JPH0342511B2 - - Google Patents

Info

Publication number
JPH0342511B2
JPH0342511B2 JP14777783A JP14777783A JPH0342511B2 JP H0342511 B2 JPH0342511 B2 JP H0342511B2 JP 14777783 A JP14777783 A JP 14777783A JP 14777783 A JP14777783 A JP 14777783A JP H0342511 B2 JPH0342511 B2 JP H0342511B2
Authority
JP
Japan
Prior art keywords
cooling
cooling plate
liquid
module
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14777783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6039855A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14777783A priority Critical patent/JPS6039855A/ja
Publication of JPS6039855A publication Critical patent/JPS6039855A/ja
Publication of JPH0342511B2 publication Critical patent/JPH0342511B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14777783A 1983-08-12 1983-08-12 液冷モジユ−ル Granted JPS6039855A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14777783A JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14777783A JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Publications (2)

Publication Number Publication Date
JPS6039855A JPS6039855A (ja) 1985-03-01
JPH0342511B2 true JPH0342511B2 (enrdf_load_stackoverflow) 1991-06-27

Family

ID=15437945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14777783A Granted JPS6039855A (ja) 1983-08-12 1983-08-12 液冷モジユ−ル

Country Status (1)

Country Link
JP (1) JPS6039855A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
JP2989976B2 (ja) * 1992-12-01 1999-12-13 甲府日本電気株式会社 回路冷却器
JP6720752B2 (ja) * 2016-07-25 2020-07-08 富士通株式会社 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法
CN117840459B (zh) * 2024-03-06 2024-06-11 东北大学 一种配备冷却系统的激光定向能量沉积系统

Also Published As

Publication number Publication date
JPS6039855A (ja) 1985-03-01

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