JPS6037781A - Driving method for fet - Google Patents

Driving method for fet

Info

Publication number
JPS6037781A
JPS6037781A JP14720283A JP14720283A JPS6037781A JP S6037781 A JPS6037781 A JP S6037781A JP 14720283 A JP14720283 A JP 14720283A JP 14720283 A JP14720283 A JP 14720283A JP S6037781 A JPS6037781 A JP S6037781A
Authority
JP
Japan
Prior art keywords
electrode
fet
source
voltage
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14720283A
Other languages
Japanese (ja)
Inventor
Kazunari Oota
一成 太田
Masaru Kazumura
数村 勝
Tatsuo Otsuki
達男 大槻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14720283A priority Critical patent/JPS6037781A/en
Publication of JPS6037781A publication Critical patent/JPS6037781A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To enable to obtain the excellent characteristic of noise index by a method wherein a channel current is controlled by impressing a voltage between the conductive semiconductor substrate of the FET and the source electrode. CONSTITUTION:An N type GaAs active layer 12 is mounted on the N<+> GaAs semiconductor substrate 10 via I type GaAs buffer layer 11, resulting in the construction of an FET. In opposition to a source electrode 13, a positive voltage is impressed on a drain electrode 14, a negative one on a gate electrode 15 and further a negative one on a substrate ohmic electrode 16. As a result, a depletion layer 17 expands as shown in the figure, and then can independently control the drain-source current by variation in the voltage impressed on the electrode 15 and the electrode 16. Since the unstable region 18 at the interface enters in the depletion layer 17, the improvement of the characteristic of NF (noise index) can be contrived.

Description

【発明の詳細な説明】 ′jgC業」ユの利用分野 木5α明は1−(f界ダ’r3LF’+リトランジスタ
のワベ11す1〕−f法に関する。
DETAILED DESCRIPTION OF THE INVENTION The application field tree 5α of 'jgC industry' U relates to the 1-(f field d'r3LF'+retransistor wave 11s1)-f method.

従′11・さ倒の115成2−その問題点l1l−V族
化合物゛1′、導体よりなる♀ニー?界効果型ト5ンジ
スタは、−8lを素材2ニする従来のFE′rに比べて
僚れ1:高周波特性をf′i十ろFE′Fとして注1」
されている。中でもGaAsシB・リドキーバリアIf
 −1−型FET (以下、GaAs −MES FE
Tと称す〕は’f’、に速性と低油Iυ1i力性の両ン
jに6にれており、実用化のJii Iコ*GaAs・
MES・FET のうち、ヂュアルグ1−ト・MlコS
・FETは、2つのゲートで独立にソースート1フイン
も 開電流を制御することができ、その高速性をη″かして
、[JHF、 SHF帯用0チューナや三十す−として
使ワれてきている。E+’S 1図はその従)乙のI”
 E’l’の<’J’s造図、!−模式的な空乏1)7
の1ノζがりを示1−でいる。1111図では半絶縁性
GaAsノ、(板(1)1−に4!jr活加のi型Ga
Asバ”J ’77層(2)を介してn 7’;9.G
aAsから成る活性層(3)を形成してFETがj、1
4成されている。ソース17J−1極m+c対し、ドレ
イy電!1jii (5)は正、lf−トI″(,17
4ii 1fil(7)は負の電圧が印加されているI
コめ、空乏1i″N(シ旧弐図のように拡がり、チャネ
ルを流ノー、る電流を・(・lJi・:11することが
できる。しかし本(1す働iliにオjいては、活性層
(3)とバ・ソファ層(2)の界面で、Ki’i晶i、
:、i−J、;、7的に不安定な遷移領域(9)ができ
、この部分がチPンネ11゜に影響を及ぼすため、ピン
チ1フ77I、圧の不!/ト定比、NFの増大などの間
Y″X1が起こる。まjこ、jlIll 込J−もソー
ス−ドレイン間に2つのゲートを作る必・3)4 」−
1その工程がψIFシくなり、シングルノj゛−トのl
t、fEs・FETに比べ歩留りの低下、特性のばらつ
きを避けられないのが現状である。
115 Formation 2 of Sub'11 - Problems l1l - Group V compound '1', ♀ knee made of a conductor? The field effect type transistor has a difference of 1 compared to the conventional FE'r, which uses -8l as the material.
has been done. Among them, GaAs Si B lid key barrier If
-1-type FET (hereinafter referred to as GaAs -MES FE
T] is 'f', and is set at 6 for both speed and low oil Iυ1i strength, and is suitable for practical use.
Among MES/FET, Dualgate/MlcoS
・The FET can independently control the open current of both source and fin with two gates, and by taking advantage of its high speed, it is used as a 0 tuner for the JHF and SHF bands and as a It is coming.E+'S 1 figure is its subordinate)
<'J's construction of E'l'! -Schematic depletion 1)7
It is 1-, which indicates a 1 degree ζ inclination. In Figure 1111, semi-insulating GaAs (I-type Ga with 4!jr activation on plate (1) 1-)
As bar"J' through the 77 layer (2)
An active layer (3) made of aAs is formed to form an FET with j, 1
4 has been completed. For source 17J-1 pole m+c, drain y electric! 1jii (5) is positive, lf-tI″(,17
4ii 1fil(7) is I to which negative voltage is applied
Therefore, the depletion 1i''N(S) can be expanded as shown in Figure 2, and the current flowing through the channel can be . At the interface between the active layer (3) and the bath layer (2), Ki'i crystal i,
:,i-J,;,7 An unstable transition region (9) is created, and this part affects the tip 11°, causing pinch 1f 77I, no pressure! Y″X1 occurs during the constant ratio of /to, increase in NF, etc.It is also necessary to create two gates between the source and drain.
1 The process becomes ψIF, and the single note l
At present, it is unavoidable that the yield is lower and the characteristics vary compared to t, fEs FETs.

