JP3652831B2 - Heat generating device and manufacturing method thereof - Google Patents

Heat generating device and manufacturing method thereof Download PDF

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Publication number
JP3652831B2
JP3652831B2 JP7746497A JP7746497A JP3652831B2 JP 3652831 B2 JP3652831 B2 JP 3652831B2 JP 7746497 A JP7746497 A JP 7746497A JP 7746497 A JP7746497 A JP 7746497A JP 3652831 B2 JP3652831 B2 JP 3652831B2
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JP
Japan
Prior art keywords
layer
heat storage
substrate
heat
resistance
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP7746497A
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Japanese (ja)
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JPH10264429A (en
Inventor
泰久 藤井
秀夫 谷口
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ローム株式会社
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat generating device used for a thermal print head and the like, and a manufacturing method thereof.
[0002]
[Prior art]
Generally, in a heat generating device used for a thermal print head, a glass glaze layer is used as a heat storage layer for obtaining desired thermal characteristics.
[0003]
Since this glass glaze layer has a relatively large thermal conductivity and a relatively large specific heat, there is a limit to lowering power consumption and improving printing quality, which has hindered increasing printing speed.
[0004]
Therefore, a heat generating device using a polyimide resin having a lower thermal conductivity and specific heat than the glass glaze layer 2 as a heat storage layer has been proposed.
[0005]
As shown in FIG. 38, such a conventional heating device has a heat storage layer 52 made of polyimide resin formed on the entire surface of a substrate 51 made of a metal plate or ceramic, and has a thickness of 0.1 μm to 0 μm thereon. A metal thin film with a thickness of about 6 μm is formed by sputtering or vapor deposition to form a resistance layer 53, and a metal thin film with a thickness of about 0.05 μm to 0.1 μm is formed thereon by sputtering or vapor deposition, and a pattern is formed by photoetching. Thus, the electrode layer 54 was formed, and a thin film having wear resistance was formed thereon to form the protective layer 55.
[0006]
However, in such a conventional heat generating device, the resistance layer 53 and the electrode layer 54 made of a very thin metal thin film are formed on the heat storage layer 52 made of polyimide resin which is softer than glass glaze. Since the disconnection of the resistance layer 53 and the electrode layer 54 frequently occurs due to the thermal stress caused by the difference in thermal expansion coefficient between the resistance layer 53 and the electrode layer 54, a polyimide resin that can withstand high temperatures during printing has been commercialized. Nevertheless, it has not yet been put to practical use.
[0007]
DISCLOSURE OF THE INVENTION
The present invention has been conceived under the circumstances described above, and uses a polyimide resin as a heat storage layer, and a heating device that can satisfactorily prevent disconnection of a resistance layer and an electrode layer, and its It is an object of the present invention to provide a manufacturing method.
[0008]
In order to solve the above problems, the present invention takes the following technical means.
[0009]
According to a first aspect of the present invention, a resistance layer that generates heat when energized, an electrode layer for energizing the resistance layer, a heat storage layer that stores heat generated by the resistance layer , and A heat generating device provided on a substrate with a protective layer covering the resistance layer , wherein the heat storage layer is composed of a polyimide resin, the resistance layer and the electrode layer are composed of a thick film , and the resistance layer and the A heat generating device is provided in which the protective layer is mainly composed of a polyimide resin .
[0010]
In this case, since the resistance layer and the electrode layer are made of a thick film, the resistance layer and the electrode layer are made of polyimide resin as a heat storage layer because it is very strong compared to the thin film. Can be prevented well. In addition, since the resistance layer and the protective layer are mainly composed of a polyimide resin, the resistance layer is flexible and has a small difference in thermal expansion coefficient from the heat storage layer made of polyimide resin. And damage to the protective layer can be prevented even better.
[0011]
This heat generating device can be used not only for a thermal print head, but also for a heater for a thermostatic bath that needs to control the temperature with very high accuracy, for example.
[0012]
According to a preferred embodiment, the heat storage layer is disposed only near the lower side of the resistance layer.
