JPS6037781A - Driving method for fet - Google Patents
Driving method for fetInfo
- Publication number
- JPS6037781A JPS6037781A JP14720283A JP14720283A JPS6037781A JP S6037781 A JPS6037781 A JP S6037781A JP 14720283 A JP14720283 A JP 14720283A JP 14720283 A JP14720283 A JP 14720283A JP S6037781 A JPS6037781 A JP S6037781A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- fet
- source
- voltage
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000005669 field effect Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 11
- 238000010276 construction Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- TVZRAEYQIKYCPH-UHFFFAOYSA-N 3-(trimethylsilyl)propane-1-sulfonic acid Chemical compound C[Si](C)(C)CCCS(O)(=O)=O TVZRAEYQIKYCPH-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
【発明の詳細な説明】
′jgC業」ユの利用分野
木5α明は1−(f界ダ’r3LF’+リトランジスタ
のワベ11す1〕−f法に関する。DETAILED DESCRIPTION OF THE INVENTION The application field tree 5α of 'jgC industry' U relates to the 1-(f field d'r3LF'+retransistor wave 11s1)-f method.
従′11・さ倒の115成2−その問題点l1l−V族
化合物゛1′、導体よりなる♀ニー?界効果型ト5ンジ
スタは、−8lを素材2ニする従来のFE′rに比べて
僚れ1:高周波特性をf′i十ろFE′Fとして注1」
されている。中でもGaAsシB・リドキーバリアIf
−1−型FET (以下、GaAs −MES FE
Tと称す〕は’f’、に速性と低油Iυ1i力性の両ン
jに6にれており、実用化のJii Iコ*GaAs・
MES・FET のうち、ヂュアルグ1−ト・MlコS
・FETは、2つのゲートで独立にソースート1フイン
も
開電流を制御することができ、その高速性をη″かして
、[JHF、 SHF帯用0チューナや三十す−として
使ワれてきている。E+’S 1図はその従)乙のI”
E’l’の<’J’s造図、!−模式的な空乏1)7
の1ノζがりを示1−でいる。1111図では半絶縁性
GaAsノ、(板(1)1−に4!jr活加のi型Ga
Asバ”J ’77層(2)を介してn 7’;9.G
aAsから成る活性層(3)を形成してFETがj、1
4成されている。ソース17J−1極m+c対し、ドレ
イy電!1jii (5)は正、lf−トI″(,17
4ii 1fil(7)は負の電圧が印加されているI
コめ、空乏1i″N(シ旧弐図のように拡がり、チャネ
ルを流ノー、る電流を・(・lJi・:11することが
できる。しかし本(1す働iliにオjいては、活性層
(3)とバ・ソファ層(2)の界面で、Ki’i晶i、
:、i−J、;、7的に不安定な遷移領域(9)ができ
、この部分がチPンネ11゜に影響を及ぼすため、ピン
チ1フ77I、圧の不!/ト定比、NFの増大などの間
Y″X1が起こる。まjこ、jlIll 込J−もソー
ス−ドレイン間に2つのゲートを作る必・3)4 」−
1その工程がψIFシくなり、シングルノj゛−トのl
t、fEs・FETに比べ歩留りの低下、特性のばらつ
きを避けられないのが現状である。115 Formation 2 of Sub'11 - Problems l1l - Group V compound '1', ♀ knee made of a conductor? The field effect type transistor has a difference of 1 compared to the conventional FE'r, which uses -8l as the material.
has been done. Among them, GaAs Si B lid key barrier If
-1-type FET (hereinafter referred to as GaAs -MES FE
T] is 'f', and is set at 6 for both speed and low oil Iυ1i strength, and is suitable for practical use.
