JPH0342511B2 - - Google Patents
Info
- Publication number
- JPH0342511B2 JPH0342511B2 JP14777783A JP14777783A JPH0342511B2 JP H0342511 B2 JPH0342511 B2 JP H0342511B2 JP 14777783 A JP14777783 A JP 14777783A JP 14777783 A JP14777783 A JP 14777783A JP H0342511 B2 JPH0342511 B2 JP H0342511B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling plate
- liquid
- module
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 15
- 239000003507 refrigerant Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
- 238000009835 boiling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は高密度実装したプリント配線モジユー
ルの強制冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a forced cooling structure for printed wiring modules mounted in high density.
(b) 技術の背景
半導体IC、LSIは年と共に高密度化が進んでお
り、単位素子中の構成ビツト数は年と共に増加し
ている。またこれらIC、LSIのプリント配線基板
への実装密度も増加し従つて10層を越す多層配線
構造がとられている。(b) Background of technology Semiconductor ICs and LSIs are becoming denser over the years, and the number of constituent bits in a unit element is increasing over the years. Furthermore, the mounting density of these ICs and LSIs on printed wiring boards has increased, and accordingly, multilayer wiring structures with more than 10 layers have been adopted.
こゝでプリント配線基板上には上記のIC、LSI
などの半導体素子以外にモジユール抵抗など発熱
素子が数多く設けられているのでプリント配線基
板（以下略して基板）は使用中にかなりの温度上
昇を伴う。そしてこの対策として基板をポリイミ
ド樹脂のような耐熱性有機絶縁材料で形成するか
或はアルミナなどの磁器で形成して基板の耐熱性
を高めている。一方基板上への装着部品は一般に
最高使用温度として85〔℃〕の値がとられている
ので、部品の信頼性と寿命を保持するためにはこ
の規定温度以内に保つことが必要でそのため冷却
が必要となる。本発明は高密度実装基板の冷却機
構に関するものである。 Here, the above IC and LSI are installed on the printed wiring board.
Printed wiring boards (hereinafter simply referred to as "boards") are subject to a considerable temperature rise during use because they are provided with a large number of heat generating elements such as modular resistors in addition to semiconductor elements such as these. As a countermeasure to this problem, the heat resistance of the substrate is increased by forming the substrate from a heat-resistant organic insulating material such as polyimide resin or from porcelain such as alumina. On the other hand, the maximum operating temperature for components mounted on a board is generally 85 [℃], so in order to maintain the reliability and lifespan of the components, it is necessary to maintain the temperature within this specified temperature. Is required. The present invention relates to a cooling mechanism for a high-density mounting board.
(c) 従来技術と問題点
従来の冷却法は、IC、LSIなどの半導体部品に
ついてはパツケージ上に放熱フインを設けこれに
扇風機（以後フアン）を用いて空冷するのが一般
的である。すなわち架台に部品の実装高に見合つ
た間隔をとつて配列している多数のコネクタに部
品装着が終つた基板の雄コンタクト部を挿入する
ことにより全部の基板を装着し、架台の下部に設
けられたフアンを用いて送風することにより並列
に並んでいる基板の間を通つて風が通り強制空冷
が行われている。然し乍ら部品の実装密度特に
IC、LSIの実装密度が増大しまたIC、LSI自体の
構成ビツト数が増加すると強制通風によつては部
品の温度を最高使用温度以内に保持することは不
可能となり、別の方法を必要とするようになつ
た。(c) Conventional technology and problems In conventional cooling methods, semiconductor components such as ICs and LSIs are generally cooled by installing heat dissipation fins on the package and using an electric fan (hereinafter referred to as "fan"). In other words, all the boards are mounted by inserting the male contacts of the board on which the components have been mounted into the numerous connectors arranged at intervals commensurate with the mounting height of the parts on the mount, and then Forced air cooling is performed by blowing air using a fan that passes between the boards arranged in parallel. However, the mounting density of parts, especially
As the packaging density of ICs and LSIs increases, and the number of bits constituting the ICs and LSIs themselves increases, it becomes impossible to maintain component temperatures within the maximum operating temperature using forced ventilation, and other methods are required. I started to do that.
