物
WO2008059654A1 (fr) * 2006-11-17 2008-05-22 Agc Seimi Chemical Co., Ltd. Composition pour empêcher un brouillage du flux pour brasage, élément électronique pour un brasage enrobé avec la composition, procédé de brasage de l'élément et produit électrique
JP5161789B2 (ja) * 2006-11-17 2013-03-13 Ａｇｃセイミケミカル株式会社 はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品
JP2010040916A (ja) * 2008-08-07 2010-02-18 Agc Seimi Chemical Co Ltd はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品
WO2011105223A1 (ja) * 2010-02-26 2011-09-01 アルプス電気株式会社 電気接点用表面処理剤

Also Published As

Publication number Publication date
JPS6362315B2 (enrdf_load_stackoverflow) 1988-12-01

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