JP2012051319A - Thermal head and method for manufacturing the same - Google Patents

Thermal head and method for manufacturing the same Download PDF

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JP2012051319A
JP2012051319A JP2010197356A JP2010197356A JP2012051319A JP 2012051319 A JP2012051319 A JP 2012051319A JP 2010197356 A JP2010197356 A JP 2010197356A JP 2010197356 A JP2010197356 A JP 2010197356A JP 2012051319 A JP2012051319 A JP 2012051319A
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glaze layer
thermal head
formed
paste material
direction
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JP2010197356A
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JP5622492B2 (en
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Masaya Yamamoto
将也 山本
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Rohm Co Ltd
ローム株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing of a thermal head in which a glaze layer having a bulged part can be more simply formed and to provide the thermal head.SOLUTION: A thermal head A1 has a substrate 1, a first glaze layer 21 formed on a surface of the substrate 1, a second glaze layer 22 formed to partially cover the surface of the first glaze layer 21, a heat-generating resistive element 4 formed to cover the second glaze layer 22 and constituting a heat-generating part 4a, and an electrode 3 conducted with the heat-generating resistive element 4. The softening point of the second glaze layer 22 is characterized by being lower than the softening point of the first glaze layer 21.

Description

  The present invention relates to a thermal head and a method for manufacturing a thermal head.

  FIG. 10 shows an example of a conventional thermal head (Patent Document 1). A thermal head X shown in FIG. 10 includes a substrate 91, a glaze layer 92, a resistor layer 93, a common electrode 94, individual electrodes 95, and a protective layer 96. The common electrode 94 and the individual electrode 95 are each connected to an external power supply device, and the heat generating portion 93a of the resistor layer 93 sandwiched between the common electrode 94 and the individual electrode 95 generates heat. The thermal head X is for printing on a printing medium 97 supplied between the thermal head X and a platen roller (not shown) arranged opposite to the thermal head X. For the print medium 97, for example, thermal paper is used.

  In the thermal head X, a bulging portion 92a is formed in the glaze layer 92, and a heat generating portion 93a is disposed on the bulging portion 92a. According to such a configuration, it is easy to apply pressure to the print medium 97, and the print quality can be improved. Further, since the bulging portion 92a exhibits the effect of storing heat, the heat generated by the heat generating portion 93a can be used efficiently, and it is easy to save power.

  The glaze layer 92 as described above is formed by the following method, for example. First, a glass paste material is applied to the substrate 91, and the applied glass paste material is baked to form a glass layer having a uniform thickness. Thereafter, a mask material is applied to a portion where the bulging portion 92a is to be formed, and blasting is performed. By doing so, the portion of the glass layer not covered with the mask material is removed, and the portion covered with the mask material is raised. Furthermore, the glaze layer 92 which has the gentle swelling part 92a can be formed by heat-processing after that.

  However, in the above-described method, since the mask is installed and blasted after the glass paste material is fired, the manufacturing work is complicated, and it is difficult to reduce the manufacturing cost.

JP 2009-154359 A

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide a thermal head manufacturing method and a thermal head capable of more simply forming a glaze layer having a bulging portion. .

  The thermal head provided by the first aspect of the present invention is formed to cover a substrate, a first glaze layer formed on the surface of the substrate, and a part of the surface of the first glaze layer. A second glaze layer, a heating resistor that forms part of the surface of the second glaze layer, and that constitutes a heating part, and an electrode that is electrically connected to a part of the heating resistor. The softening point of the second glaze layer is lower than the softening point of the first glaze layer.

  In a preferred embodiment, the second glaze layer is formed in a strip shape extending along a first direction orthogonal to the thickness direction of the substrate.

  In a preferred embodiment, the second glaze layer has a narrower width in the thickness direction and in a second direction orthogonal to the first direction as it moves away from the surface of the first glaze layer in the thickness direction. The heat generating portion is formed so as to overlap a region farthest from the surface of the first glaze layer in the thickness direction of the second glaze layer.

  In a preferred embodiment, in the thickness direction of the second glaze layer, the width in the second direction of the portion closest to the surface of the first glaze layer in the thickness direction of the second glaze layer is relative to the width in the second direction. The ratio of the width of the central portion in the second direction is 0.65 or more and 0.75 or less.

