JPS60166151U - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS60166151U
JPS60166151U JP1984052155U JP5215584U JPS60166151U JP S60166151 U JPS60166151 U JP S60166151U JP 1984052155 U JP1984052155 U JP 1984052155U JP 5215584 U JP5215584 U JP 5215584U JP S60166151 U JPS60166151 U JP S60166151U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
semiconductor integrated
semiconductor
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984052155U
Other languages
Japanese (ja)
Inventor
小堀　良夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984052155U priority Critical patent/JPS60166151U/en
Publication of JPS60166151U publication Critical patent/JPS60166151U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05073—Single internal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体集積回路装置の断面図、第２図は
本考案の一実施例の断面図である。 １・・・・・・半導体ペレット、２，４・・・・・・ポ
ンディングパッド、３・・・・・・パシベーション膜、
５・俸・・・・Ａ１層、６・・・・・・Ｔｉ−Ｐｔ層。FIG. 1 is a sectional view of a conventional semiconductor integrated circuit device, and FIG. 2 is a sectional view of an embodiment of the present invention. 1...Semiconductor pellet, 2,4...Ponding pad, 3...Passivation film,
5. Salary... A1 layer, 6... Ti-Pt layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレット上に設けたアルミニウムのポン゛　ディ
ングパッド表面が、水分に対し化学反応を起し難い金属
で被われていることを特徴とする一半導体集積回路装置
。A semiconductor integrated circuit device characterized in that the surface of an aluminum bonding pad provided on a semiconductor pellet is covered with a metal that does not easily cause a chemical reaction with moisture.
JP1984052155U 1984-04-10 1984-04-10 Semiconductor integrated circuit device Pending JPS60166151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984052155U JPS60166151U (en) 1984-04-10 1984-04-10 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984052155U JPS60166151U (en) 1984-04-10 1984-04-10 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS60166151U true JPS60166151U (en) 1985-11-05

Family

ID=30571852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984052155U Pending JPS60166151U (en) 1984-04-10 1984-04-10 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS60166151U (en)

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