Among MES/FET, Dualgate/MlcoS
・The FET can independently control the open current of both source and fin with two gates, and by taking advantage of its high speed, it is used as a 0 tuner for the JHF and SHF bands and as a It is coming.E+'S 1 figure is its subordinate)
<'J's construction of E'l'! -Schematic depletion 1)7
It is 1-, which indicates a 1 degree ζ inclination. In Figure 1111, semi-insulating GaAs (I-type Ga with 4!jr activation on plate (1) 1-)
As bar"J' through the 77 layer (2)
An active layer (3) made of aAs is formed to form an FET with j, 1
4 has been completed. For source 17J-1 pole m+c, drain y electric! 1jii (5) is positive, lf-tI″(,17
4ii 1fil(7) is I to which negative voltage is applied
Therefore, the depletion 1i''N(S) can be expanded as shown in Figure 2, and the current flowing through the channel can be . At the interface between the active layer (3) and the bath layer (2), Ki'i crystal i,
:,i-J,;,7 An unstable transition region (9) is created, and this part affects the tip 11°, causing pinch 1f 77I, no pressure! Y″X1 occurs during the constant ratio of /to, increase in NF, etc.It is also necessary to create two gates between the source and drain.
1 The process becomes ψIF, and the single note l
At present, it is unavoidable that the yield is lower and the characteristics vary compared to t, fEs FETs.
発明の目的
本発明は八41’、S −FE1’にJ5いて1″:J
LれtこNF持性を得ることができるFErの駆動方法
を提供することを「1的とする。Object of the Invention The present invention is directed to 841', S-FE1', J5 and 1'':J.
One objective is to provide a method for driving an FEr that can obtain LETNF characteristics.
発明の]R成
本発明の1’IC?i’−効果型トラ、−7ジスタの駆
動方法によると、導111゛性を有する半導体ツメ7仮
十二に形成されtこ″1江界効果摩1 lうごノジスタ
のnl[記31(導体基板とソース’I’l−j 1.
+i! i:’dにf?+圧を加えてチトネIlz電流
を制御することを1、〒徴とする。[of the invention] 1'IC of the present invention? According to the driving method of the i'-effect type transistor and the -7 transistor, the semiconductor claw 7 having conductivity is formed on the 7 temporary 12, and the nl of the Conductor substrate and source 'I'l-j 1.
+i! i:'d to f? The first characteristic is to control the chitone Ilz current by applying + pressure.
実施例のj’、11j明
り、下、本発明の1110・)1方Deを具体的なりこ
雄側に基づいて1;lΔ明A−る。Example j', 11j light, lower, 1110 of the present invention.) One side De is based on the specific Rikoo side 1;
C1)2図は本発明によるFJETのβf’、 1ft
f1ft上空乏層の拡がりを植式的に示す。114−型
GaΔS半導体J4(”、Li (Iffi上にi 型
GaAsバ”)ファ層(1)を介し2てn型(ya A
5活)゛■ミ1i (12が戦費されFETが111
7成されている。ソース11イイm(13ニ対シ、ドl
y イy FEr極(14)に正、ゲート市: J+i
ii OQに負、さらに基(反オーミ・ツク電極面にf
lの電圧か印加さね、でいる。空乏;1゛・j(J力は
(Nに示ずようにjシ、かり、ゲートIjイ’tk o
i i6 ヨ(J ノ、”’; 板A−E ”J ’)
i’:1: l1n(、(lfi) ニ加える電圧を
ニノン化さ1Jろことにより、)j1!立にト□レイン
・ソース間市、bIEを徂1イ(・4Iする:1かでき
ろ。t fこ、界面の不安定な領域か?;・4乏層fr
t)内に入って1.1.FうTこめ、NFの向上か[;
]メ1.る。C1) Figure 2 shows βf', 1ft of FJET according to the present invention.