  In a preferred embodiment, the second glaze layer and the first glaze layer are made of different materials.

  In a preferred embodiment, the second glaze layer contains more bubbles than the first glaze layer.

  The method for manufacturing a thermal head provided by the second aspect of the present invention includes a step of forming a first glaze layer on a substrate and a second glaze so as to cover a part of the surface of the first glaze layer. A step of forming a layer, a step of forming a heating resistor so as to cover a part of the surface of the second glaze layer, and a step of forming an electrode electrically connected to a part of the heating resistor. In the method for manufacturing a thermal head, the step of forming the first glaze layer includes a step of printing the first paste material on the substrate and a step of firing the first paste material. The first glaze layer is formed so as to have a first softening point, and the step of forming the second glaze layer includes printing a second paste material on the first glaze layer. And baking the second paste material Has a step, the second glaze layer is characterized by being formed to have a second softening point lower than the first softening point.

  In a preferred embodiment, in the step of firing the second paste material, the second paste material is fired at a firing temperature higher than the first softening point.

  In a preferred embodiment, the second paste material and the first paste material are made of different materials.

  According to such a manufacturing method, it is possible to form the first and second glaze layers by repeating printing and baking. For this reason, in order to form a bulging part like before, it is not necessary to perform the process of shaving a glass layer. Therefore, according to the thermal head manufacturing method of the present invention, the manufacturing process can be simplified.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a top view which shows the thermal head in 1st Embodiment of this invention. It is sectional drawing which follows the II-II line | wire of FIG. FIG. 3 is an enlarged view of a main part of FIG. 2. It is a figure which shows the process of the manufacturing method of the thermal head shown in FIG. FIG. 5 is a diagram illustrating a process following FIG. 4. FIG. 6 is a diagram showing a step following FIG. 5. It is a top view which shows the thermal head in 2nd Embodiment of this invention. It is sectional drawing which follows the VIII-VIII line of FIG. It is a principal part enlarged view of FIG. It is principal part sectional drawing which shows an example of the conventional thermal head.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show a thermal head according to a first embodiment of the present invention. FIG. 1 is a plan view of a thermal head according to the present embodiment, and FIG. 2 is a sectional view thereof. A thermal head A1 shown in FIGS. 1 and 2 includes a substrate 1, a glaze layer 2, an electrode 3, a heating resistor 4, a driving IC 5, a protective resin 51, a terminal portion 6, a flexible wiring substrate 61, and a protective layer 7. ing. As shown in FIG. 2, the thermal head A <b> 1 is for performing printing on a printing medium 8 that is supplied between the thermal head A <b> 1 and a platen roller (not shown) arranged to face the thermal head A <b> 1. For the print medium 8, for example, thermal paper is used. In FIG. 1, the protective layer 7 is omitted.

  The substrate 1 is a flat plate having a rectangular shape in plan view, and is made of, for example, alumina ceramic. The x direction shown in FIG. 1 is the longitudinal direction of the substrate 1, and the y direction is the short direction. Further, the z direction shown in FIG. 2 is the thickness direction of the substrate 1. A glaze layer 2 is formed on the surface of the substrate 1. The x direction corresponds to the first direction in the present invention, and the y direction corresponds to the second direction in the present invention.

  The glaze layer 2 is made of glass and supplies a smooth surface suitable for installing the electrode 3, the heating resistor 4, and the driving IC 5. The glaze layer 2 of this embodiment includes a first glaze layer 21 and a second glaze layer 22. FIG. 3 shows an enlarged portion where the second glaze layer 22 is provided.

  The first glaze layer 21 is formed so as to cover the surface of the substrate 1. The thickness h1 of the first glaze layer 21 is about 50 μm. The first glaze layer 21 is made of glass, for example, and is formed so that its softening point is 920 ° C.

