JPS6028114Y2 - composite parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component including a capacitor and a diode.

For example, as shown in Fig. 1, an AC power supply circuit for a color television is conventionally constructed by connecting capacitors C1 to C4 and diodes D1 to D4 in a bridge configuration, and leading out lead terminals a to d from each connection point. A voltage rectifier circuit is used.

When realizing this voltage doubler rectifier circuit, conventionally, capacitors 01 to C1 and diodes D to
D, were individually soldered and mounted on a printed circuit board.

However, in this method, since the voltage doubler rectifier block occupies a large space, it is not possible to meet the demands for smaller, thinner, and higher-density packaging of devices.

The object of the present invention is to eliminate this drawback and provide a capacitor-diode composite component that occupies less space and is suitable for making equipment smaller, thinner, and more densely packaged.

To distantly relate to the above object, the present invention provides a composite component comprising at least four bridge-connected diodes and at least four capacitors connected in parallel to each of these diodes. is a pair of electrodes that are subdivided on one side of the ceramic substrate and are connected to each other in a horizontal direction by a conductive pattern, and a pair of vertically adjacent electrodes on the other side of the ceramic substrate. Commonly facing 2
and a common electrode, and the diode is configured to include:
Arranged on the surface of the ceramic substrate, and on the side opposite to the mounting surface, a lead wire provided in the diode is inserted through a through hole drilled in the ceramic substrate and led out. and each diode is connected to the electrode and the common electrode constituting the capacitor using the lead wire provided in each of the diodes as a connection conductor, and the diodes are connected to each other. Features.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples.

FIG. 2 is a front view of the composite component according to the present invention, and FIG. 3 is a rear view thereof.

This embodiment shows a composite component of the voltage doubler rectifier circuit shown in FIG.

In the figure, 1 is a ceramic substrate.

The ceramic substrate 1 is generally a dielectric ceramic substrate, but it can also be a semiconductor ceramic substrate such as a reduced and reoxidized type if the necessary withstand voltage can be obtained.

On the surface of this ceramic substrate 1, four
Three electrodes 2 to 5 are deposited.

Among the electrodes 2 to 5, the electrode 2 adjacent to the left and right in the figure
-5 and between electrodes 3 and 4 are electrically connected by narrow connection electrodes 6 and 7, respectively.

These electrodes 2 to 5 and connection electrodes 6 and 7 can be formed at the same time, for example, by applying silver paste by screen printing or the like and baking it.

On the other hand, on the back side of the ceramic substrate 1, among the electrodes 2 to 5,
In the figure, an electrode 8.9 commonly facing the two vertically adjacent electrodes 2, 3 and 4, 5 is adhered by the same means as described above.

Therefore, between electrodes 2-8, 3-8, 4-9 and 5-9, each capacitor 01 to C
4 is formed.

Among the capacitors 01 to C1, capacitors C□,
The electrodes 2 and 5 on the surface side of C1 are electrically connected by a connection electrode 6, and the electrodes 3 and 4 on the surface side of capacitors C2 and C3 are electrically connected by a connection electrode 7, and further, the capacitor C1
, C2, C3, and C4 share electrodes 8 and 9 on the back side.

Therefore, each of the capacitors C□ to C1 has a circuit configuration in which they are connected in series.

In this way, in the present invention, capacitors C1 to C1
The same ceramic substrate 1 is used, and electrodes 2 to 5 are placed on both sides.
, 8.9, the capacitors C1 to C1 are integrated into one component, and the capacitors C□ to C
The number of parts is reduced compared to when 4 is used as a single part,
It is smaller and thinner, and at the same time, the cost is lower.

Lead terminals d, b, a, c are soldered to the electrodes 3, 5 on the front side and the electrodes 8, 9 on the back side, respectively.

Then, the lead wire 13□ of the diode D3 is simultaneously soldered to the soldering point 10, and the other lead wire 13° of the diode D3 is passed through the through hole 14 made in the ceramic substrate 1. The lead terminal C of the electrode 9 is led from the front side to the back side, and the soldering is fixed at the position where the lead terminal C of the electrode 9 is soldered 13.

In addition, the lead wires 1□2v'21 of the diodes D□ and D2 are electrically connected to the lead terminals S and d by means such as soldering, and the remaining lead wires of the diodes D□ and D2 are electrically connected to the lead terminals S and d. 1□1? 122 is led out from the front side to the back side through a through hole 16 made in the ceramic substrate 1, and is electrically connected to the lead terminal a on the back side.