本発明に係る液冷モジユールはかゝる必要性か
ら生じたものである。 The liquid cooling module of the present invention arose from such a need.
第１図は従来の液冷モジユールの構造でLSI、
抵抗などの発熱素子１を装着した基板２を密封容
器３の底部に置き容器３を上部にはフイン４を備
えた冷却板５があり、この中に冷媒６が入れてあ
る。こゝで発熱素子１が通電により発熱して生じ
た気泡或は冷媒６の温度上昇により液面から発生
した冷媒の蒸気は冷却板５で冷却されて液化し、
滴下すると云うサイクルを繰返すことにより発熱
素子１を含む基板２の冷却が行われている。 Figure 1 shows the structure of a conventional liquid cooling module.
A substrate 2 mounted with a heat generating element 1 such as a resistor is placed at the bottom of a sealed container 3, and a cooling plate 5 with fins 4 is provided on the top of the container 3, into which a refrigerant 6 is placed. Here, the bubbles generated when the heating element 1 generates heat due to the energization or the refrigerant vapor generated from the liquid surface due to the temperature rise of the refrigerant 6 are cooled by the cooling plate 5 and liquefied.
By repeating the cycle of dropping, the substrate 2 including the heating element 1 is cooled.
然し乍ら容器３の内部を冷媒６のガスだけで充
すことは困難であり、空気などが混在し易く、こ
の場合は冷却能力が著しく低下する缺点があり、
優れた冷却構造であるとは云えなかつた。 However, it is difficult to fill the inside of the container 3 with only the gas of the refrigerant 6, and air etc. are likely to be mixed in, and in this case, there is a drawback that the cooling capacity is significantly reduced.
It could not be said that the cooling structure was excellent.
(d) 発明の目的
本発明の目的は冷却機能の優れた液冷モジユー
ルの構造を提供するにある。(d) Object of the invention The object of the invention is to provide a liquid cooling module structure with excellent cooling function.
(e) 発明の構成
本発明の目的は冷媒液を入れた密封容器の中に
モジユールを構成する配線基板を垂直にして浸漬
して格納すると共に、この配線基板の相互間に冷
却板をおき、この冷却板を冷却することにより配
線基板を強制冷却する構造をとることにより達成
することができる。(e) Structure of the Invention The object of the present invention is to store the wiring boards constituting a module by vertically immersing them in a sealed container containing a refrigerant liquid, and to place a cooling plate between the wiring boards. This can be achieved by adopting a structure in which the wiring board is forcibly cooled by cooling the cooling plate.
(f) 発明の実施例
本発明は複数個の基板を縦にして冷媒液中に配
列すると共にこの基板の間に冷却板を介在させて
冷却を行うものである。(f) Embodiments of the Invention In the present invention, a plurality of substrates are arranged vertically in a refrigerant liquid, and cooling is performed by interposing a cooling plate between the substrates.
第２図は本発明の実施例で密封容器７の底部に
は気密構造のコネクタ端子８が設けられており、
基板９のオスコンタクトが挿着されるよう構成さ
れている。次に縦に平行に配列している基板９の
間には多孔金属を外側に持ち内部に蛇管を備えた
冷却板１０が配列しており、上部より冷媒（この
実施例の場合は水）が供給され循還している。 FIG. 2 shows an embodiment of the present invention, in which an airtight connector terminal 8 is provided at the bottom of a sealed container 7.
It is configured so that a male contact of the board 9 can be inserted. Next, cooling plates 10 having porous metal on the outside and corrugated pipes on the inside are arranged between the substrates 9 arranged vertically in parallel, and a coolant (water in this embodiment) is supplied from the top. It is supplied and circulated.
また基板９を完全に浸漬する形で冷媒１１が入
れてある。 Further, a coolant 11 is placed in such a manner that the substrate 9 is completely immersed therein.
