JPS602947A - Method for coating resist - Google Patents

Abstract

PURPOSE:To reduce the amount of a resist soln. to be fed by setting a substrate so that the surface on which a resist is coated is positioned downward and by carrying out spin coating. CONSTITUTION:A substrate 12 for a photomask is attached to a vacuum chuck 11 fixed on the lower end of a suspended rotating shaft 10 so that a metallic chromium film 12a formed on one side of the substrate 12 is positioned downward. The surface of the film 12a is brought into contact with the surface of a resist soln. 14 to stick thinly the resist soln. to the surface of the film 12a. The surface of the film 12a is then separated from the soln. 14, and the shaft 10 is rotated at high speed to scatter an excess of the resist soln. on the surface of the film 12a. The remaining resist soln. is dried to form a thin resist film of a uniform thickness on the surface of the film 12a.

Description

DETAILED DESCRIPTION OF THE INVENTION The technical field of the invention relates to a photoresist method for photomasks used in the manufacturing process of semiconductor devices such as ICs and LSIs.

Prior Art and Problems In the manufacture of ICs and LSIs, photolithography technology is used to form the elements. That u3 go hotoma”
Although a fabric is used, photolithography technology is also used in the production of this photomask, similar to that used in the production of this photomask.

Namely, a metal chromium AQ layer was formed on a plate by sputtering, a photoresist layer was applied thereon, and the photoresist reticle was exposed to light. The gold part is etched on all sides of the chromium film and gold J is applied.
(+Create a photomask by buttering it with chrome.)

In the manufacturing process of this photomask, the photoresistive fabric Qj is used according to the 16p spin code method. This method is fixed at rotation #QI+1 as shown in Figure 1.
Photomask on pinned chuck 2 / fl base 3 all gold ・
1 chrome hole should be on the top surface +c; 4V, t7 male; after dropping photoresist (Iia; 4'?r) on top of it, rotate the rotating shaft at high speed to apply photoresist solution 4 to the metal chromium film surface. The expansion is extended upwards, and the extra few notes are made into a uniform] 9's *ji';% 'c-+i). However, in this case, photoresist stone J7
Due to the monopoly property, it is necessary to drop the photoresist solution 4 to spread it around the substrate.
It is necessary to have a lot of V 1- from the foundation that is based on the fire protection. Therefore, this method is suitable for photoresist 7'lN
There was a drawback that there were a lot of angles of ~4°. Reedab 1 - Is the sprayed resist liquid the substrate? ,
He also rarely had the disadvantage of wearing a samurai mask.

The purpose of the invention is to fail.
The photoresist solution has a very low level of resist ((goij
') To offer the J method? f: It is the purpose.

According to the present invention, the 41 features of the invention and this object are as follows:
'I One of the photoresists in VC; Cloth method, with gold &i on the surface of -10,000! T! This is the sheet metal that was formed, and it is the metal that hangs down from above.ii ii5. i opening is downward t
After removing it in the same manner, the metal trace is easily melted in the resist solution, and the resist F rt4 liquid gold is deposited on the surface of the resist solution.
'I'll do everything in my power to remove the extra resist vulgarity on the h4 page this month.
This can be achieved by providing a resist Dj i0 method'f.

Embodiments of the invention will be described in detail below.

Figure 2 is a diagram for explaining the present invention's new resist method. 1bll is the machining chuck installed under it at 91'h; 12 is the photomask J old, j, ', iyun, which has been formed on the chrome film surface on one side of the glass 4, and 13 is the container. , 14 indicate all resist solutions, respectively.

As shown in the 21st prisoner, an example of a fuji-oke is a true chuck 1 fixed to the lower end of a rotating shaft 110 hanging down from above.
One photomask substrate 12 is completely attached. In this case, the photomask substrate 12 has metal chromium (mounted on the chuck 11 so that jΔ12a faces downward) 7 formed on one surface thereof.
1f. Next, resist 7 is applied to the 2a side of this complete ROM model.
The entire surface of the liquid 8 is brought into contact with the liquid 14, and the resist solution is completely thinly deposited on the surface of the metal chromium film. Next, the resist solution on the surface of the metal chromium 719 is removed by rotating the shaft 10 at high speed, and the remaining resist solution is dried to form a coarse gold chromium film. A thin resist with a uniform thickness is formed on the surface.

An unfavorable example of forming a resist layer HfAf in this way is that the method of supplying resist solution gold to all four chromium surfaces of a photomask substrate is such that the gold layer is brought into contact with the resist solution under the entire surface of the chromium film, and the resist solution is uniformly applied. Since it is deposited as a thin layer, the size of the substrate is 4' x 4' to 6j x s.
In the case of I, it is 1-2 cc, and in the conventional dripping method, it is 2 cc.
The amount is significantly less than ~5 cc. Since the reed treadle is rotated so that the resist coated surface is facing downward, the scattered resist solution is prevented from flowing around and adhering to the back side of the substrate m1.

Effects of the Invention As explained in detail above, the resist coating method of the present invention is economical because it spin-codes with the resist coating side facing down, so that the resist trough solution co-supplied with the diode 4 only requires a small amount of Pg. It has a great effect.0

[Brief explanation of the drawing]

Fig. 1 is a diagram for explaining the conventional resist coating method, and Fig. 2 is a diagram for explaining the resist coating method according to the present invention':f:iI.
This is a diagram for "brother ψ". On the south side, 10 indicates a total chuck, 11 indicates a full chuck, 12 indicates a photomask; NKFj, and 14 indicate a resist solution. T7j Keidetsu (human wealth) 1 power (1s type company! 1 patent application agent patent attorney ± 1 yen Thurs. 19J square 1゛P± Nishidate O゛11 Patent attorney Uchide ♀ Male patent attorney Yamaguchi Bl Zu no

Claims (1)

[Claims] 1. In the photoresist coating method in the photomask manufacturing process, the base Ifl gold, on which a metal film is formed on one side, must be mounted with the metal film facing downward on the rotation axis 545 degrees below the top. Q Shitanora, Kokin Ji4 j! '
F1 side? The surface of the resist bath liquid is exposed to the metal Q°.
, -: Apply the resist solution to t + ij, then rotate '1tll f Takamichi once to remove all the excess resist solution of gold 7: 1 soil and remove it. A11 method.