  The second glaze layer 22 is formed so as to overlap with one end portion (right end portion in FIG. 3) in the y direction of the first glaze layer 21. The second glaze layer 22 is formed in a planar view band shape extending in the x direction. As shown in FIG. 3, the second glaze layer 22 is formed so that the width in the y direction gradually decreases as the distance from the surface of the first glaze layer 21 increases in the z direction. That is, the second glaze layer 22 constitutes a bulging portion that bulges in the z direction from the first glaze layer 21 toward the center thereof. The thickness h2 of the thickest portion of the second glaze layer 22 is about 50 μm. The z direction of the second glaze layer 22 The ratio Lm / Lb between the y direction width Lb of the lower end portion in FIG. 3 and the y direction width Lm of the center portion is 0.65 to 0.75. The second glaze layer 22 is made of, for example, glass, and is formed so that its softening point is 870 ° C.

  An electrode 3 is formed on the glaze layer 2. The electrode 3 is for energizing the heating resistor 4, and includes a common electrode 31 and a plurality of individual electrodes 32. As shown in the enlarged portion of FIG. 1, the common electrode 31 has a shape in which a band-shaped portion extending in the x direction and a plurality of protruding portions protruding from the band-shaped portion in the y direction are connected. The plurality of individual electrodes 32 are formed in a strip shape extending in the y direction, and are arranged along the x direction so that the tips in the y direction face the plurality of protruding portions of the common electrode 31. As shown in FIG. 2, the common electrode 31 and each individual electrode 32 are arranged so as to sandwich the top portion of the second glaze layer 22 in the y direction.

  The heating resistor 4 is a heat source of the thermal head A1. The heating resistor 4 has a strip shape extending in the x direction, and is formed on the glaze layer 2. As shown in FIGS. 2 and 3, the heating resistor 4 is formed to be longer than the second glaze layer 22 in the y direction. In the portion where the heating resistor 4 is formed, the electrode 3 is formed so as to overlap the heating resistor 4. In the top portion of the second glaze layer 22, the heating electrode 4 is exposed from the electrode 3 because the common electrode 31 and each individual electrode 32 are separated from each other. When the common electrode 31 and any one of the individual electrodes 32 are energized, a region between the common electrode 31 and the individual electrode 32 in the heating resistor 4 partially generates heat. A plurality of such regions are arranged in the x direction, and constitute a belt-like heat generating portion 4a extending in the x direction. As shown in FIG. 2, the heat generating portion 4 a is positioned so as to overlap the top portion of the second glaze layer 22.

  The drive IC 5 is a drive for causing the heating resistor 4 to generate heat partially (that is, selectively generating the heating portion 4a) by energizing the heating resistor 4 through the common electrode 31 and the plurality of individual electrodes 32. Take control. In the present embodiment, a plurality of drive ICs 5 are arranged in the x direction on the substrate 1. The drive IC 5 is connected to the plurality of individual electrodes 32 and the terminal unit 6 through wires. The driving IC 5 and the wire connected to the driving IC 5 are covered with a protective resin 51. The protective resin 51 is, for example, a black resin, and prevents malfunction due to damage to the drive IC 5 and reception of ultraviolet rays or the like.

  The terminal portion 6 includes a plurality of metal terminals 6a arranged in the x direction. Each metal terminal 6a is made of, for example, silver, and is connected to the drive IC 5 by a wire. Solder terminals 62 are formed so as to overlap the metal terminals 6a. The flexible wiring board 61 is electrically connected to the terminal portion 6 by the solder 63 formed on the solder terminal 62. The flexible wiring board 61 is used for connection between the thermal head A1 and an external device.

  The protective layer 7 is made of, for example, glass, and protects a portion that comes into contact with the print medium 8 and is easily worn. As shown in FIG. 2, the protective layer 7 is formed so as to expose the ends of the plurality of individual electrodes 32. Wires extending from the drive IC 5 are connected to exposed portions of the plurality of individual electrodes 32. The protective layer 7 is formed of a suitable material selected from, for example, glass, sialon, tantalum nitride, and silicon carbide.

  Next, a method for manufacturing the thermal head A1 will be described with reference to FIGS.

  When manufacturing the thermal head A1, first, a step of forming the first glaze layer 21 is performed. In this step, the first glaze layer 21 is formed by printing and applying the first paste material to the substrate 1, drying the first paste material, and then baking the first paste material at 1200 ° C. (State shown in FIG. 4). The softening point of the first glaze layer 21 is determined by, for example, the composition and material of the first paste material.