こゝで冷媒としては化学的に安定であつて腐食
作用を伴わずまた沸点が室温から85〔℃〕以内の
液体を用いることが必要であり、この条件を満す
ものとしてはCmF2m+2（但しｍは正数）の分子式
で表わされるフルオロカーボンがある。例えば
C5F12の沸点は30〔℃〕であり、C6F14は56〔℃〕で
あり、かつ腐食性はない。また冷却板１０は第３
図に断面構造を示すように銅（Cu）製の蛇管１
２の外側を極めて多孔質な板状の発泡金属で覆つ
たもので泡状の空隙部１３を通つて沸騰によつて
生じた気泡および冷媒は自由に通過することがで
き、気泡の通過速度は、ゆるやかになるので蛇管
１２に水を通じて冷却すれば通常の蛇管だけに較
べて遥かに大きな冷却効果を生ずることができ
る。 As a refrigerant, it is necessary to use a liquid that is chemically stable, does not cause corrosive effects, and has a boiling point within 85 [℃] of room temperature.CmF 2 m + There is a fluorocarbon represented by the molecular formula 2 (where m is a positive number). for example
The boiling point of C 5 F 12 is 30 [°C], and that of C 6 F 14 is 56 [°C], and is not corrosive. Further, the cooling plate 10 is
Copper (Cu) flexible pipe 1 as shown in the figure shows the cross-sectional structure.
2 is covered with an extremely porous plate-shaped foamed metal, through which air bubbles generated by boiling and the refrigerant can freely pass through the foam-like voids 13, and the passing speed of the air bubbles is , so that if water is passed through the corrugated tube 12 for cooling, a much greater cooling effect can be produced than with a normal corrugated tube alone.
さて基板９の上に設けられているLSIや抵抗モ
ジユールなどの発熱素子１は通電の際の温度上昇
により冷媒１１の沸点以上の温度になるので発熱
素子１が沸騰源となつて気泡の発生が起る。こゝ
で発熱素子１は縦に並んだ基板９の上に密に装着
されているので下方の発熱素子１で発生した気泡
が、上方にある発熱素子１を覆い冷媒との接触を
遮断し易く、この場合は冷却効果を無くしてしま
う。それ故に発生した気泡は速かに冷却して戻す
ことが必要で液面にまで上昇しないよう工夫する
必要がある。本発明に係る冷却板１０はこの対策
の１つで冷却板１０と発熱素子１との間隔を狭め
て配置することが必要である。更に有効な方法は
第４図に示すように基板９の上に配列している発
熱素子１の間にガス誘導板１４を基板９に直角に
且つ容器の底面に平行に設け、下方の発熱素子１
から発生した気泡１５が上方の発熱素子１に当ら
ないよう工夫されている。 Now, the heating element 1, such as an LSI or a resistance module, provided on the substrate 9 becomes heated to a temperature higher than the boiling point of the refrigerant 11 due to the temperature rise when electricity is applied, so the heating element 1 becomes a boiling source and bubbles are generated. It happens. Since the heating elements 1 are closely mounted on the vertically arranged substrates 9, air bubbles generated in the lower heating elements 1 easily cover the upper heating elements 1 and cut off contact with the refrigerant. , in this case, the cooling effect will be lost. Therefore, it is necessary to quickly cool and return the generated bubbles, and it is necessary to take measures to prevent them from rising to the liquid level. The cooling plate 10 according to the present invention is one of the measures against this problem, and it is necessary to narrow the distance between the cooling plate 10 and the heating element 1. A more effective method is to provide a gas guide plate 14 between the heating elements 1 arranged on the substrate 9 at right angles to the substrate 9 and parallel to the bottom of the container, as shown in FIG. 1
It is designed to prevent the bubbles 15 generated from hitting the heating element 1 above.
また気泡１５は冷却板１０に触れ急速に液化す
ることが望ましくそのためにはガス誘導板１４は
冷却板１０に殆んど接触する程度にまで近づける
ことが必要である。次に冷却板１０への冷却は第
２図の本実施例の場合、密封容器７の上部に設け
た送入管１７と送入管との間を冷却板１０の中の
蛇管１２が結ぶ構造をとり冷媒として水を用いて
いるが、これよりも低温冷却が可能なフレオン等
の冷媒を用いれば更に冷却温度を下げることがで
きる。このように基板を垂直に配列すると共にこ
の間に冷却板を置き浸漬液冷する構造をとること
により効果的な冷却が可能となる。 Further, it is desirable that the air bubbles 15 touch the cooling plate 10 and liquefy rapidly, and for this purpose, the gas guide plate 14 needs to be brought close to the cooling plate 10 to the extent that it almost contacts it. Next, cooling to the cooling plate 10 is carried out in the case of the present embodiment shown in FIG. Although water is used as the refrigerant, the cooling temperature can be further lowered by using a refrigerant such as Freon, which can cool at a lower temperature than this. Effective cooling can be achieved by vertically arranging the substrates, placing a cooling plate between them, and performing immersion liquid cooling.