The spread of the depletion layer above f1ft is schematically shown. 114-type GaΔS semiconductor J4 (", Li (i-type GaAs buffer on Iffi)") 2 n-type (ya A
5 life) ゛■ Mi 1i (12 were war expenses and FET was 111
7 has been completed. Source 11 good m (13 ni vs. shi, do l
y y Positive to FEr pole (14), gate city: J+i
ii Negative to OQ, and further base (f to anti-ohmic electrode surface)
A voltage of 1 is applied. Depletion; 1゛・j (J force is (as shown in N)
i i6 YO (J ノ, ``'; Board A-E ``J ')
i': 1: l1n (, (lfi) By changing the applied voltage to 1J) j1! Between the train and the source, change the bIE to 1 (・Do 4I: Can you do it? t f Is this an unstable region at the interface?; ・4 depletion layer fr
t) Go inside 1.1. Is it an improvement in NF and NF [;
] Me1. Ru.
本実施例ではSi添加■仕G;IAS(2XI018c
m−3)半導体基板uU J−に気相成長?、ノ:に3
1−リi KVGaAs(り1xlO”cm 3)21
Jm、 n 7qすGaAs (I X 10 ”nn
”>(1,877111の I萱ソ 〕 ァ fil
FI+)、活性Ji’i (lのを順に成I::<シ
1こ。ソース行ら(、じ:(1]、トしイン?i、j’
、 (:m (目)、 ノ占(fi A”fl ”)
り 1,1)シ’+IJ’N にAuGc/A、u を
、テ・\2′j後、ト、へ処理により合金化しでオー
三ツクを完全にした。If−ト11?極(1!’A I
:iA ’; 5: :)パ、γ11でドリフトより形
成しtこ。グーt− 4.−、j 1 /IJZ X.
す°′ー1ー幅20117n、ソース・トレイン間1’
/A 5 717I+としtこ1・王T (7) ’i
、テ+’lユ1:llと(2て、I DSS = 5
tn. A % yy++ −1 il(1 trr.
sAr77++、VT二25ポル1−、基板オーニ・ツ
ク7t,( 、r::4i7])らの]ンタクタ:ノス
としC2 0 tns /ynm を1C?fこ。”!
. f−NF i1+’iは基4i f’j’l jF
i,圧を0 1jし1こ時に対し、■ボルトのバイアス
l’J’j圧を加えた時、5dBの減少が見られ、界面
の不安定1′]:か特,i4i−に影響を及ぼさなくな
つtこ事を示している。In this example, Si addition G; IAS (2XI018c
m-3) Vapor phase growth on semiconductor substrate uU J-? ,ノ:ni3
1-ri KVGaAs (ri 1xlO”cm 3) 21
Jm, n 7qsGaAs (I X 10”nn
”>(1,877111 I萱SO) fil
I, j'
, (:m (eyes), ノ divination (fi A"fl")
1,1) AuGc/A,u was added to SI'+IJ'N, and after Te. If 11? Pole (1!'A I
:iA'; 5: :) Formed by drift at γ11. Goo T-4. −, j 1 /IJZ X.
°'-1-width 20117n, source-train distance 1'
/A 5 717I + Toshi tko 1・O T (7) 'i
, te+'lyu1:ll and (2te, I DSS = 5
tn. A % yy++ -1 il (1 trr.
sAr77++, VT225pol1-, boardOnitsuk7t, ( , r::4i7]) et al.: Assuming that C20 tns /ynm is 1C? F-ko. ”!
.. f-NF i1+'i is the group 4i f'j'l jF
i, pressure is 0, 1j and 1, when a bias l'J'j pressure of This shows that there is no longer any impact.
なお、上記実rIL例番とおいて半導体材料はGaAs
として説明しtこが、これはInz−xGa)(As
+ Ga1−yA%AS。In addition, in the above actual rIL example number, the semiconductor material is GaAs.
This is explained as Inz-xGa)(As
+ Ga1-yA%AS.
InPなどのIII −V族化合物半導体材料でも同様
の効弔がi’.lられる。Similar effects can be seen in III-V compound semiconductor materials such as InP. I will be beaten.