  Next, a step of forming the second glaze layer 22 is performed. In this step, first, the second paste material 22A is printed and applied to a predetermined position on the first glaze layer 21 (state shown in FIG. 5). After the second paste material 22A is dried, the second glaze layer 22 is formed by firing at 950 ° C. (state shown in FIG. 6). The softening point of the second glaze layer 22 is determined by, for example, the composition and material of the second paste material 22A. In the present embodiment, the second paste material 22A and the first paste material are made of different materials, and the softening point is different between the second glaze layer 22 and the first glaze layer 21 due to the difference. It has become.

  Since the softening point of the first glaze layer 21 is 920 ° C., the first glaze layer 21 softens when the second paste material 22A is fired, and the first glaze layer 21 and the second paste material Both are mixed at the boundary with 22A. At this time, the second paste material 22A is fluidly deformed, and the second glaze layer 22 has a shape as shown in FIG.

  As shown in FIG. 6, bubbles hardly remain in the first glaze layer 21, but bubbles easily remain in the second glaze layer 22. Since the first glaze layer 21 is baked at a temperature 280 ° C. higher than its softening point, bubbles are less likely to be generated. On the other hand, the second glaze layer 22 is baked at a temperature 80 ° C. higher than its softening point, and bubbles are likely to remain.

  After the second glaze layer 22 is formed, the thermal head A1 is completed by sequentially forming the heating resistor 4, the electrode 3, and the protective layer 7. The heating resistor 4 and the electrode 3 can be formed using, for example, a sputtering method or a CVD method.

  Next, the operation of the thermal head A1 of this embodiment will be described.

  In the thermal head A1 described above, the heat generating portion 4a is formed so as to overlap the top of the second glaze layer 22 formed so as to protrude from the surface of the first glaze layer 21. For this reason, the thermal head A1 is configured to easily apply pressure to the print medium 8 during printing, and even when the print medium 8 is relatively thick, characters are not easily faded, and good print quality can be realized. it can.

  Furthermore, since the second glaze layer 22 stores a part of the heat generated in the heat generating part 4a, the amount of heat that needs to be generated in the heat generating part 4a can be suppressed. For this reason, the thermal head A1 facilitates power saving.

  According to the manufacturing method of the thermal head A1 in this embodiment, the glaze layer 2 can be formed by repeating printing and baking of the paste material. For this reason, it is not necessary to perform blasting as in the conventional method of manufacturing the thermal head X, for example. Therefore, according to the manufacturing method of the thermal head A1 in the present invention, it is possible to form the glaze layer 2 having the bulging portion relatively easily.

  7 to 9 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  7 to 9 show a thermal head in a second embodiment of the present invention. FIG. 7 is a plan view of the thermal head A2 according to this embodiment, and FIG. 8 is a sectional view thereof. FIG. 9 is an enlarged view of a main part of FIG. The thermal head A2 shown in FIGS. 7 to 9 is different from the thermal head A1 in the configuration of the electrode 3 and the heating resistor 4, and the other configurations are the same as the thermal head A1. Hereinafter, a different part of the thermal head A2 from the thermal head A1 will be described.

  The electrode 3 of the present embodiment includes a common electrode 31, a plurality of individual electrodes 32, and an auxiliary electrode 33 that overlaps the common electrode 31. As shown in the enlarged portion of FIG. 7, the common electrode 31 has a shape in which a band-shaped portion extending in the x direction and a plurality of protruding portions protruding from the band-shaped portion in the y direction are connected. The plurality of individual electrodes 32 are formed in a strip shape extending in the y direction, and are arranged along the x direction so that the tip portions in the y direction are sandwiched between the plurality of protruding portions of the common electrode 31. The auxiliary electrode 33 is formed so as to overlap the belt-like portion of the common electrode 31 and has an effect of increasing the conductivity. The common electrode 31 and a plurality of individual electrodes 32, for example, resinate gold paste are formed by thick film printing and then firing. For example, the auxiliary electrode 33 is formed on the common electrode 31 by performing baking after a thick film of silver paste is printed. The height position of the upper surface of the auxiliary electrode 33 in the z direction is lower than the top portion of the second glaze layer 22. In the present embodiment, by providing the auxiliary electrode 33, a portion overlapping the auxiliary electrode 33 of the protective layer 7 is raised.