(g) 発明の効果
本発明はプリント配線基板への高密度実装によ
り従来の空冷構造では規定された最高使用温度以
下に部品温度を保つことが困難なことからなされ
たもので本発明の実施により、規定温度以内に保
持することが可能となる。(g) Effects of the Invention The present invention was developed because it is difficult to maintain component temperatures below the specified maximum operating temperature with conventional air-cooled structures due to high-density mounting on printed wiring boards. , it becomes possible to maintain the temperature within the specified temperature.
第１図は従来の液冷モジユールの断面構成図、
第２図は本発明に係る液冷モジユールの断面構成
図、第３図は冷却板の部分断面図また第４図はガ
ス誘導板を備えた実施例の部分断面図である。
図において１は発熱素子、２，９はプリント配
線基板、３，７は密封容器、６，１１は冷媒、１
０は冷却板、１２は蛇管、１３は空隙部、１４は
ガス誘導板。
Figure 1 is a cross-sectional diagram of a conventional liquid cooling module.
FIG. 2 is a sectional view of a liquid cooling module according to the present invention, FIG. 3 is a partial sectional view of a cooling plate, and FIG. 4 is a partial sectional view of an embodiment provided with a gas guide plate. In the figure, 1 is a heating element, 2 and 9 are printed wiring boards, 3 and 7 are sealed containers, 6 and 11 are refrigerants, and 1
0 is a cooling plate, 12 is a flexible pipe, 13 is a gap, and 14 is a gas guide plate.
Claims (1)
対向して配列し該配線基板上に多数個の発熱部品
を配置してなるプリント配線基板実装モジユール
の強制冷却法として該モジユールを冷媒液を入れ
た密封容器内に配線基板を垂直にして浸漬して格
納すると共に該配線基板の相互間に冷却板を置
き、該冷却板を冷却して強制冷却する構造をとる
ことを特徴とする液冷モジユール。 ２ 冷媒液を入れた密封容器の中に冷却板を挟ん
で対向するプリント配線基板が該基板上に容器の
底面に平行して突出し冷却板に達するガス該導板
を備えてなることを特徴とする特許請求の範囲第
１項記載の液冷モジユール。[Claims] 1. A method for forced cooling of a printed wiring board mounting module in which a plurality of printed wiring boards are arranged facing each other with very small intervals and a large number of heat generating components are arranged on the wiring boards. The module is stored by dipping the wiring board vertically in a sealed container containing refrigerant liquid, and a cooling plate is placed between the wiring boards to cool the cooling plate for forced cooling. Features a liquid cooling module. 2. A printed wiring board facing a cooling plate in a sealed container containing a refrigerant liquid is provided with a gas conductive plate that protrudes parallel to the bottom of the container and reaches the cooling plate. A liquid cooling module according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14777783A JPS6039855A (en) | 1983-08-12 | 1983-08-12 | Liquid-cooled module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14777783A JPS6039855A (en) | 1983-08-12 | 1983-08-12 | Liquid-cooled module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6039855A JPS6039855A (en) | 1985-03-01 |
| JPH0342511B2 true JPH0342511B2 (en) | 1991-06-27 |
Family
ID=15437945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14777783A Granted JPS6039855A (en) | 1983-08-12 | 1983-08-12 | Liquid-cooled module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039855A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
| JP2989976B2 (en) * | 1992-12-01 | 1999-12-13 | 甲府日本電気株式会社 | Circuit cooler |
| JP6720752B2 (en) * | 2016-07-25 | 2020-07-08 | 富士通株式会社 | Immersion cooling device, immersion cooling system, and method of controlling immersion cooling device |
| CN117840459B (en) * | 2024-03-06 | 2024-06-11 | 东北大学 | Laser directional energy deposition system with cooling system |
-
1983
- 1983-08-12 JP JP14777783A patent/JPS6039855A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6039855A (en) | 1985-03-01 |
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