JPS603587Y2 - 発光ダイオ−ド基板 - Google Patents

発光ダイオ−ド基板

Info

Publication number
JPS603587Y2
JPS603587Y2 JP5537379U JP5537379U JPS603587Y2 JP S603587 Y2 JPS603587 Y2 JP S603587Y2 JP 5537379 U JP5537379 U JP 5537379U JP 5537379 U JP5537379 U JP 5537379U JP S603587 Y2 JPS603587 Y2 JP S603587Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
layer
light
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5537379U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55154564U (enrdf_load_stackoverflow
Inventor
昌昭 梅崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP5537379U priority Critical patent/JPS603587Y2/ja
Publication of JPS55154564U publication Critical patent/JPS55154564U/ja
Application granted granted Critical
Publication of JPS603587Y2 publication Critical patent/JPS603587Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP5537379U 1979-04-24 1979-04-24 発光ダイオ−ド基板 Expired JPS603587Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5537379U JPS603587Y2 (ja) 1979-04-24 1979-04-24 発光ダイオ−ド基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5537379U JPS603587Y2 (ja) 1979-04-24 1979-04-24 発光ダイオ−ド基板

Publications (2)

Publication Number Publication Date
JPS55154564U JPS55154564U (enrdf_load_stackoverflow) 1980-11-07
JPS603587Y2 true JPS603587Y2 (ja) 1985-01-31

Family

ID=28951129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5537379U Expired JPS603587Y2 (ja) 1979-04-24 1979-04-24 発光ダイオ−ド基板

Country Status (1)

Country Link
JP (1) JPS603587Y2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680841B2 (ja) * 1986-04-07 1994-10-12 株式会社小糸製作所 照明装置
JPH046056Y2 (enrdf_load_stackoverflow) * 1986-12-22 1992-02-19
JP4527714B2 (ja) * 2003-02-07 2010-08-18 パナソニック株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
EP2518190A1 (en) 2009-12-25 2012-10-31 FUJIFILM Corporation Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element
JP2012033853A (ja) 2010-04-28 2012-02-16 Fujifilm Corp 絶縁性光反射基板
KR20120022628A (ko) 2010-08-16 2012-03-12 후지필름 가부시키가이샤 Ｌｅｄ 용 방열 반사판

Also Published As

Publication number Publication date
JPS55154564U (enrdf_load_stackoverflow) 1980-11-07

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