発明の目的 本発明は八41’、S −FE1’にJ5いて1″:J
LれtこNF持性を得ることができるFErの駆動方法
を提供することを「1的とする。
Object of the Invention The present invention is directed to 841', S-FE1', J5 and 1'':J.
One objective is to provide a method for driving an FEr that can obtain LETNF characteristics.

発明の]R成 本発明の1’IC?i’−効果型トラ、−7ジスタの駆
動方法によると、導111゛性を有する半導体ツメ7仮
十二に形成されtこ″1江界効果摩1 lうごノジスタ
のnl[記31(導体基板とソース’I’l−j 1.
+i! i:’dにf?+圧を加えてチトネIlz電流
を制御することを1、〒徴とする。
[of the invention] 1'IC of the present invention? According to the driving method of the i'-effect type transistor and the -7 transistor, the semiconductor claw 7 having conductivity is formed on the 7 temporary 12, and the nl of the Conductor substrate and source 'I'l-j 1.
+i! i:'d to f? The first characteristic is to control the chitone Ilz current by applying + pressure.

実施例のj’、11j明 り、下、本発明の1110・)1方Deを具体的なりこ
雄側に基づいて1;lΔ明A−る。
Example j', 11j light, lower, 1110 of the present invention.) One side De is based on the specific Rikoo side 1;

