JPS6039855A - 液冷モジユ−ル - Google Patents

液冷モジユ−ル

Info

Publication number
JPS6039855A
JPS6039855A JP14777783A JP14777783A JPS6039855A JP S6039855 A JPS6039855 A JP S6039855A JP 14777783 A JP14777783 A JP 14777783A JP 14777783 A JP14777783 A JP 14777783A JP S6039855 A JPS6039855 A JP S6039855A
Authority
JP
Japan
Prior art keywords
cooling
refrigerant
substrates
cooling plate
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14777783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0342511B2 (enrdf_load_stackoverflow
Inventor
Kishio Yokouchi
貴志男 横内
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14777783A priority Critical patent/JPS6039855A/ja
Publication of JPS6039855A publication Critical patent/JPS6039855A/ja
Publication of JPH0342511B2 publication Critical patent/JPH0342511B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14777783A 1983-08-12 1983-08-12 液冷モジユ−ル Granted JPS6039855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14777783A JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14777783A JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Publications (2)

Publication Number Publication Date
JPS6039855A true JPS6039855A (ja) 1985-03-01
JPH0342511B2 JPH0342511B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=15437945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14777783A Granted JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Country Status (1)

Country Link
JP (1) JPS6039855A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
JPH06169039A (ja) * 1992-12-01 1994-06-14 Kofu Nippon Denki Kk 浸漬ｄｃ−ｄｃコンバータ冷却器
JP2018018857A (ja) * 2016-07-25 2018-02-01 富士通株式会社 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法
CN117840459A (zh) * 2024-03-06 2024-04-09 东北大学 一种配备冷却系统的激光定向能量沉积系统

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
JPH06169039A (ja) * 1992-12-01 1994-06-14 Kofu Nippon Denki Kk 浸漬ｄｃ−ｄｃコンバータ冷却器
JP2018018857A (ja) * 2016-07-25 2018-02-01 富士通株式会社 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法
CN117840459A (zh) * 2024-03-06 2024-04-09 东北大学 一种配备冷却系统的激光定向能量沉积系统
CN117840459B (zh) * 2024-03-06 2024-06-11 东北大学 一种配备冷却系统的激光定向能量沉积系统

Also Published As

Publication number Publication date
JPH0342511B2 (enrdf_load_stackoverflow) 1991-06-27

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