[0013]
If it does in this way, the usage-amount of an expensive polyimide resin can be reduced and manufacturing cost can be reduced. In addition, there is no polyimide resin as a heat storage layer under the electrode layer at the bonding position of the wire for connection with the driving IC or the like, and the substrate or the glass glaze layer is directly present under the electrode layer. Since these substrates or glass glaze layers are harder than the polyimide resin as the heat storage layer, wire bonding can be performed satisfactorily and reliability is improved.
[0018]
According to another preferred embodiment, a glass glaze layer is provided on the substrate except near the lower side of the resistance layer, and the heat storage layer is provided near the lower side of the resistance layer on the substrate where the glass glaze layer is not provided. And formed in close contact with the glass glaze layer.
[0019]
If it does in this way, since a heat storage layer can be formed by apply | coating and baking a polyimide resin mucus on the groove-shaped valley part formed of the glass glaze layer at the time of manufacture, a thick heat storage layer can be formed easily.
[0020]
According to another preferred embodiment, the protruding height of the heat storage layer from the substrate is set to be higher than the protruding height of the glass glaze layer from the substrate.
[0021]
In this way, the printing pressure increases, and the resistance layer on the heat storage layer can be favorably pressed against the recording paper via the protective layer.
[0022]
According to another preferred embodiment, the protruding height of the heat storage layer from the substrate is 10 μm to 20 μm higher than the protruding height of the glass glaze layer from the substrate.
[0023]
In this way, the printing pressure increases moderately, and the resistance layer on the heat storage layer can be appropriately pressed against the recording paper via the protective layer.
[0024]
According to the second aspect of the present invention, a resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and heat generated by the resistive layer A method of manufacturing a heat generating device for manufacturing a heat generating device provided on a substrate with a heat storage layer made of a polyimide resin that stores heat, and when forming an electrode layer, the heat storage layer is formed before the heat storage layer is formed. High temperature gold is printed on the part excluding the planned position, the high temperature gold is baked at a temperature higher than the deterioration point of the polyimide resin, and after the heat storage layer is formed, the low temperature gold is printed on the heat storage layer. There is provided a method for manufacturing a heating device, characterized in that the low-temperature gold is fired at a temperature lower than the deterioration point of the polyimide resin in a state where the end portion is superposed on the high-temperature gold.
[0025]
In this way, as in the case where the entire electrode layer is formed after the formation of the heat storage layer, it is not necessary to configure the entire electrode layer with low-temperature gold, the manufacturing cost can be reduced, and good wire bonding can be achieved, Furthermore, the electrode layer can have a low resistance.
[0026]
That is, low-temperature gold that can be fired at a temperature lower than the degradation point of the polyimide resin is more expensive, harder to wire bond, and sheet resistance than the high-temperature gold that needs to be fired at a temperature higher than the degradation point of the polyimide resin. The contact strength is weak.
[0027]
The deterioration point refers to a temperature at which deformation, flow, or thermal decomposition starts to occur in the polyimide resin. The high-temperature gold is gold that needs to be fired at a high temperature of about 800 degrees Celsius, such as a generally used resinate gold, and the low-temperature gold can be fired at about 300 degrees Celsius. It is money. This gold paste for low temperature is obtained by dispersing fine gold particles having a particle size of about 80 angstroms in a solvent.
[0028]
According to the third aspect of the present invention, a resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and heat generated by the resistive layer A method of manufacturing a heat generating device for manufacturing a heat generating device provided on a substrate with a heat storage layer made of a polyimide resin for storing heat, wherein a polyimide resin and a resistive material are mixed when forming a resistance layer. There is provided a method for manufacturing a heating device, characterized in that a material is printed at a thickness of 2 μm to 10 μm and then fired.
[0029]
In this case, the resistive layer is formed by printing a material obtained by mixing a polyimide resin and a resistive substance with a thickness of 2 μm to 10 μm and firing the printed material, so that the resistive layer has flexibility. In addition, since the difference in coefficient of thermal expansion between the heat storage layer made of polyimide resin and the resistance layer is small, disconnection of the resistance layer due to thermal stress can be further prevented.