C1)2図は本発明によるFJETのβf’、 1ft
f1ft上空乏層の拡がりを植式的に示す。114−型
GaΔS半導体J4(”、Li (Iffi上にi 型
GaAsバ”)ファ層(1)を介し2てn型(ya A
 5活)゛■ミ1i (12が戦費されFETが111
7成されている。ソース11イイm(13ニ対シ、ドl
y イy FEr極(14)に正、ゲート市: J+i
ii OQに負、さらに基(反オーミ・ツク電極面にf
lの電圧か印加さね、でいる。空乏;1゛・j(J力は
(Nに示ずようにjシ、かり、ゲートIjイ’tk o
i i6 ヨ(J ノ、”’; 板A−E ”J ’)
 i’:1: l1n(、(lfi) ニ加える電圧を
ニノン化さ1Jろことにより、)j1!立にト□レイン
・ソース間市、bIEを徂1イ(・4Iする:1かでき
ろ。t fこ、界面の不安定な領域か?;・4乏層fr
t)内に入って1.1.FうTこめ、NFの向上か[;
]メ1.る。
C1) Figure 2 shows βf', 1ft of FJET according to the present invention.
The spread of the depletion layer above f1ft is schematically shown. 114-type GaΔS semiconductor J4 (", Li (i-type GaAs buffer on Iffi)") 2 n-type (ya A
5 life) ゛■ Mi 1i (12 were war expenses and FET was 111
7 has been completed. Source 11 good m (13 ni vs. shi, do l
y y Positive to FEr pole (14), gate city: J+i
ii Negative to OQ, and further base (f to anti-ohmic electrode surface)
A voltage of 1 is applied. Depletion; 1゛・j (J force is (as shown in N)
i i6 YO (J ノ, ``'; Board A-E ``J ')
i': 1: l1n (, (lfi) By changing the applied voltage to 1J) j1! Between the train and the source, change the bIE to 1 (・Do 4I: Can you do it? t f Is this an unstable region at the interface?; ・4 depletion layer fr
t) Go inside 1.1. Is it an improvement in NF and NF [;
] Me1. Ru.

本実施例ではSi添加■仕G;IAS(2XI018c
m−3)半導体基板uU J−に気相成長?、ノ:に3
1−リi KVGaAs(り1xlO”cm 3)21
Jm、 n 7qすGaAs (I X 10 ”nn
 ”>(1,877111の I萱ソ 〕 ァ fil
 FI+)、活性Ji’i (lのを順に成I::<シ
1こ。ソース行ら(、じ:(1]、トしイン?i、j’
、 (:m (目)、 ノ占(fi A”fl ”) 
り 1,1)シ’+IJ’N にAuGc/A、u を
 、テ・\2′j後、ト、へ処理により合金化しでオー
三ツクを完全にした。If−ト11?極(1!’A I
:iA ’; 5: :)パ、γ11でドリフトより形
成しtこ。グーt− 4.−、j 1 /IJZ X.
す°′ー1ー幅20117n、ソース・トレイン間1’
/A 5 717I+としtこ1・王T (7) ’i
、テ+’lユ1:llと(2て、I DSS = 5 
tn. A % yy++ −1 il(1 trr.
sAr77++、VT二25ポル1−、基板オーニ・ツ
ク7t,( 、r::4i7])らの]ンタクタ:ノス
としC2 0 tns /ynm を1C?fこ。”!
. f−NF i1+’iは基4i f’j’l jF
i,圧を0 1jし1こ時に対し、■ボルトのバイアス
l’J’j圧を加えた時、5dBの減少が見られ、界面
の不安定1′]:か特,i4i−に影響を及ぼさなくな
つtこ事を示している。
In this example, Si addition G; IAS (2XI018c
m-3) Vapor phase growth on semiconductor substrate uU J-? ,ノ:ni3
1-ri KVGaAs (ri 1xlO”cm 3) 21
Jm, n 7qsGaAs (I X 10”nn
”>(1,877111 I萱SO) fil
I, j'
, (:m (eyes), ノ divination (fi A"fl")
1,1) AuGc/A,u was added to SI'+IJ'N, and after Te. If 11? Pole (1!'A I
:iA'; 5: :) Formed by drift at γ11. Goo T-4. −, j 1 /IJZ X.
°'-1-width 20117n, source-train distance 1'
/A 5 717I + Toshi tko 1・O T (7) 'i
, te+'lyu1:ll and (2te, I DSS = 5
tn. A % yy++ -1 il (1 trr.
sAr77++, VT225pol1-, boardOnitsuk7t, ( , r::4i7]) et al.: Assuming that C20 tns /ynm is 1C? F-ko. ”!
.. f-NF i1+'i is the group 4i f'j'l jF
i, pressure is 0, 1j and 1, when a bias l'J'j pressure of This shows that there is no longer any impact.

なお、上記実rIL例番とおいて半導体材料はGaAs
として説明しtこが、これはInz−xGa)(As 
+ Ga1−yA%AS。
In addition, in the above actual rIL example number, the semiconductor material is GaAs.
This is explained as Inz-xGa)(As
+ Ga1-yA%AS.

