JPS6042069A - Thermal print head - Google Patents
Thermal print headInfo
- Publication number
- JPS6042069A JPS6042069A JP58151796A JP15179683A JPS6042069A JP S6042069 A JPS6042069 A JP S6042069A JP 58151796 A JP58151796 A JP 58151796A JP 15179683 A JP15179683 A JP 15179683A JP S6042069 A JPS6042069 A JP S6042069A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- glaze layer
- substrate
- heat generating
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 abstract description 43
- 239000011241 protective layer Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 230000002411 adverse Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 102220509329 Small integral membrane protein 10_V73E_mutation Human genes 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】 この発明はサーマＶプリストヘッＦに関する。[Detailed description of the invention] The present invention relates to a THERMA V PRIST HEAD F.
この睡す−１Ｍプリントヘッドにおりて、第１図に示す
ように、アルミナ等のセラミックかちなみ基板１０表面
に、熱絶縁層として部分グレーズ層２を形成し、その表
面を含んで基板ｌの表面に発熱抵抗層８を設け、更に部
分グレーズ層２の頂面をはさんで一対の通電用の導体４
．６を構成した本のけ、既によく知ちれて−る。この構
成によれば導体４．５間に電圧を印加すれば、導体４゜
５間の発熱抵抗層部公示発熱領域３Ａ Ｊ−なり、この
発熱領域８Ａの発熱により所要のプリントが可能となる
。As shown in FIG. 1, in this Sleep-1M print head, a partial glaze layer 2 is formed as a thermal insulation layer on the surface of a ceramic substrate 10 such as alumina, and the substrate 1 including that surface is formed. A heating resistor layer 8 is provided on the surface, and a pair of current-carrying conductors 4 are provided across the top surface of the partial glaze layer 2.
．． The books that made up 6 are already well known. According to this configuration, when a voltage is applied between the conductors 4.5, a heat generating region 3A J- is formed between the conductors 4.5 and the heat generating resistor layer section, and the heat generated in this heat generating region 8A enables the desired printing.
シころでこのような構成によれば、発熱抵抗層８け基板
ｌの一部分グレーズ層２の表面以外の個所にも形成する
のを普通として層る。ｌ−かし基板ｌとしてのセラミッ
クはその表面粗さは平均してはハ０．２〜０．８μｍ程
序もあり、これを改善するたぬに研摩しても、表面を連
Ｈ層とするととけ極めて困難である。そ［２て表面の微
細な凹凸或いは亀裂が残った不連続層のままで、表面に
発熱抵抗層８を形成すると−これが局部的に不連続とな
ったり、ビンホーＶ７３Ｅ生じたりすることガあり、特
性に悪影響を与えることがある。のみならず炉に表面に
耐酸化層、耐摩耗層Ｊ−１ｘつた保護層を般社ることが
あるが−この保護層ＶＣ−１で不連続層ふしての悪影響
を及ぼし、極端方場合にはピンホーＶが発生すると）−
があふ。According to such a configuration, it is common to form the heating resistor layer 8 on a portion of the substrate 1 other than the surface of the glaze layer 2. The average surface roughness of the ceramic used as a substrate is in the order of 0.2 to 0.8 μm, and even if it is polished to improve this, if the surface is made into a continuous H layer, It is extremely difficult to melt. [2] If the heating resistor layer 8 is formed on the surface of a discontinuous layer with fine irregularities or cracks remaining on the surface, this may become locally discontinuous or cause Binho V73E. May adversely affect properties. In addition, a protective layer such as an oxidation-resistant layer and an abrasion-resistant layer J-1x is sometimes applied to the surface of the furnace, but this protective layer VC-1 can have an adverse effect as a discontinuous layer, and in extreme cases. When pinho V occurs)-
Gafu.
この発明はセラミックかちなる基板の表面粗さｗ基〈凹
凸により一基板の表面値（不連続層になるこＪ−による
特性の悪影響を防止することを目的表中る。The purpose of this invention is to prevent the adverse effects on the characteristics of a substrate made of ceramic due to the surface roughness of a substrate (i.e., the surface roughness of a single substrate due to unevenness).
この発明の実施例を第２Ｕに示す。ｆｘお第１図と同じ
符号を付１−７た部分は同−又は対応する部分を示す。An embodiment of the invention is shown in Section 2U. fx, parts 1-7 with the same reference numerals as in FIG. 1 indicate the same or corresponding parts.
この発明にしたがい、基板ｌの表面にガラスたとえばほ
うけい酸鉛ガラスからなるグレーズ層６を形成し−その
表面に発熱抵抗層８を形成する。グレーズ層６を構成す
るガラスジ１−では、部分グレーズ層２を構成するガラ
スとは、その軟化１ＦＡ９カ；適当ｖＣ異なるもの、た
とえば２００〜４００Ｃ程廖異なる本のを使用するとよ
い。According to the invention, a glaze layer 6 made of glass, for example lead borosilicate glass, is formed on the surface of a substrate 1, and a heat generating resistor layer 8 is formed on the surface. For the glass 1- constituting the glaze layer 6, it is preferable to use a glass having a softening temperature of 1FA9, which is different from the glass constituting the partial glaze layer 2 by an appropriate vC, for example, by about 200 to 400C.