  The heating resistor 4 of the present embodiment has a strip shape extending in the x direction, and constitutes a heating part in the present invention. As shown in FIGS. 8 and 9, the heating resistor 4 is formed so as to overlap the top portion of the second glaze layer 22. In the present embodiment, the heating resistor 4 is formed so as to overlap the plurality of protruding portions of the common electrode 31 and the plurality of individual electrodes 32. The heat generating resistor 4 is formed, for example, by carrying out baking after thick film printing of ruthenium oxide paste. In the present embodiment, the portion of the protective layer 7 that overlaps the heating resistor 4 rises.

  In the present embodiment, when the common electrode 31 and any one of the individual electrodes 32 are energized, a region between the protruding portions of the common electrode 31 sandwiching the individual electrode 32 in the heating resistor 4 partially generates heat.

  The formation process of the glaze layer 2 in this embodiment is performed similarly to the formation process of the glaze layer 2 in the thermal head A1.

  In such a thermal head A2, the heating resistor 4 is formed so as to overlap the top of the second glaze layer 22 formed so as to protrude from the surface of the first glaze layer 21. Further, since the protective layer 7 in the portion is raised, the thermal head A2 is configured to easily apply pressure to the print medium 8 when performing printing, and even if the print medium 8 is relatively thick, characters are blurred. It is difficult to achieve good print quality.

  Furthermore, since the second glaze layer 22 stores a part of the heat generated in the heating resistor 4, the amount of heat that needs to be generated in the heating resistor 4 can be suppressed. For this reason, the thermal head A2 facilitates power saving.

  The scope of the present invention is not limited to the embodiment described above. The specific configuration of each part of the thermal head according to the present invention can be varied in design in various ways. For example, the softening point and firing temperature of the first glaze layer 21 shown in the above-described embodiment are merely examples, and can be changed as appropriate. The softening point of the second glaze layer 22 can be set as appropriate within a range lower than the softening point of the first glaze layer 21. The firing temperature of the second glaze layer 22 can be set as appropriate within a range higher than the softening point of the first glaze layer 21.

  In the above-described embodiment, the first paste material and the second paste material 22A are separate materials, but the softening point of the first glaze layer 21 and the softening point of the second glaze layer 22 are different. The same material may be used if different.

A1, A2 Thermal head x (first) direction y (second) direction z (thickness) direction 1 substrate 2 glaze layer 21 first glaze layer 22 second glaze layer 22A paste material 3 electrode 31 common electrode 32 Individual electrode 33 Auxiliary electrode 4 Heating resistor 4a Heating part 5 Drive IC
51 Protective Resin 6 Terminal 6a Metal Terminal 61 Flexible Wiring Board 62 Solder Terminal 63 Solder 7 Protective Layer

Claims (9)

