JPH0321093B2 - - Google Patents
Info
- Publication number
- JPH0321093B2 JPH0321093B2 JP8069585A JP8069585A JPH0321093B2 JP H0321093 B2 JPH0321093 B2 JP H0321093B2 JP 8069585 A JP8069585 A JP 8069585A JP 8069585 A JP8069585 A JP 8069585A JP H0321093 B2 JPH0321093 B2 JP H0321093B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- medium
- container
- boiling
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8069585A JPS61239654A (ja) | 1985-04-16 | 1985-04-16 | 浸漬液冷装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8069585A JPS61239654A (ja) | 1985-04-16 | 1985-04-16 | 浸漬液冷装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61239654A JPS61239654A (ja) | 1986-10-24 |
| JPH0321093B2 true JPH0321093B2 (enrdf_load_stackoverflow) | 1991-03-20 |
Family
ID=13725461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8069585A Granted JPS61239654A (ja) | 1985-04-16 | 1985-04-16 | 浸漬液冷装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61239654A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5018555B2 (ja) * | 2008-02-29 | 2012-09-05 | 日本電気株式会社 | 冷却モジュール及び複合実装基板 |
-
1985
- 1985-04-16 JP JP8069585A patent/JPS61239654A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61239654A (ja) | 1986-10-24 |