[0030]
For example, carbon black can be used as the resistance substance.
[0031]
According to the fourth aspect of the present invention, a resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and heat generated by the resistive layer A heating device manufacturing method for manufacturing a heating device provided with a heat storage layer made of polyimide resin for storing heat and a protective layer covering a resistance layer on a substrate. There is provided a method for manufacturing a heating device, characterized in that a material in which a resin and an abrasion-resistant substance are mixed is printed with a thickness of 2 μm to 10 μm and fired.
[0032]
In this way, a protective layer is formed by printing a material obtained by mixing a polyimide-based resin and an abrasion-resistant substance with a thickness of 2 μm to 10 μm and firing it. In addition, since the difference in coefficient of thermal expansion between the heat storage layer made of polyimide resin and the protective layer is small, damage to the protective layer due to thermal stress can be further prevented.
[0033]
As the wear resistant substance, for example, aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), silicon carbide (SiC), aluminum nitride (AlN), or the like can be used.
[0034]
Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.
[0036]
FIG. 1 is a plan view of a main part of a thermal print head provided with a heat generating device according to the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. A glass glaze layer 2 and a heat storage layer 3 are formed. The heat storage layer 3 is formed over almost the entire length in the length direction near one end of the substrate 1 in the width direction, and the glass glaze layer 2 is formed on the entire surface in the other portions. The upper surface of the heat storage layer 3 protrudes from the upper surface of the glass glaze layer 2. A common electrode 4 and a large number of individual electrodes 5 are formed on the glass glaze layer 2 and the heat storage layer 3. The common electrode 4 has a large number of comb teeth 4 a that protrude toward the other end in the width direction of the substrate 1. The comb teeth 4 a and the individual electrodes 5 are alternately positioned in the length direction of the substrate 1. ing. On the heat storage layer 3, a resistance layer 6 is formed over almost the entire length of the substrate 1, and a part of the facing portion between each comb tooth 4 a and each individual electrode 5 is part of the heat storage layer 3 and the resistance layer 6. It is sandwiched between. The resistance layer 6 is covered with a protective layer 7, and the protective layer 7 is formed over the entire length of the substrate 1 from one end in the width direction to the other end side of the center. On the glass glaze layer 2, a plurality of drive ICs 8 are bonded in a row at the position of the other end in the width direction of the substrate 1. The output terminals of the drive IC 8 and the individual electrodes 5 are wire-bonded wires 9. Connected through.
[0037]
The substrate 1 is made of ceramic. The glass glaze layer 2 has a thickness of about 20 μm to 30 μm. The heat storage layer 3 is made of a polyimide resin having a high heat resistance, hardness, and adhesion to other objects as compared with a normal polyimide resin, such as a trade name Upilex (manufactured by Ube Industries Co., Ltd.). Is about 0.5 mm to 1.5 mm, and protrudes upward from the glass glaze layer 2 by about 10 μm to 20 μm. The common electrode 4 and the individual electrode 5 are made of a thick gold film, and the thickness is about 0.6 μm. The resistance layer 6 is made of a thick film obtained by firing a mixture of a polyimide resin and carbon powder as a resistance substance, and has a thickness of about 2 μm to 10 μm, preferably about 5 μm to 10 μm. The protective layer 7 is obtained by baking a mixture of a polyimide resin and an abrasion-resistant material such as aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), silicon carbide (SiC), or aluminum nitride (AlN). It consists of a thick film, and the thickness is about 2 μm to 10 μm, preferably about 5 μm to 10 μm. The drive IC 8 controls the energization to the resistance layer 6 in accordance with the print data. When the switching element built in the drive IC 8 corresponding to each individual electrode 5 is turned on, the anode of the power source, the common electrode 4. A closed loop composed of the comb-tooth portion 4a of the common electrode 4, the resistance layer 6, the individual electrode 5, the wire 9, the switching element of the driving IC 8 and the cathode of the power source is formed. The individual electrode 5 and the comb-tooth portions 4a on both sides thereof The resistance layer 6 between the two is energized.