すなわちこのような構成σ）ヘッドを製作するには、ま
ず基板１の全表面にわたってグレーズ層６を形成するう
これｔよその厚さ全豹５〜２０μｍ−ｉ＋Ｎ常は約１０
ＩＩｍ稈ル゛となるようにスプレー法により塗布し−
そのあと焼成する。この焼成温度をたとえば約１８００
℃ シする。次に部分グレーズ層２をグレーズＩｉ’１
６の表面に形Ｊ戊する。これはその１シさを約８０〜８
０μｍ−通常は５０μｍ程慶と０るように印刷法により
印刷し、焼成する。その焼成温廖はた七えばｌ】００℃
にする。この２Ａグレ一ズ層６の軟化温度が部分グレー
ズ層２のそれより充屏高＜＋＝ておトドげ、部分グレー
ズ層２の焼成時−グレーズ層６が軟化してしまう恐れは
なり０
発熱抵抗体８けグレーズ層６及び部分グレー１層２０表
面に形成される。更に導体４．５が発熱抵抗体８の表面
に形成される。これらは従来例２同じである。なお第２
図では保護層７が図示されて込ふ。That is, in order to manufacture a head having such a configuration (σ), first, the glaze layer 6 is formed over the entire surface of the substrate 1.
Apply by spraying so that it becomes a thick layer.
Then it is fired. For example, set this firing temperature to about 1800
°C Next, the partial glaze layer 2 is glazed Ii'1
Draw a J shape on the surface of 6. This is about 80~8
It is printed by a printing method to a thickness of 0 μm - usually about 50 μm, and then fired. The firing temperature is 00℃
Make it. Since the softening temperature of this 2A glaze layer 6 is higher than that of the partial glaze layer 2, there is no fear that the glaze layer 6 will soften when the partial glaze layer 2 is fired. 8 resistors are formed on the surfaces of the glaze layer 6 and the partial gray layer 20. Furthermore, a conductor 4.5 is formed on the surface of the heating resistor 8. These are the same as in the conventional example 2. Furthermore, the second
In the figure, a protective layer 7 is shown and included.
前述のように発熱抵抗体８けグレーズ層６の表面に形成
される。グレーズ層はセラミックよりも表面はける一Ａ
、に平滑である。したがって発熱抵抗体８は、基板１の
よりな不連続な而の表面に形成されるようなことはなく
なる。このように発熱抵抗体８力２連続した面の表面に
形成されるととにより、発熱抵抗体８．ひいては導体４
．５−保賂層７にお層ても連続［、た層）−１７で形成
でき一従来のような局部的な亀裂、ピンホーν等ははル
んどなくなる。１７たがってこれちの存在による特性の
悪影響は十分回避できるようになる。As described above, the heating resistor 8 is formed on the surface of the glaze layer 6. The glaze layer is easier to peel off than ceramic.
, is smooth. Therefore, the heating resistor 8 is no longer formed on a more discontinuous surface of the substrate 1. In this way, the heating resistor 8 is formed on the surface of the two continuous surfaces, so that the heating resistor 8. In turn, conductor 4
．． 5 - The bonding layer 7 can be formed as a continuous layer 17, and local cracks, pinholes, etc., which are conventional, are almost eliminated. 17 Therefore, the adverse effects of their presence on the characteristics can be sufficiently avoided.
々お以上の説明は薄膜によるサーマルプリントヘッドに
ついて説明した一ｈ（、これに代えて匣膿によるサーマ
ルプリントヘッドにつ−て＋−ａ板とＬ２でセラミック
を使用する限りとの発明は適用される。又１拶の実施例
にお−でグレーズ層６の軟化温ｒｔｔが部分グレーズ層
２のそれより本高いもの七ｌ〜で説明したが、その製作
過糧で一部分グレーズ層２をさ六に、グレーズ層６をあ
とで焼成するようにすると六は一献化温廖の高低は逆で
あってもより０又同時に焼成するなちば軟化温度は同じ
であってもよい。The above description has been made regarding a thermal print head using a thin film (although the invention is not applicable to a thermal print head using a thin film instead, as long as ceramic is used for the +-a plate and L2). In addition, in the embodiment in Section 1, it was explained that the softening temperature rtt of the glaze layer 6 was much higher than that of the partial glaze layer 2, but due to manufacturing errors, the softening temperature of the glaze layer 2 could be slightly higher than that of the partial glaze layer 2. In addition, if the glaze layer 6 is fired later, the softening temperature may be reversed or the softening temperature may be the same as long as the glaze layer 6 is fired at the same time.
