JPS6133453U - lead frame - Google Patents

lead frame

Info

Publication number
JPS6133453U
JPS6133453U JP1984117304U JP11730484U JPS6133453U JP S6133453 U JPS6133453 U JP S6133453U JP 1984117304 U JP1984117304 U JP 1984117304U JP 11730484 U JP11730484 U JP 11730484U JP S6133453 U JPS6133453 U JP S6133453U
Authority
JP
Japan
Prior art keywords
lead frame
leads
abstract
film
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984117304U
Other languages
Japanese (ja)
Inventor
晋 中森
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984117304U priority Critical patent/JPS6133453U/en
Publication of JPS6133453U publication Critical patent/JPS6133453U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の実施例によるテープ・キャリア方式
のリード・フレームの半導体装置搭載側を拡大した平面
図、第２図は、従来のテープ・キャリア方式のリード・
フレームの平面図、第３図は、従来のテープ・キャリア
方式のリード・フレームの半導体装置搭載側の拡大図で
ある。 尚図において、１・・・テープ、２・・・スプロケット
、ホール、３・・・リード、４・・・デバイス・ホール
、５・・・半導体装置、６・・・半導体装置支持用リー
ドである。FIG. 1 is an enlarged plan view of the semiconductor device mounting side of a tape carrier type lead frame according to an embodiment of the present invention, and FIG. 2 is an enlarged plan view of a conventional tape carrier type lead frame.
The plan view of the frame, FIG. 3, is an enlarged view of the semiconductor device mounting side of a conventional tape carrier type lead frame. In the figure, 1...Tape, 2...Sprocket, hole, 3...Lead, 4...Device hole, 5...Semiconductor device, 6...Semiconductor device support lead. .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長尺状の絶縁性フイルム上にリードパターンが密着して
形成されたリード・フレームにおいて、フイルム上の一
部のリードを他のリードより硬質の材質で形成したこと
を特徴とするリードフレーム。A lead frame in which a lead pattern is formed in close contact with a long insulating film, wherein some of the leads on the film are made of a harder material than other leads.
JP1984117304U 1984-07-31 1984-07-31 lead frame Pending JPS6133453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984117304U JPS6133453U (en) 1984-07-31 1984-07-31 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984117304U JPS6133453U (en) 1984-07-31 1984-07-31 lead frame

Publications (1)

Publication Number Publication Date
JPS6133453U true JPS6133453U (en) 1986-02-28

Family

ID=30676218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984117304U Pending JPS6133453U (en) 1984-07-31 1984-07-31 lead frame

Country Status (1)

Country Link
JP (1) JPS6133453U (en)

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