InPなどのIII −V族化合物半導体材料でも同様
の効弔がi’.lられる。
Similar effects can be seen in III-V compound semiconductor materials such as InP. I will be beaten.

発明の詳細 な説明のように本発明の′ii’,1界効栗型トランジ
スタの1゛区!b11方法によると、導電性)1(:板
とソース間に電圧を印加して空乏1nを基板側から拡げ
てチャネル電流をグー!〜電圧と独立して制r11する
jこめ、づDセスの容k・)化が「IJ能になり.NF
特件の優れtコFETを作成するこ吉ができるものであ
る。
As detailed in the detailed description of the invention, the ``ii'' of the present invention, the 1st section of the 1-field effect chestnut-type transistor! According to the b11 method, the conductivity) 1 (: Apply voltage between the plate and the source to expand the depletion 1n from the substrate side and increase the channel current!~ Control r11 independently of the voltage. Yok・)Nation becomes “IJ Noh.NF
This is what Kokichi can do by creating an excellent t-co FET.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のFETの414Y造と(蓮式的な空乏層
の拡がりの説明図、第2図は本発明によるFT汀のl駆
動方法のー;1コ施例雄側乏層の拡がりの説明図である
。 θ(1 、、、 n4−型GaAs半導体基板、(It
) − i 型GaAsバ・リファ層、(12 ・n 
型GaAs活性層、0:C − ソー スrU 極、(
14)・・・ドレイン?′l!石れ(142−ダ“−ト
市,5(瓶、(1(塾・基(反オーミックSU; 、f
VtE、07)・・空乏119、(1[・・界面の不安
定な領域 代理人 へ A\ 二<) 弘 第1図 第2図
Figure 1 is an explanatory diagram of the conventional FET 414Y structure and the expansion of the depletion layer in a lotus-like manner. θ(1, , n4-type GaAs semiconductor substrate, (It
) − i-type GaAs barrier layer, (12 ・n
type GaAs active layer, 0:C-source rU pole, (
14)...Drain? 'l! Stone (142-Dato City, 5 (bottle, (1) cram school, group (anti-ohmic SU; , f
VtE, 07)... Depletion 119, (1 [... to the unstable region agent at the interface A\2<) Hiro 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 1、導電性をffするl、 ;、1′y体基板」−に形
成されf、m電:界′jIJ果型トうンジスタの前記半
導体基板とソースf’!”+’、 (1・11間に7i
、j:圧を加えてチPシネル1ぽ流を制作する電界効L
u型1へろヲジスタのrU<動方法。
1. The semiconductor substrate and the source of the IJ transistor are formed in the semiconductor substrate and the source f'! "+', (7i between 1st and 11th
, j: Field effect L that creates ChiP sinel 1 flow by applying pressure
rU< movement method of U type 1 gearshifter.
JP14720283A 1983-08-10 1983-08-10 Driving method for fet Pending JPS6037781A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14720283A JPS6037781A (en) 1983-08-10 1983-08-10 Driving method for fet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14720283A JPS6037781A (en) 1983-08-10 1983-08-10 Driving method for fet

Publications (1)

Publication Number Publication Date
JPS6037781A true JPS6037781A (en) 1985-02-27

Family

ID=15424864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14720283A Pending JPS6037781A (en) 1983-08-10 1983-08-10 Driving method for fet

Country Status (1)

Country Link
JP (1) JPS6037781A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814258A (en) * 1995-12-28 1998-09-29 Fuji Photo Film Co., Ltd. Method for forming multilayer sheet or multilayer film
US6203742B1 (en) 1997-08-22 2001-03-20 Fuji Photo Film Co., Ltd. Method for forming multilayer sheets and extrusion die therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814258A (en) * 1995-12-28 1998-09-29 Fuji Photo Film Co., Ltd. Method for forming multilayer sheet or multilayer film
US6203742B1 (en) 1997-08-22 2001-03-20 Fuji Photo Film Co., Ltd. Method for forming multilayer sheets and extrusion die therefor
US6461138B2 (en) 1997-08-22 2002-10-08 Fuji Photo Film Co., Ltd. Device for forming multilayer sheets and extrusion die therefor

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