JP2004195947A - Thermal head and thermal printer using it - Google Patents

Thermal head and thermal printer using it Download PDF

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Publication number
JP2004195947A
JP2004195947A JP2002370856A JP2002370856A JP2004195947A JP 2004195947 A JP2004195947 A JP 2004195947A JP 2002370856 A JP2002370856 A JP 2002370856A JP 2002370856 A JP2002370856 A JP 2002370856A JP 2004195947 A JP2004195947 A JP 2004195947A
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JP
Japan
Prior art keywords
protective film
thermal head
conductive film
recording medium
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002370856A
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Japanese (ja)
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JP2004195947A5 (en
Inventor
Shigetaka Shintani
重孝 新谷
Original Assignee
Kyocera Corp
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, 京セラ株式会社 filed Critical Kyocera Corp
Priority to JP2002370856A priority Critical patent/JP2004195947A/en
Publication of JP2004195947A publication Critical patent/JP2004195947A/en
Publication of JP2004195947A5 publication Critical patent/JP2004195947A5/ja
Pending legal-status Critical Current

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Abstract

Provided is a high-performance thermal head that enables a protective film to function satisfactorily for a long period of time and that can stabilize the conveyance state of a recording medium M.
A plurality of heating resistors are arranged on an upper surface of a substrate, and an electrode pattern connected to the heating resistor is attached to the heating resistor. In the thermal head covered with the conductive film 7, a conductive film 7 which is always or temporarily held at the ground potential is deposited on the protective film 6, and the conductive film 7 located immediately above the arrangement of the heating resistors 3 is formed. A groove 7a is provided on the substrate, and the surface of the protective film is exposed from the groove 7a.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a thermal head used as a printing device such as a facsimile or a video printer, and a thermal printer using the same.
[0002]
[Prior art]
Conventionally, a thermal head has been used as a printing device such as a facsimile or a video printer.
[0003]
In such a conventional thermal head, as shown in FIG. 7, for example, a plurality of heating resistors 23 and an electrode pattern 24 connected to the heating resistors 23 are attached on the upper surface of a substrate 21 made of alumina ceramic, A structure in which the body 23 and the electrode pattern 13 are covered with a protective film 26 is known, and a recording medium M such as thermal paper or an ink film is thermally transferred using a platen roller disposed directly above the heating resistor 23. While being conveyed onto the heating resistor 23 while being pressed against the head, a large number of heating resistors 23 are selectively and individually heated based on image data from the outside, and the recording medium M is heated by the heating resistor 23. The print is formed by bringing the heat generated by the heat generating resistor 23 into conduction with the recording medium M via the protective film 26 by slidingly contacting the upper protective film surface. It has become.
[0004]
The protective film 26 is made of an inorganic material having excellent wear resistance such as silicon nitride (Si 3 N 4 ) or sialon (Si—Al—O—N). It functions to protect the recording medium M from abrasion due to sliding contact and corrosion from contact with moisture or the like contained in the atmosphere.
[0005]
[Patent Document 1]
JP 2000-177158 A
[Problems to be solved by the invention]
In the above-described conventional thermal head, when the recording medium M is repeatedly slid on the surface of the protective film on the heating resistor, a part of the static electricity attached to the surface of the recording medium M is accumulated on the protective film 26. In addition, a discharge occurs between the protective film 26 and the heating resistor 23, and the dielectric breakdown of the protective film 26 occurs. As a result, there is a problem that the function as the protective film 26 is lost.
[0007]
Therefore, in order to solve the above problem, a conductive film made of an electric resistance material such as TaSiO or TaSiNO is deposited on the protective film 26, and the conductive film is held at the ground potential, so that the static electricity attached to the surface of the recording medium is reduced. It has been proposed to escape to ground via a conductive film.
[0008]
However, since the surface of the recording medium M is relatively rough with respect to such a conductive film, the friction between the recording medium M and the conductive film immediately above and near the heating resistor to which the pressing force from the platen roller is most easily transmitted. The force is particularly large, and therefore, a part of the recording medium M is shaved by the frictional force to generate a large amount of paper dust, and the recording medium M is caught on the paper waste and a new problem that the conveyance state becomes unstable. Trigger.