発明の詳細
な説明のように本発明の′ii’,1界効栗型トランジ
スタの1゛区!b11方法によると、導電性)1(:板
とソース間に電圧を印加して空乏1nを基板側から拡げ
てチャネル電流をグー!〜電圧と独立して制r11する
jこめ、づDセスの容k・)化が「IJ能になり.NF
特件の優れtコFETを作成するこ吉ができるものであ
る。As detailed in the detailed description of the invention, the ``ii'' of the present invention, the 1st section of the 1-field effect chestnut-type transistor! According to the b11 method, the conductivity) 1 (: Apply voltage between the plate and the source to expand the depletion 1n from the substrate side and increase the channel current!~ Control r11 independently of the voltage. Yok・)Nation becomes “IJ Noh.NF
This is what Kokichi can do by creating an excellent t-co FET.
第1図は従来のFETの414Y造と(蓮式的な空乏層
の拡がりの説明図、第2図は本発明によるFT汀のl駆
動方法のー;1コ施例雄側乏層の拡がりの説明図である
。
θ(1 、、、 n4−型GaAs半導体基板、(It
) − i 型GaAsバ・リファ層、(12 ・n
型GaAs活性層、0:C − ソー スrU 極、(
14)・・・ドレイン?′l!石れ(142−ダ“−ト
市,5(瓶、(1(塾・基(反オーミックSU; 、f
VtE、07)・・空乏119、(1[・・界面の不安
定な領域
代理人 へ A\ 二<) 弘
第1図
第2図Figure 1 is an explanatory diagram of the conventional FET 414Y structure and the expansion of the depletion layer in a lotus-like manner. θ(1, , n4-type GaAs semiconductor substrate, (It
) − i-type GaAs barrier layer, (12 ・n
type GaAs active layer, 0:C-source rU pole, (
14)...Drain? 'l! Stone (142-Dato City, 5 (bottle, (1) cram school, group (anti-ohmic SU; , f
VtE, 07)... Depletion 119, (1 [... to the unstable region agent at the interface A\2<) Hiro 1 Figure 2
Claims (1)
成されf、m電:界′jIJ果型トうンジスタの前記半
導体基板とソースf’!”+’、 (1・11間に7i
、j:圧を加えてチPシネル1ぽ流を制作する電界効L
u型1へろヲジスタのrU<動方法。1. The semiconductor substrate and the source of the IJ transistor are formed in the semiconductor substrate and the source f'! "+', (7i between 1st and 11th
, j: Field effect L that creates ChiP sinel 1 flow by applying pressure
rU< movement method of U type 1 gearshifter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14720283A JPS6037781A (en) | 1983-08-10 | 1983-08-10 | Driving method for fet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14720283A JPS6037781A (en) | 1983-08-10 | 1983-08-10 | Driving method for fet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6037781A true JPS6037781A (en) | 1985-02-27 |
Family
ID=15424864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14720283A Pending JPS6037781A (en) | 1983-08-10 | 1983-08-10 | Driving method for fet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037781A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814258A (en) * | 1995-12-28 | 1998-09-29 | Fuji Photo Film Co., Ltd. | Method for forming multilayer sheet or multilayer film |
US6203742B1 (en) | 1997-08-22 | 2001-03-20 | Fuji Photo Film Co., Ltd. | Method for forming multilayer sheets and extrusion die therefor |
-
1983
- 1983-08-10 JP JP14720283A patent/JPS6037781A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814258A (en) * | 1995-12-28 | 1998-09-29 | Fuji Photo Film Co., Ltd. | Method for forming multilayer sheet or multilayer film |
US6203742B1 (en) | 1997-08-22 | 2001-03-20 | Fuji Photo Film Co., Ltd. | Method for forming multilayer sheets and extrusion die therefor |
US6461138B2 (en) | 1997-08-22 | 2002-10-08 | Fuji Photo Film Co., Ltd. | Device for forming multilayer sheets and extrusion die therefor |
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