Further, one lead wire 1, 1 of the diode D is connected to the lead terminal, and the other lead wire 1, 2 of the diode D4 is passed through the through hole 15 bored in the ceramic substrate 1. It is led from the front side to the back side and is electrically connected to the lead terminal C.

The diodes D1-D4 are electrically connected to the capacitors 01-C4 so as to have the polarities shown in FIG.

As a result, a composite component of a voltage doubler rectifier circuit having a circuit configuration as shown in FIG. 1 is obtained.

Note that the lead terminals a''c are connected to diodes D1 to
It can also be constructed using lead wires D.

As described above, in the present invention, the diodes D1 to D4 arranged on the surface of the ceramic substrate 1 are connected by the lead wires of the diodes D□ to D4 that pass through the through holes 13 to 15 drilled in the ceramic substrate 1. Since they are electrically connected to the electrodes 8 and 9 on the other side, the wiring of the diodes D1 to D4 is housed within the ceramic substrate 1, which prevents the size from becoming large, and also simplifies the wiring route and improves reliability. be able to.

Moreover, the bridge connection of the diodes D□ to D, and the capacitor C for each of these diodes D1 to D4 are provided.
When connecting 1 to C1 in parallel, diodes D to D,
Each of the diodes D1 to D4 is connected to the divided electrodes 2 to 5 and the common electrodes 8 and 9 constituting the capacitors C□ to C4 using lead wires provided in each of the capacitors C□ to C4 as connection conductors, and the diode D1 Since the configuration connects the diodes D1 to D, the required circuit connection can be realized by routing the diodes D1 to D and glued wires without requiring a dedicated connection lead conductor. The connection is simplified and the connection process becomes easier.

After assembly, it is desirable to apply epoxy mold or glass mold to the entire assembly to improve moisture resistance and insulation.

As described above, the present invention provides a composite component comprising at least four bridge-connected diodes and at least four capacitors connected in parallel to each of these diodes, the capacitor comprising: Common to an electrode that is divided into four parts on one side of the ceramic substrate and a pair of horizontally adjacent pairs connected to each other by a conductive pattern, and a pair of electrodes that are vertically adjacent among the electrodes on the other side of the ceramic substrate. and two common electrodes facing each other, the diode is disposed on the surface of the ceramic substrate, and the diode is disposed on the surface opposite to the disposed surface. A lead wire is inserted through a through hole drilled in the ceramic substrate and led out, and the lead wire provided in each of the diodes is used as a connecting conductor to connect to the electrode and the common electrode constituting the capacitor. Since the diodes are connected and the diodes are connected to each other, it can be integrated into one component on a single ceramic substrate, reducing the number of parts, making it smaller, thinner, and lower in cost. The wiring to the back side of the diode disposed on the ceramic substrate can be simplified by using the through hole, and reliability can be improved.

Therefore, according to the present invention, it is possible to provide a highly reliable and inexpensive capacitor-diode composite component that occupies less space and is suitable for making devices smaller, thinner, and more densely packaged. can.

[Brief explanation of drawings]

FIG. 1 is an electrical circuit diagram of a voltage doubler rectifier circuit, FIG. 2 is a front view of a composite component according to the present invention, and FIG. 3 is a rear view thereof. 1... Ceramic substrate, C1-C4... Capacitor, 2.3, 4, 5, 8.9... Electrode, D
1-D,...Diode, 13. 14. 1
5...Through hole.

Claims (1)

[Scope of utility model registration request] In a composite component comprising at least four bridge-connected diodes and at least four capacitors connected in parallel to each of these diodes,
The capacitor includes a pair of electrodes that are divided into four parts on one side of the ceramic substrate and are connected to each other in the horizontal direction by a conductor pattern, and a pair of electrodes that are adjacent in the vertical direction among the electrodes on the other side of the ceramic substrate. and two common electrodes that are commonly opposed to each other, and the diode is disposed on the surface of the ceramic substrate, and the diode is disposed on the surface opposite to the disposed surface. A lead wire provided under the diode is inserted through a through hole drilled in the ceramic substrate and led out, and the lead wire provided for each of the diodes is used as a connecting conductor to connect the electrodes and the capacitor constituting the capacitor. A composite component characterized in that each diode is connected to the common electrode, and the diodes are connected to each other.