[0009]
The present invention has been made to solve the above two problems at the same time. The purpose of the present invention is to enable the protective film to function well for a long period of time and to stabilize the transport state of the recording medium M. An object of the present invention is to provide a possible high-performance thermal head and thermal printer.
[0010]
[Means for Solving the Problems]
In the thermal head of the present invention, a plurality of heating resistors are arranged on the upper surface of the substrate, an electrode pattern connected to the heating resistor is applied, and the heating resistor and the electrode pattern are covered with a protective film. In the thermal head, a conductive film that is always or temporarily held at the ground potential is deposited on the protective film, and a groove is formed in the conductive film located immediately above the arrangement of the heating resistors. The surface of the protective film is exposed.
[0011]
The thermal head according to the present invention is characterized in that the surface roughness of the surface of the protective film exposed from the groove is set to an arithmetic average roughness Ra of 0.03 μm or less.
[0012]
Further, the thermal head of the present invention is characterized in that the protective film in the groove and the conductive film near the groove are in contact with a platen roller disposed on the heating resistor via a recording medium. is there.
[0013]
According to another aspect of the invention, there is provided a thermal printer including the above-described thermal head and a platen roller that conveys a recording medium onto the thermal head.
[0014]
According to the thermal head of the present invention, the conductive film that is always or temporarily held at the ground potential is deposited on the protective film that covers the heating resistor, and the conductive film that is located immediately above the arrangement of the heating resistor is provided. Since a groove is formed in the film and the surface of the protective film is exposed from the groove, during recording operation, static electricity adhering to the surface of the recording medium can be released to the ground via the conductive film to which the recording medium slides. In addition to this, the recording medium is slid directly into contact with the surface of the protective film, which has a relatively small surface roughness, in the area directly above the heating resistor where the pressing force from the platen roller to the thermal head is most likely to increase. The frictional force with the head can be effectively reduced. Therefore, it is possible to effectively prevent the dielectric breakdown of the protective film and make the protective film function for a long period of time, and to effectively prevent the generation of paper waste due to the sliding contact of the recording medium and to stably transport the recording medium. Becomes possible.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line XX of the thermal head of FIG. 1, and FIG. 3 is an enlarged sectional view of a main part of FIG. The illustrated thermal head generally has a structure in which a heating resistor 3, an electrode pattern 4, a protective film 6, a conductive film 7, and an electrode wiring 8 are provided on an upper surface of a substrate 1.
[0016]
The substrate 1 is formed in a rectangular shape by using an insulating material such as alumina ceramics or a semiconductor material such as single crystal silicon provided with a silicon oxide film or a silicon nitride film on its surface. A plurality of heating resistors 3, an electrode pattern 4, a protective film 6, a conductive film 7, an electrode wiring 8, and the like are provided, and function as a supporting base material for supporting these.
[0017]
When such a substrate 1 is made of alumina ceramics, for example, an appropriate organic solvent / organic solvent is added to and mixed with a ceramic raw material powder such as alumina / silica / magnesia to form a slurry. A ceramic green sheet is obtained by employing a doctor blade method, a calendar roll method, or the like, and thereafter, the ceramic green sheet is punched into a rectangular shape, and then fired at a high temperature (about 1600 ° C.).
[0018]
On the upper surface of the substrate 1, a partial glaze layer 2 made of glass is attached in a band shape in the longitudinal direction of the substrate 1, and a plurality of heating resistors 3 are provided near the top.
[0019]
The partial glaze layer 2 is formed so as to have an arc-shaped cross section with a radius of curvature of 1 mm to 4 mm, for example, and the thickness of the top is set to 20 μm to 160 μm.
[0020]
Since the partial glaze layer 2 is formed of glass having low thermal conductivity (thermal conductivity: 0.7 W / m · K to 1.0 W / m · K), the heat generated by the heating resistor 3 inside the partial glaze layer 2. Of the thermal head to maintain good thermal response characteristics of the thermal head, specifically, as a heat storage layer for raising the temperature of the heating resistor 3 to a predetermined temperature required for printing in a short time. Make
[0021]
The plurality of heating resistors 3 are linearly arranged in the main scanning direction at a density of, for example, 600 dpi (dot per inch), and each is made of an electric resistance material such as TaSiO, TiSiO, or TiCSiO. Each of the heating resistors 3 has a width of 35 μm in the main scanning direction and a width of 70 μm in the sub-scanning direction.
