JPS6031220A - チップ状固体電解コンデンサの製造方法 - Google Patents
チップ状固体電解コンデンサの製造方法Info
- Publication number
- JPS6031220A JPS6031220A JP13991783A JP13991783A JPS6031220A JP S6031220 A JPS6031220 A JP S6031220A JP 13991783 A JP13991783 A JP 13991783A JP 13991783 A JP13991783 A JP 13991783A JP S6031220 A JPS6031220 A JP S6031220A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- terminal
- lead
- cathode
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000007787 solid Substances 0.000 title claims description 10
- 239000003990 capacitor Substances 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000007784 solid electrolyte Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000006071 cream Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Primary Cells (AREA)
- Conductive Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13991783A JPS6031220A (ja) | 1983-07-29 | 1983-07-29 | チップ状固体電解コンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13991783A JPS6031220A (ja) | 1983-07-29 | 1983-07-29 | チップ状固体電解コンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6031220A true JPS6031220A (ja) | 1985-02-18 |
| JPH0155572B2 JPH0155572B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=15256654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13991783A Granted JPS6031220A (ja) | 1983-07-29 | 1983-07-29 | チップ状固体電解コンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6031220A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS588938A (ja) * | 1981-06-30 | 1983-01-19 | ハネウエル・インコ−ポレ−テツド | 冷凍機の屋外コイル除霜制御装置 |
| JPS5860524A (ja) * | 1981-10-05 | 1983-04-11 | ニチコンスプラ−グ株式会社 | チップ状固体電解コンデンサの製造方法 |
-
1983
- 1983-07-29 JP JP13991783A patent/JPS6031220A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS588938A (ja) * | 1981-06-30 | 1983-01-19 | ハネウエル・インコ−ポレ−テツド | 冷凍機の屋外コイル除霜制御装置 |
| JPS5860524A (ja) * | 1981-10-05 | 1983-04-11 | ニチコンスプラ−グ株式会社 | チップ状固体電解コンデンサの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155572B2 (enrdf_load_stackoverflow) | 1989-11-27 |
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