[0038]
According to such a thermal print head, when the thickness of the heat storage layer 3 is 30 μm, the power consumption can be reduced to less than half compared to a thermal print head provided with a heat storage layer made of a conventional glass glaze. Confirmed by
[0039]
In the production of this thermal print head, glass is printed on a ceramic substrate 1 containing 96 percent alumina as shown in FIG. 3 as shown in FIG. 4 and fired at about 1200 degrees Celsius. The glaze layer 2 is formed. At this time, a groove-like valley 2a having a width of about 0.5 mm to 1.5 mm is formed in the glass glaze layer 2 over the entire length in the length direction. And as shown in FIG. 5, the high temperature gold | metal | money 11 is printed on the glass glaze layer 2, and it bakes at about 800 degree Celsius. Then, as shown in FIG. 6, a polyimide resin mucus is applied to the groove-shaped valley 2a formed by the glass glaze layer 2 on the substrate 1 by a method such as screen printing and baked at about 400 degrees Celsius. The heat storage layer 3 is formed. The polyimide resin mucus is, for example, a product obtained by condensing biphenyltetracarboxylic dianhydride (BPDA) and aromatic diamine in a solvent, and has a large solvent content, so that it is about 10 to 20 μm than the glass glaze layer 2. In order to form a thick film so as to protrude, it is necessary to repeat application and drying.
[0040]
And as shown in FIG. 7, the low temperature gold | metal | money 12 is printed on the thermal storage layer 3, and it bakes at about 400 degreeC-500 degreeC. At this time, the high temperature gold 11 and the low temperature gold 12 are connected to each other by printing so that both ends in the width direction of the low temperature gold 12 overlap the high temperature gold 11. And as shown in FIG. 8, the common electrode 4 and the individual electrode 5 are formed by removing the unnecessary part of the high temperature gold | metal | money 11 and the low temperature gold | metal | money 12 by photoetching. Then, as shown in FIG. 9 and FIG. 10, on the heat storage layer 3, a resistance paste made of a mixture of a polyimide resin and a resistance substance such as carbon powder is printed in a band shape and fired at about 400 degrees Celsius. The resistance layer 6 is formed. As this resistance paste, for example, a mixture of the same polyimide resin mucus and carbon black that has formed the heat storage layer 3 can be used. If the carbon black is 50 weight percent in the solid component, the resistivity is 290 Ω / m 2 per unit length, and if the carbon black is 43 weight percent in the solid component, the resistivity is 430 Ω / m 2. . Then, as shown in FIG. 11, the protective layer 7 is formed by printing a protective film paste made of a mixture of a polyimide-based resin and an abrasion-resistant material on the resistive layer 6 in a band shape and baking it at about 400 degrees Celsius. To do. As this protective film paste, for example, a mixture of the same polyimide resin mucus and silicon dioxide (SiO 2 ) powder that has formed the heat storage layer 3 can be used. Thereafter, a predetermined number of driving ICs 8 are bonded onto the glass glaze layer 2 at the other end in the width direction of the substrate 1, and the output terminals of the driving IC 8 and the individual electrodes 5 are connected by wires 9. And a thermal print head as shown in FIG. 2 is obtained.
[0041]
In the above embodiment, the common electrode 4 and the individual electrode 5 are formed by the high temperature gold 11 and the low temperature gold 12, but the individual electrode 5 can also be formed only by the low temperature gold. That is, the glass glaze layer 2 is formed as shown in FIG. 13 on the substrate 1 as shown in FIG. 12, and the heat storage layer 3 is formed in the valley 2a of the glass glaze layer 2 as shown in FIG. The low-temperature gold 13 is printed on the glass glaze layer 2 and the heat storage layer 3 and fired at about 400 to 500 degrees Celsius. Then, the common electrode 4 and the individual electrode 5 are formed by removing unnecessary portions of the low-temperature gold 13 by photoetching as shown in FIG. 16, and the resistance layer 6 is formed on the heat storage layer 3 as shown in FIGS. Then, as shown in FIG. 19, the protective layer 7 is formed on the resistance layer 6 and the driving IC 8 and the wire 9 are bonded, whereby a thermal print head as shown in FIGS. 1 and 2 is obtained.