[0022]
When a plurality of heat generating resistors 3 are supplied with electric power from the outside via the electrode patterns 4 connected to both ends thereof, Joule heat is generated, and the temperature required for forming a print on the thermal paper, for example, 150 ° C. Heat is generated to a temperature of from 400C to 400C.
[0023]
The electrode patterns 4 connected to both ends of each of the heating resistors 3 are made of a metal material such as aluminum (Al) or copper (Cu), and are connected to one end of the heating resistor 3 in common. A power supply terminal (Vh1) which is composed of a pattern 4a and an individual electrode pattern 4b individually connected to the other end of the heating resistor 3, and the common electrode pattern 4a is maintained at a predetermined potential (for example, 24 V). The individual electrode pattern 4b is connected to a first ground terminal (GND1) held at a ground potential (for example, 0 V) via a switching element or the like of the driver IC 5 to switch on / off the switching element of the driver IC 5. The energization of the heating resistor 3 is controlled.
[0024]
In the driver IC 5, electronic circuits such as a shift register, a latch circuit, a switching element, and a terminal are densely integrated on each circuit forming surface (lower surface). It has the function of causing the resistor 3 to selectively generate heat.
[0025]
As the driver IC 5, for example, a flip-chip type IC having an electronic circuit and terminals on its lower surface is used, and conventionally known face-down bonding, that is, solder bonding of the terminals of the driver IC 5 to the corresponding terminals on the electrode pattern 4. By doing so, the driver IC 5 is electrically connected to the electrode pattern 4.
[0026]
The plurality of heating resistors 3 and the pair of electrode patterns 4 are formed on a substrate so as to form a predetermined pattern by employing a conventionally known thin film forming technique, specifically, sputtering, photolithography, etching, or the like. 1 is formed and adhered on the upper surface.
[0027]
Also, the driver IC 5 forms an ingot made of single-crystal silicon by adopting, for example, the conventionally-known Choralski method (pulling method), and slices the ingot into a plate shape using a diamond cutter or the like. Thereafter, by adopting a conventionally well-known semiconductor manufacturing technique on one main surface of the plate body, the plate body is manufactured by integrating electronic circuits such as shift registers and latch circuits at a high density.
[0028]
On the other hand, a protective film 6 is provided on the heating resistor 3 and the electrode pattern 4, and the heating resistor 3 and the pair of electrode patterns 4 are commonly covered with the protection film 6.
[0029]
The protective film 6 is made of an inorganic material having excellent wear resistance such as silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), sialon (Si—Al—O—N), and the heating resistor 3. And the electrode patterns 4 and the electrode wirings 8 to be described later are protected from wear due to sliding contact of the recording medium M and corrosion due to contact with moisture or the like contained in the atmosphere.
[0030]
The above-described protective film 6 employs a conventionally known thin film forming technique, for example, a CVD (Chemical Vapor Deposition) method, sputtering, or the like, and is made of silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), sialon (Si— It is formed by depositing an inorganic material such as Al-ON) on the heating resistor 3, the electrode pattern 4, and the upper surface of the electrode wiring 8 described later in a thickness of 5 μm to 10 μm. Specifically, when the protective film 6 made of silicon nitride (Si 3 N 4 ) is formed by sputtering, a target made of a sintered body of silicon nitride (Si 3 N 4 ) is placed in the chamber of the sputtering apparatus. And a substrate 1 on which a heating resistor 3 and an electrode pattern are adhered, and a predetermined electric power is applied between the target material and the substrate 1 while introducing an argon gas into the chamber, thereby forming the target. It is formed by sputtering a material on a predetermined region of the substrate 1. At this time, the pressure in the chamber is set to 0.4 Pa to 0.6 Pa, and the substrate temperature is set to 150 ° C. to 200 ° C., whereby the surface roughness of the protective film 6 is reduced to an arithmetic average roughness Ra of 0.03 μm or less. Is set.
[0031]
A conductive film 7 is applied on the protective film 6 over the arrangement region of the heating resistors 3.
