JPS604226A - 半導体装置の樹脂封止成形装置 - Google Patents

半導体装置の樹脂封止成形装置

Info

Publication number
JPS604226A
JPS604226A JP11305483A JP11305483A JPS604226A JP S604226 A JPS604226 A JP S604226A JP 11305483 A JP11305483 A JP 11305483A JP 11305483 A JP11305483 A JP 11305483A JP S604226 A JPS604226 A JP S604226A
Authority
JP
Japan
Prior art keywords
mold
resin
fixed
surface plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11305483A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Koji Yanagiya
柳谷　孝二
Kunio Kobayashi
邦夫 小林
Hiromichi Yamada
弘道 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11305483A priority Critical patent/JPS604226A/ja
Publication of JPS604226A publication Critical patent/JPS604226A/ja
Publication of JPS6366051B2 publication Critical patent/JPS6366051B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP11305483A 1983-06-21 1983-06-21 半導体装置の樹脂封止成形装置 Granted JPS604226A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11305483A JPS604226A (ja) 1983-06-21 1983-06-21 半導体装置の樹脂封止成形装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11305483A JPS604226A (ja) 1983-06-21 1983-06-21 半導体装置の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JPS604226A true JPS604226A (ja) 1985-01-10
JPS6366051B2 JPS6366051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-12-19

Family

ID=14602327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11305483A Granted JPS604226A (ja) 1983-06-21 1983-06-21 半導体装置の樹脂封止成形装置

Country Status (1)

Country Link
JP (1) JPS604226A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292329A (ja) * 1985-06-20 1986-12-23 Toshiba Corp 半導体樹脂封止用成形装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292329A (ja) * 1985-06-20 1986-12-23 Toshiba Corp 半導体樹脂封止用成形装置

Also Published As

Publication number Publication date
JPS6366051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-12-19

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