JPS6045093A - カバ−レイ付フレキシブル回路板の製造方法 - Google Patents

カバ−レイ付フレキシブル回路板の製造方法

Info

Publication number
JPS6045093A
JPS6045093A JP15381383A JP15381383A JPS6045093A JP S6045093 A JPS6045093 A JP S6045093A JP 15381383 A JP15381383 A JP 15381383A JP 15381383 A JP15381383 A JP 15381383A JP S6045093 A JPS6045093 A JP S6045093A
Authority
JP
Japan
Prior art keywords
coverlay
circuit board
flexible circuit
resin
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15381383A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038596B2 (enrdf_load_stackoverflow
Inventor
能美　豊
加藤　雅久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP15381383A priority Critical patent/JPS6045093A/ja
Publication of JPS6045093A publication Critical patent/JPS6045093A/ja
Publication of JPH038596B2 publication Critical patent/JPH038596B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP15381383A 1983-08-23 1983-08-23 カバ−レイ付フレキシブル回路板の製造方法 Granted JPS6045093A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15381383A JPS6045093A (ja) 1983-08-23 1983-08-23 カバ−レイ付フレキシブル回路板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15381383A JPS6045093A (ja) 1983-08-23 1983-08-23 カバ−レイ付フレキシブル回路板の製造方法

Publications (2)

Publication Number Publication Date
JPS6045093A true JPS6045093A (ja) 1985-03-11
JPH038596B2 JPH038596B2 (enrdf_load_stackoverflow) 1991-02-06

Family

ID=15570661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15381383A Granted JPS6045093A (ja) 1983-08-23 1983-08-23 カバ−レイ付フレキシブル回路板の製造方法

Country Status (1)

Country Link
JP (1) JPS6045093A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH038596B2 (enrdf_load_stackoverflow) 1991-02-06

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