[0032]
The conductive film 7 is formed in a band shape in the main scanning direction by using Si, C, Ta-based electric resistance material such as TaSiO or TaSiNO (specific resistance 5 × 10 −4 Ω · cm to 2 × 10 4 Ω · cm). In addition, a groove 7a is formed in a region immediately above the arrangement of the heating resistors 3, and the surface of the protective film 6 is exposed from the groove 7a.
[0033]
One end of such a conductive film 7 is connected to a second ground terminal (GND2) which is maintained at a ground potential (for example, 0 V) via an electrode wiring 8, whereby the conductive film 7 is always kept at the ground potential. It has been held.
[0034]
For this reason, at the time of the recording operation, even if a large amount of static electricity is accumulated on the recording medium M conveyed on the heating resistor 3 using a platen roller or the like, a part of the recording medium M contacts the conductive film 7. At this time, the static electricity attached to the surface of the recording medium M is released to the ground via the conductive film 7. Therefore, a large amount of static electricity hardly accumulates on the protective film 6, and the dielectric breakdown of the protective film 6 can be effectively prevented, so that the protective film 6 can function well for a long period of time.
[0035]
Moreover, as described above, the conductive film 7 has the groove 7 formed in the region immediately above the arrangement of the heating resistors 3, and the surface of the protective film is exposed from the groove 7, so that the conductive film 7 can be moved from the platen roller. Immediately above the heating resistor 3 where the pressing force against the thermal head is the largest, the recording medium M is placed on the surface of the protective film having a relatively small surface roughness (0.03 μm or less in arithmetic average roughness Ra). Direct sliding contact can effectively reduce the frictional force between the recording medium M and the thermal head. Therefore, it is possible to effectively prevent the generation of paper waste due to the sliding contact of the recording medium M, and to stably convey the recording medium M.
[0036]
Here, if the surface roughness of the protective film exposed from the groove 7a is larger than 0.03 μm in arithmetic average roughness Ra, if the pressing force of the platen roller against the thermal head is particularly strong, the recording medium M may stick. There is. Also, since it is difficult to make the surface roughness of the protective film smaller than 0.005 μm in arithmetic average roughness Ra, the surface roughness of the protective film is 0.005 μm to 0.03 μm in arithmetic average roughness Ra. It is preferable to set the range.
[0037]
Preferably, the width of the groove 7a in the sub-scanning direction is set to be three to six times the width of the heating resistor 3 in the sub-scanning direction. If the width of the body 3 in the sub-scanning direction is smaller than three times, the area where the protective film 6 is exposed is small. Therefore, when the pressing force of the platen roller against the thermal head is particularly strong, the distance between the recording medium M and the thermal head is reduced. On the other hand, if the width of the groove 7a in the sub-scanning direction is larger than the width of the heating resistor 3 in the sub-scanning direction by 6 times, the effect of reducing the frictional force tends to decrease. And the conductive film 7 are hardly in contact with each other, and the static electricity of the recording medium may not be easily released through the conductive film. Therefore, the width of the groove 7a in the sub-scanning direction is preferably set to be three to six times the width of the heating resistor 3 in the sub-scanning direction.
[0038]
In this embodiment, as shown in FIGS. 4 and 5, the inner surface of the groove 7'a is inclined outward so that the opening area of the groove 7'a gradually increases as approaching the recording medium M side. This makes it easier for the recording medium M to come into contact with the surface of the protective film, thereby further increasing the effect of reducing the frictional force between the recording medium M and the thermal head. There is an advantage that the recording medium M is effectively prevented from being damaged at the formed corners.
[0039]
Moreover, in this case, since the inner surface of the groove 7'a and the surface of the protective film are continuous surfaces with small steps, the stress due to the friction of the recording medium is reduced by the boundary between the inner surface of the groove 7'a and the surface of the protective film. Concentration can be effectively prevented, and the occurrence of peeling of the conductive film 7 starting from the groove 7'a can be almost eliminated.
