JPS6038673Y2 - コイル材のメツキ装置 - Google Patents
コイル材のメツキ装置Info
- Publication number
- JPS6038673Y2 JPS6038673Y2 JP1980108928U JP10892880U JPS6038673Y2 JP S6038673 Y2 JPS6038673 Y2 JP S6038673Y2 JP 1980108928 U JP1980108928 U JP 1980108928U JP 10892880 U JP10892880 U JP 10892880U JP S6038673 Y2 JPS6038673 Y2 JP S6038673Y2
- Authority
- JP
- Japan
- Prior art keywords
- coil material
- mask
- plating
- roller
- rollers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating By Spraying Or Casting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980108928U JPS6038673Y2 (ja) | 1980-07-31 | 1980-07-31 | コイル材のメツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980108928U JPS6038673Y2 (ja) | 1980-07-31 | 1980-07-31 | コイル材のメツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5735362U JPS5735362U (en:Method) | 1982-02-24 |
| JPS6038673Y2 true JPS6038673Y2 (ja) | 1985-11-19 |
Family
ID=29470140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980108928U Expired JPS6038673Y2 (ja) | 1980-07-31 | 1980-07-31 | コイル材のメツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6038673Y2 (en:Method) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4505225A (en) * | 1983-08-31 | 1985-03-19 | National Semiconductor Corporation | Self-aligning apparatus for semiconductor lead frame processing means |
| JP2666415B2 (ja) * | 1988-10-18 | 1997-10-22 | 松下電器産業株式会社 | 部分めっき装置 |
| JPH0686673B2 (ja) * | 1988-11-04 | 1994-11-02 | 株式会社三井ハイテック | めっき処理設備 |
| KR101308371B1 (ko) * | 2011-09-05 | 2013-09-16 | (주)아이케이텍 | 연속도금장치 |
| US20210025068A1 (en) * | 2017-12-15 | 2021-01-28 | Sumitomo Electric Toyama Co., Ltd. | Method for producing metal porous body, and plating apparatus |
-
1980
- 1980-07-31 JP JP1980108928U patent/JPS6038673Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5735362U (en:Method) | 1982-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4409924A (en) | Self-adjusting plating mask | |
| DE4039120A1 (de) | Verfahren und vorrichtung zur korrektur der richtung einer seite eines transportierten blatts | |
| JPS6428829A (en) | Lead frame conveyer for automatic wire bonder and method of replacing the same | |
| JPS6038673Y2 (ja) | コイル材のメツキ装置 | |
| EP0139846A2 (en) | Workpiece clamp assembly for plating machine | |
| DE4134418C2 (de) | Vorrichtung zum Transportieren von plattenförmigen Gegenständen | |
| CN111392473B (zh) | 一种柔印机自动换卷连续覆膜设备 | |
| JP4161571B2 (ja) | 材料供給装置 | |
| US6681695B2 (en) | Continuous printing and mounting apparatus for film-like printing body | |
| JP3093973B2 (ja) | 帯状材料の部分めっき方法および設備 | |
| JPH0762271B2 (ja) | 部分めつき装置 | |
| JP3339927B2 (ja) | 部分めっき装置 | |
| JPH0115199Y2 (en:Method) | ||
| JP2730059B2 (ja) | スクリーン印刷機 | |
| JPH0226657Y2 (en:Method) | ||
| JPH09223704A (ja) | リードフレーム搬送方法とその装置 | |
| JPS6143438B2 (en:Method) | ||
| JP2894303B2 (ja) | マーキング装置 | |
| US4608479A (en) | Lead-frame splicer welder and method | |
| JP4095744B2 (ja) | 板体の受け取り装置 | |
| KR920000569Y1 (ko) | 반도체 부품 테이핑기의 부품 리드 굽힘 불량 교정장치 | |
| JPH01145144A (ja) | 液状フォトレジスト塗布用自動印刷機 | |
| JPH0412618B2 (en:Method) | ||
| JPH056041Y2 (en:Method) | ||
| JP2000246869A (ja) | 凹版列直刷印刷機 |