  1. A substrate,
    A first glaze layer formed on the surface of the substrate;
    A second glaze layer formed to cover part of the surface of the first glaze layer;
    A heating resistor which is formed so as to cover a part of the surface of the second glaze layer, and which constitutes a heating part;
    An electrode conducting with a part of the heating resistor;
    A thermal head comprising
    A thermal head, wherein a softening point of the second glaze layer is lower than a softening point of the first glaze layer.
  2.   The thermal head according to claim 1, wherein the second glaze layer is formed in a strip shape extending along a first direction orthogonal to the thickness direction of the substrate.
  3. The second glaze layer is formed so that a width in the thickness direction and a second direction orthogonal to the first direction becomes narrower as the distance from the surface of the first glaze layer increases in the thickness direction. And
    3. The thermal head according to claim 1, wherein the heat generating portion is formed to overlap with a region farthest from the surface of the first glaze layer in the thickness direction of the second glaze layer.
  4.   The second portion of the central portion in the thickness direction of the second glaze layer with respect to the width in the second direction of the portion of the second glaze layer in the thickness direction closest to the surface of the first glaze layer. 4. The thermal head according to claim 2, wherein a width ratio in the direction of is not less than 0.65 and not more than 0.75. 5.
  5.   The thermal head according to claim 1, wherein the second glaze layer and the first glaze layer are made of different materials.
  6.   The thermal head according to any one of claims 1 to 5, wherein the second glaze layer contains more bubbles than the first glaze layer.
  7. Forming a first glaze layer on a substrate;
    Forming a second glaze layer so as to cover part of the surface of the first glaze layer;
    Forming a heating resistor so as to cover part of the surface of the second glaze layer;
    Forming an electrode that is electrically connected to a part of the heating resistor;
    A thermal head manufacturing method comprising:
    The step of forming the first glaze layer includes a step of printing the first paste material on the substrate, and a step of firing the first paste material,
    The first glaze layer is formed to have a first softening point;
    The step of forming the second glaze layer includes a step of printing a second paste material on the first glaze layer, and a step of firing the second paste material,
    The method of manufacturing a thermal head, wherein the second glaze layer is formed to have a second softening point lower than the first softening point.
  8.   The method for manufacturing a thermal head according to claim 7, wherein, in the step of firing the second paste material, the second paste material is fired at a firing temperature higher than the first softening point.
  9.   The method for manufacturing a thermal head according to claim 7 or 8, wherein the second paste material and the first paste material are made of different materials.
JP2010197356A 2010-09-03 2010-09-03 Thermal head and method for manufacturing thermal head Active JP5622492B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130307907A1 (en) * 2012-04-27 2013-11-21 Rohm Co., Ltd. Thermal printhead and method of manufacturing the same
JP2014231216A (en) * 2012-08-29 2014-12-11 ローム株式会社 Thermal print head and thermal printer
US9796189B2 (en) 2015-12-25 2017-10-24 Rohm Co., Ltd. Thermal print head
US9937729B2 (en) 2015-12-25 2018-04-10 Rohm Co., Ltd. Thermal print head

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042069A (en) * 1983-08-19 1985-03-06 Rohm Co Ltd Thermal print head
JPS61215067A (en) * 1985-03-20 1986-09-24 Pentel Kk Preparation of thermal head
JPH03128256A (en) * 1989-10-14 1991-05-31 Rohm Co Ltd Thermal printing head and its manufacture
JPH0852892A (en) * 1994-08-12 1996-02-27 Tdk Corp Thermal head and production thereof
JPH08207334A (en) * 1995-02-06 1996-08-13 Fuji Photo Film Co Ltd Thermal head and its manufacture
JP2000025259A (en) * 1999-06-28 2000-01-25 Ngk Spark Plug Co Ltd Glaze substrate for thermal head and manufacture thereof
JP2009154359A (en) * 2007-12-26 2009-07-16 Rohm Co Ltd Thermal head

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042069A (en) * 1983-08-19 1985-03-06 Rohm Co Ltd Thermal print head
JPS61215067A (en) * 1985-03-20 1986-09-24 Pentel Kk Preparation of thermal head
JPH03128256A (en) * 1989-10-14 1991-05-31 Rohm Co Ltd Thermal printing head and its manufacture
JPH0852892A (en) * 1994-08-12 1996-02-27 Tdk Corp Thermal head and production thereof
JPH08207334A (en) * 1995-02-06 1996-08-13 Fuji Photo Film Co Ltd Thermal head and its manufacture
JP2000025259A (en) * 1999-06-28 2000-01-25 Ngk Spark Plug Co Ltd Glaze substrate for thermal head and manufacture thereof
JP2009154359A (en) * 2007-12-26 2009-07-16 Rohm Co Ltd Thermal head

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130307907A1 (en) * 2012-04-27 2013-11-21 Rohm Co., Ltd. Thermal printhead and method of manufacturing the same
US9254650B2 (en) 2012-04-27 2016-02-09 Rohm Co., Ltd. Thermal printhead and method of manufacturing the same
JP2014231216A (en) * 2012-08-29 2014-12-11 ローム株式会社 Thermal print head and thermal printer
US9248663B2 (en) 2012-08-29 2016-02-02 Rohm Co., Ltd. Thermal print head and thermal printer
US9352585B2 (en) 2012-08-29 2016-05-31 Rohm Co., Ltd. Thermal print head and thermal printer
US9796189B2 (en) 2015-12-25 2017-10-24 Rohm Co., Ltd. Thermal print head
US9937729B2 (en) 2015-12-25 2018-04-10 Rohm Co., Ltd. Thermal print head
US10279597B2 (en) 2015-12-25 2019-05-07 Rohm Co., Ltd. Thermal print head

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