[0040]
The inner surface of the groove 7'a is preferably inclined at an angle of 60 to 85 degrees with respect to a vertical direction (a direction orthogonal to the upper surface of the substrate 1). If the thickness is smaller than the above range, when the pressing force of the platen roller against the thermal head is particularly strong, the recording medium M may be damaged at a corner formed by the groove 7′a and the surface of the conductive film 7 ′, If the inclination angle of the inner surface of the groove 7'a is larger than the above range, it becomes difficult to process the groove 7'a.
[0041]
Similar to the protective film 6, the conductive film 7 described above employs a conventionally known thin film forming technique, for example, a CVD method or sputtering, and applies an electric resistance material such as TaSiO or TaSiNO to a predetermined region on the upper surface of the protective film 6. A groove 7a is formed in a predetermined region of the conductive film 7 by applying a conventionally known photolithography technique and an etching technique, by applying the film to a thickness of 0.02 μm to 0.2 μm. The surface roughness of the conductive film 7 thus formed is 0.05 μm to 0.08 μm in arithmetic average roughness Ra. The groove 7a is formed by polishing the lapping film over the region immediately above the heating resistor with respect to the surface of the conductive film, in addition to the etching technique.
[0042]
On the other hand, at one end of the conductive film 7, an electrode wiring 8 is formed in a predetermined pattern from a metal material such as aluminum (Al) or copper (Cu), and connects the conductive film 7 to a second ground terminal (GND2). Thus, the conductive film 7 functions to keep the conductive film 7 at the ground potential. The electrode wirings 8 are simultaneously formed by the same method as the electrode pattern 4 described above.
[0043]
As shown in FIG. 6, the thermal printer incorporating the above-described thermal head includes a platen roller 9 and transport rollers 10a, 10b, 10c, and 10d.
[0044]
The platen roller 9 is a cylindrical member in which butadiene rubber or the like is wound around a shaft core made of a metal such as SUS to a thickness of about 3 mm to 15 mm, and is rotatable on the heating resistor 3 of the thermal head T. The recording medium M is transported in the sub-scanning direction (the direction of the arrow in the figure) while pressing the recording medium M against the surface of the protective film on the heating resistor 3.
[0045]
The surface of the platen roller 9 is in contact with the surface of the protective film in the groove 7a and the surface of the conductive film near the protective film via the recording medium. And the conductive film is simultaneously contacted, so that the static electricity attached to the recording medium can be removed and the paper waste of the recording medium can be prevented at the same time.
[0046]
The transport rollers 10a, 10b, 10c, and 10d have outer peripheral portions formed of metal, rubber, or the like. The transport rollers 10a, 10b, 10c, and 10d are formed of metal, rubber, or the like. The recording medium M is supported by the transport rollers 10a, 10b, 10c, and 10d and the platen roller 9 described above.
[0047]
At the same time, a large number of heating resistors 3 are selectively Joule-heated with the driving of the driver IC 5, and the heat is transferred to the recording medium M via the protective film 6 and the conductive film 7, thereby printing a predetermined image. It is formed.
[0048]
Note that the present invention is not particularly limited to the above-described embodiment, and various changes and improvements can be made without departing from the spirit of the present invention.
[0049]
For example, in the above-described embodiment, the conductive film 7 is always held at the ground potential. Alternatively, the conductive film 7 may be temporarily held at the ground potential.
[0050]
In the above-described embodiment, the conductive film 7 may be formed of the same material as the heating resistor 3 or a multilayer structure. In the latter case, the specific resistance of the lowermost layer is 1 × 10 7. When the resistance is set to Ω · cm or more, an electrical short circuit between the conductive film and the electrode can be prevented extremely well even if many pinholes and the like occur in the protective film serving as the base of the conductive film.
[0051]
Further, in the above embodiment, it goes without saying that the protective film 6 may have a multilayer structure of two or more layers.
[0052]
【The invention's effect】
According to the thermal head of the present invention, the conductive film that is always or temporarily held at the ground potential is deposited on the protective film that covers the heating resistor, and the conductive film that is located immediately above the arrangement of the heating resistor is provided. Since a groove is formed in the film and the surface of the protective film is exposed from the groove, during recording operation, static electricity adhering to the surface of the recording medium can be released to the ground via the conductive film to which the recording medium slides. In addition to this, the recording medium is slid directly into contact with the surface of the protective film, which has a relatively small surface roughness, in the area directly above the heating resistor where the pressing force from the platen roller to the thermal head is most likely to increase. The frictional force with the head can be effectively reduced. Therefore, it is possible to effectively prevent the dielectric breakdown of the protective film and make the protective film function for a long period of time, and to effectively prevent the generation of paper waste due to the sliding contact of the recording medium and to stably transport the recording medium. Becomes possible.