[0042]
Moreover, although the trough part 2a was formed in the glass glaze layer 2 in the said embodiment, the glass glaze layer which does not have a trough part can also be used. That is, the glass glaze layer 14 is formed on the entire surface of the substrate 1 as shown in FIG. 20, the heat storage layer 3 is formed on the glass glaze layer 14 as shown in FIG. 21, and the glass glaze layer 14 and the heat storage layer as shown in FIG. A low temperature gold 13 is formed on the layer 3, and unnecessary portions of the low temperature gold 13 are removed by photo-etching as shown in FIG. 23 to form a common electrode 4 and individual electrodes 5, and heat storage as shown in FIGS. A resistive layer 6 is formed on the layer 3, a protective layer 7 is formed on the resistive layer 6 as shown in FIG. 26, and the driving IC 8 and the wire 9 are bonded. A print head is obtained.
[0043]
Moreover, in the said embodiment, although the glass glaze layer 2 or the glass glaze layer 14 was used, these do not need to be used. That is, the heat storage layer 3 is formed on the substrate 1 as shown in FIG. 29 as shown in FIG. 30, the low-temperature gold 13 is formed on the substrate 1 and the heat storage layer 3 as shown in FIG. 31, and the photo is shown in FIG. The common electrode 4 and the individual electrode 5 are formed by removing unnecessary portions of the low temperature gold 13 by etching, and the resistance layer 6 is formed on the heat storage layer 3 as shown in FIGS. 33 and 34, as shown in FIG. By forming the protective layer 7 on the resistance layer 6 and bonding the driving IC 8 and the wire 9, a thermal print head as shown in FIGS. 36 and 37 is obtained.
[0044]
Needless to say, high-temperature gold and low-temperature gold can be used in place of the low-temperature gold 13 even when the glass glaze layer 14 having no valley is used or when the glass glaze layer is not used. That is, when using the glass glaze layer 14, after forming the glass glaze layer 14 as shown in FIG. 20, high temperature gold | metal | money is formed except the formation formation position of the thermal storage layer 3 on it, as shown in FIG. After the heat storage layer 3 is formed, low temperature gold may be formed thereon. Further, when a glass glaze layer is not used, high-temperature gold is formed on the substrate 1 as shown in FIG. 29 except for the formation planned position of the heat storage layer 3, and after forming the heat storage layer 3 as shown in FIG. What is necessary is just to form low-temperature gold on it.
[Brief description of the drawings]
FIG. 1 is a plan view of a main part of a thermal print head provided with a heat generating device according to the present invention.
FIG. 2 is a cross-sectional view taken along the line AA in FIG.
3 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
4 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
5 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
6 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
7 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
8 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
9 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
10 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
11 is an explanatory diagram of a manufacturing process of the thermal print head shown in FIG. 1. FIG.
12 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1. FIG.
13 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1. FIG.
FIG. 14 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1;
FIG. 15 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1;
FIG. 16 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1;
FIG. 17 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1;
18 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1. FIG.
FIG. 19 is an explanatory diagram of a manufacturing process according to another embodiment of the thermal print head shown in FIG. 1;
FIG. 20 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 21 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 22 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 23 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 24 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 25 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 26 is an explanatory diagram of a manufacturing process of a thermal print head in another embodiment.
FIG. 27 is a plan view of a main part of a thermal print head according to another embodiment.
28 is a cross-sectional view taken along the line BB in FIG. 27. FIG.
FIG. 29 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
30 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment. FIG.
FIG. 31 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
FIG. 32 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
FIG. 33 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
FIG. 34 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
FIG. 35 is an explanatory diagram of a manufacturing process of a thermal print head in still another embodiment.
