JPS6041051U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6041051U JPS6041051U JP13329783U JP13329783U JPS6041051U JP S6041051 U JPS6041051 U JP S6041051U JP 13329783 U JP13329783 U JP 13329783U JP 13329783 U JP13329783 U JP 13329783U JP S6041051 U JPS6041051 U JP S6041051U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- printed
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の帯電防止剤を被覆した樹脂封止型半導体
装置の断面図、第２図ａは本考案の実施例を示す平面図
、第２図すはその断面図を示す。
尚、図において、１１，２１・・・帯電防止剤の被覆膜
、１３・・・モールド、１４・・・リード、２２・・・
捺印される部分、２５・・・捺印面、である。FIG. 1 is a sectional view of a conventional resin-sealed semiconductor device coated with an antistatic agent, FIG. 2a is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. In the figure, 11, 21... antistatic agent coating film, 13... mold, 14... lead, 22...
The part to be stamped is 25...the stamping surface.
Claims (1)
捺印される部分を除いて周囲を帯電防止剤で被覆したこ
とを特徴とする樹脂封止型半導体装置。1. A resin-sealed semiconductor device characterized in that a surface of the resin-sealed semiconductor device on which a seal is printed is coated with an antistatic agent except for the portion of the surface where the seal is printed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13329783U JPS6041051U (en) | 1983-08-29 | 1983-08-29 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13329783U JPS6041051U (en) | 1983-08-29 | 1983-08-29 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6041051U true JPS6041051U (en) | 1985-03-23 |
Family
ID=30300737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13329783U Pending JPS6041051U (en) | 1983-08-29 | 1983-08-29 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6041051U (en) |
-
1983
- 1983-08-29 JP JP13329783U patent/JPS6041051U/en active Pending
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