以上詳述したようにこの発明によれば一基板として十う
ミック製のものを使用側−で本−発熱抵抗体に一基板の
表面粗さに基〈亀裂、ビンホーＭ等７５二発生すること
はなり、４１つてこの種サーマルプリントヘッドとして
の信頼性を十分向上させることかで餐る効果を奏すふ。As described in detail above, according to the present invention, when a substrate made by Tomic is used, cracks, cracks, etc. may occur in the heat generating resistor on the user side due to the surface roughness of the substrate. However, the reliability of this type of thermal print head can be sufficiently improved.
第１図は従来例の断面１ｖ２第２図はこの発明の実施例
を示す断面図である。FIG. 1 is a cross-sectional view of a conventional example. FIG. 2 is a cross-sectional view showing an embodiment of the present invention.
Claims (1)
分に部分グレーズを設け、前記グレーズ層から前記部分
グレーズ層にまでまたがって発熱抵抗層を設け、前記発
熱抵抗層のうちの発熱領域をはさんで前記発熱抵抗層の
表面に導体を設けてなるザーマルプリントヘッドA glaze layer is provided on the surface of a ceramic substrate, and a partial glaze is provided on a part, a heating resistor layer is provided spanning from the glaze layer to the partial glaze layer, and the heating area of the heating resistor layer is sandwiched. A thermal print head comprising a conductor provided on the surface of the heating resistance layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58151796A JPS6042069A (en) | 1983-08-19 | 1983-08-19 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58151796A JPS6042069A (en) | 1983-08-19 | 1983-08-19 | Thermal print head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6042069A true JPS6042069A (en) | 1985-03-06 |
Family
ID=15526482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58151796A Pending JPS6042069A (en) | 1983-08-19 | 1983-08-19 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042069A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60224558A (en) * | 1984-04-20 | 1985-11-08 | Seiko Instr & Electronics Ltd | Glazed base for thermal head |
| JPS62103158A (en) * | 1985-10-30 | 1987-05-13 | Futaki Itsuo | Thermal head |
| JPS62153178A (en) * | 1985-12-27 | 1987-07-08 | 株式会社ノリタケカンパニーリミテド | Glazed ceramic substrate |
| JPS62170361A (en) * | 1986-01-24 | 1987-07-27 | Rohm Co Ltd | Thermal head and manufacture thereof |
| EP0631876A2 (en) * | 1993-06-30 | 1995-01-04 | Rohm Co., Ltd. | Thermal print head |
| JP2012051319A (en) * | 2010-09-03 | 2012-03-15 | Rohm Co Ltd | Thermal head and method for manufacturing the same |
| US12023940B2 (en) | 2020-04-10 | 2024-07-02 | Rohm Co., Ltd. | Thermal print head, manufacturing method of the same, and thermal printer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56159176A (en) * | 1980-05-12 | 1981-12-08 | Rohm Co Ltd | Thermal printing head |
| JPS5874373A (en) * | 1981-10-29 | 1983-05-04 | Seiko Instr & Electronics Ltd | Thermal head and manufacture thereof |
-
1983
- 1983-08-19 JP JP58151796A patent/JPS6042069A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56159176A (en) * | 1980-05-12 | 1981-12-08 | Rohm Co Ltd | Thermal printing head |
| JPS5874373A (en) * | 1981-10-29 | 1983-05-04 | Seiko Instr & Electronics Ltd | Thermal head and manufacture thereof |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60224558A (en) * | 1984-04-20 | 1985-11-08 | Seiko Instr & Electronics Ltd | Glazed base for thermal head |
| JPS62103158A (en) * | 1985-10-30 | 1987-05-13 | Futaki Itsuo | Thermal head |
| JPS62153178A (en) * | 1985-12-27 | 1987-07-08 | 株式会社ノリタケカンパニーリミテド | Glazed ceramic substrate |
| JPH0584223B2 (en) * | 1985-12-27 | 1993-12-01 | Noritake Co Ltd | |
| JPS62170361A (en) * | 1986-01-24 | 1987-07-27 | Rohm Co Ltd | Thermal head and manufacture thereof |
| EP0631876A2 (en) * | 1993-06-30 | 1995-01-04 | Rohm Co., Ltd. | Thermal print head |
| EP0631876A3 (en) * | 1993-06-30 | 1995-07-26 | Rohm Co Ltd | Thermal print head. |
| JP2012051319A (en) * | 2010-09-03 | 2012-03-15 | Rohm Co Ltd | Thermal head and method for manufacturing the same |
| US12023940B2 (en) | 2020-04-10 | 2024-07-02 | Rohm Co., Ltd. | Thermal print head, manufacturing method of the same, and thermal printer |
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