[Brief description of the drawings]
FIG. 1 is a plan view of a thermal head according to an embodiment of the present invention.
FIG. 2 is a sectional view taken along line XX of the thermal head of FIG.
FIG. 3 is an enlarged sectional view of a main part of FIG. 2;
FIG. 4 is a sectional view of a thermal head according to another embodiment of the present invention.
FIG. 5 is an enlarged sectional view of a main part of FIG.
FIG. 6 is a schematic view of a thermal printer configured using the thermal head of FIG.
FIG. 7 is a sectional view of a conventional thermal head.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Partial glaze layer 3 ... Heating resistor 4 ... Electrode pattern 4a ... Common electrode pattern 4b ... Individual electrode pattern 5 ... Driver IC
6 ... Protective films 7, 7 '... Conductive films 7a, 7'a ... Groove 8 ... Electrode wiring 9 ... Platen rollers 10a, 10b, 10c, 10d ... Transport rollers GND1 .. First ground terminal GND2 second ground terminal Vh1 power supply terminal Vh2 second power supply terminal T thermal head SW switching means M recording medium

Claims (4)

  1. On a top surface of the substrate, a plurality of heating resistors are arranged, and an electrode pattern connected to the heating resistor is attached, and the heating resistor and the electrode pattern are covered with a protective film.
    On the upper surface of the protective film, a conductive film that is always or temporarily held at the ground potential is deposited, and a groove is provided in at least a region immediately above the arrangement of the heating resistors in the conductive film, thereby protecting the conductive film from the groove. A thermal head having a film surface exposed.
  2. A thermal head, wherein the surface roughness of the surface of the protective film exposed from the groove is set to an arithmetic average roughness Ra of 0.03 μm or less.
  3. 3. The method according to claim 1, wherein the protective film in the groove and the conductive film near the groove are in contact with a platen roller disposed on the heating resistor via a recording medium. 4. Thermal head.
  4. 4. A thermal printer comprising: the thermal head according to claim 1; and a platen roller that conveys a recording medium onto the thermal head.
JP2002370856A 2002-12-20 2002-12-20 Thermal head and thermal printer using it Pending JP2004195947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002370856A JP2004195947A (en) 2002-12-20 2002-12-20 Thermal head and thermal printer using it

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Application Number Priority Date Filing Date Title
JP2002370856A JP2004195947A (en) 2002-12-20 2002-12-20 Thermal head and thermal printer using it

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JP2004195947A5 JP2004195947A5 (en) 2006-03-02

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791625B2 (en) 2007-11-30 2010-09-07 Tdk Corporation Thermalhead, method for manufacture of same, and printing device provided with same
WO2012115231A1 (en) * 2011-02-25 2012-08-30 京セラ株式会社 Thermal head and thermal printer equipped with same
JP2014124835A (en) * 2012-12-26 2014-07-07 Kyocera Corp Thermal head and thermal printer comprising the same
JP2015182447A (en) * 2014-03-26 2015-10-22 京セラ株式会社 Thermal head, manufacturing method for thermal head and thermal printer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791625B2 (en) 2007-11-30 2010-09-07 Tdk Corporation Thermalhead, method for manufacture of same, and printing device provided with same
WO2012115231A1 (en) * 2011-02-25 2012-08-30 京セラ株式会社 Thermal head and thermal printer equipped with same
US8803931B2 (en) 2011-02-25 2014-08-12 Kyocera Corporation Thermal head and thermal printer including the same
JP5744171B2 (en) * 2011-02-25 2015-07-01 京セラ株式会社 Thermal head and thermal printer equipped with the same
JP2014124835A (en) * 2012-12-26 2014-07-07 Kyocera Corp Thermal head and thermal printer comprising the same
JP2015182447A (en) * 2014-03-26 2015-10-22 京セラ株式会社 Thermal head, manufacturing method for thermal head and thermal printer

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