FIG. 36 is a plan view of an essential part of a thermal print head in still another embodiment.
37 is a cross-sectional view taken along the line CC in FIG. 36. FIG.
FIG. 38 is a cross-sectional view of a conventional heat generating device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Glass glaze layer 2a Valley part 3 Heat storage layer 4 Common electrode 4a Comb tooth part 5 Individual electrode 6 Resistance layer 7 Protective layer 8 Drive IC
9 Wire 11 High temperature gold 12 Low temperature gold 13 Low temperature gold 14 Glass glaze layer

Claims (8)

  1. A resistance layer that generates heat when energized, an electrode layer for energizing the resistance layer, a heat storage layer that stores heat generated by the resistance layer, and a protective layer that covers the resistance layer are formed on the substrate. A heating device for
    The heat storage layer is made of polyimide resin,
    While configuring the resistance layer and the electrode layer with a thick film ,
    The heating layer, wherein the resistance layer and the protective layer are mainly composed of a polyimide resin .
  2.   The heat generating device according to claim 1, wherein the heat storage layer is disposed only near the lower side of the resistance layer.
  3. A glass glaze layer is provided on the substrate except near the lower side of the resistance layer,
    The heat generating device according to claim 1 or 2 , wherein the heat storage layer is formed in close contact with the glass glaze layer in the vicinity of the lower side of the resistance layer where the glass glaze layer is not provided on the substrate.
  4. The heat generating device according to claim 3 , wherein a protruding height of the heat storage layer from the substrate is equal to or higher than a protruding height of the glass glaze layer from the substrate.
  5. The heat generating device according to claim 3 , wherein a protrusion height of the heat storage layer from the substrate is higher by 10 μm to 20 μm than a protrusion height of the glass glaze layer from the substrate.
  6. A resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and a heat storage layer made of a polyimide resin that stores heat generated by the resistive layer A method of manufacturing a heating device for manufacturing a heating device provided on a substrate,
    When forming the electrode layer, before the heat storage layer is formed, high temperature gold that can be baked at 800 degrees Celsius or higher is printed on a portion excluding the formation position of the heat storage layer, and the high temperature gold is printed on the polyimide resin. After the formation of the heat storage layer, low temperature gold that can be fired at 300 degrees Celsius or higher is printed on the heat storage layer, and the end portion is superimposed on the high temperature gold. The method for manufacturing a heat generating device is characterized in that the low-temperature gold is fired at a temperature lower than the deterioration point of the polyimide resin.
  7. A resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and a heat storage layer made of a polyimide resin that stores heat generated by the resistive layer A method of manufacturing a heating device for manufacturing a heating device provided on a substrate,
    A method of manufacturing a heating device, wherein when forming the resistance layer, a material obtained by mixing a polyimide-based resin and a resistance substance is printed with a thickness of 2 μm to 10 μm and fired.
  8. A resistive layer made of a thick film that generates heat when energized, an electrode layer made of a thick film for energizing the resistive layer, and a heat storage layer made of polyimide resin that stores heat generated by the resistive layer; A heating device manufacturing method for manufacturing a heating device provided with a protective layer covering the resistance layer on a substrate,
    A method of manufacturing a heating device, wherein when forming the protective layer, a material obtained by mixing a polyimide-based resin and an abrasion-resistant substance is printed with a thickness of 2 μm to 10 μm and fired.
JP7746497A 1997-03-28 1997-03-28 Heat generating device and manufacturing method thereof Expired - Fee Related JP3652831B2 (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP7746497A JP3652831B2 (en) 1997-03-28 1997-03-28 Heat generating device and manufacturing method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006321123A (en) * 2005-05-19 2006-11-30 Seiko Instruments Inc Heating resistor element, thermal head and ink jet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070034511A (en) * 2004-05-25 2007-03-28 로무 가부시키가이샤 Thermal print head and a method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006321123A (en) * 2005-05-19 2006-11-30 Seiko Instruments Inc Heating resistor element, thermal head and ink jet

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